METHOD OF SEALING GLASS SUBSTRATES
    3.
    发明申请
    METHOD OF SEALING GLASS SUBSTRATES 审中-公开
    密封玻璃基材的方法

    公开(公告)号:WO2007067419A3

    公开(公告)日:2008-10-23

    申请号:PCT/US2006045935

    申请日:2006-12-01

    CPC classification number: H01L51/5246 H01L51/56

    Abstract: A method of sealing a plurality of frame-like frit walls disposed between two substrates. The frit walls are arranged in rows and columns and divided into groups, each group being sealed by a separate laser beam. Several strategies are disclosed for the order in which the frit walls are heated and sealed by a laser beam to optimize the efficiency of the sealing process.

    Abstract translation: 一种密封设置在两个基板之间的多个框状玻璃料壁的方法。 玻璃料壁以行和列排列并分成组,每组由单独的激光束密封。 公开了几种策略,其中玻璃料壁被激光束加热和密封,以优化密封过程的效率。

    METHOD AND APPARATUS FOR SEALING A GLASS ENVELOPE
    4.
    发明申请
    METHOD AND APPARATUS FOR SEALING A GLASS ENVELOPE 审中-公开
    密封玻璃包装的方法和装置

    公开(公告)号:WO2007094977A3

    公开(公告)日:2008-04-03

    申请号:PCT/US2007002863

    申请日:2007-02-02

    CPC classification number: H01L51/524

    Abstract: A method of sealing a glass package comprising providing a first glass substrate, the first substrate having first and second alignment marks. A second glass substrate having third and fourth alignment marks is aligned to the first substrate by translating the first substrate relative to the second substrate, and aligning the second and fourth alignment marks by rotating the first substrate relative to the second substrate.

    Abstract translation: 一种密封玻璃包装的方法,包括提供第一玻璃基板,所述第一基板具有第一和第二对准标记。 具有第三和第四对准标记的第二玻璃基板通过相对于第二基板平移第一基板而与第一基板对准,并且通过相对于第二基板旋转第一基板来对准第二和第四对准标记。

    HERMETICALLY SEALED GLASS PACKAGE AND METHOD OF MANUFACTURE
    5.
    发明申请
    HERMETICALLY SEALED GLASS PACKAGE AND METHOD OF MANUFACTURE 审中-公开
    密封玻璃包装及其制造方法

    公开(公告)号:WO2007067384A3

    公开(公告)日:2009-04-30

    申请号:PCT/US2006045479

    申请日:2006-11-27

    CPC classification number: B65B7/00 C03C27/06 H01L21/50 H01L51/5246

    Abstract: A method for manufacturing a hermetically sealed package is provided, the method comprising the steps of: using a laser to heat a frit, disposed in a pattern between two substrates, such that the heated frit forms a hermetic seal which connects the substrates and further comprising: directing the laser to enter the frit pattern, then to trace the frit pattern, then to retrace a portion of the frit pattern, and then to exit the frit pattern; and selecting an initial laser power which, when the laser enters the frit pattern, is insufficient to heat the frit to form a hermetic seal; then increasing the laser power over a first section of the frit pattern to a target laser power at least sufficient to heat the frit to form a hermetic seal; and then decreasing the laser power over a second section of the frit pattern until the laser power is insufficient to heat the frit to form a hermetic seal before the laser exits the frit pattern.

    Abstract translation: 提供一种用于制造密封包装的方法,所述方法包括以下步骤:使用激光加热以两个基板之间的图案设置的玻璃料,使得加热的玻璃料形成密封件,该密封件连接基板,还包括 :引导激光进入玻璃料图案,然后跟踪玻璃料图案,然后回扫玻璃料图案的一部分,然后退出玻璃料图案; 以及选择当激光进入玻璃料图案时的初始激光功率不足以加热玻璃料以形成气密密封; 然后将玻璃料图案的第一部分上的激光功率增加至至少足以加热玻璃料以形成气密密封的目标激光功率; 然后在玻璃料图案的第二部分上降低激光功率,直到激光功率不足以加热玻璃料以在激光器离开玻璃料图案之前形成气密密封。

    SYSTEM AND METHOD FOR FRIT SEALING GLASS PACKAGES
    6.
    发明申请
    SYSTEM AND METHOD FOR FRIT SEALING GLASS PACKAGES 审中-公开
    用于密封玻璃包装的系统和方法

    公开(公告)号:WO2007067533A3

    公开(公告)日:2009-04-23

    申请号:PCT/US2006046382

    申请日:2006-12-05

    CPC classification number: C03C27/06 H01L51/5237 H01L51/5246

    Abstract: A sealing device and method are described herein that can be used to manufacture a hermetically sealed glass package. In one embodiment, the hermetically sealed glass package is suitable to protect thin film devices which are sensitive to the ambient environment (e.g., oxygen, moisture) . Some examples of such glass packages are organic emitting light diode (OLED) displays, sensors, and other optical devices. The present invention is demonstrated using an OLED display as an example.

    Abstract translation: 本文描述了可用于制造密封玻璃包装的密封装置和方法。 在一个实施例中,密封玻璃封装适用于保护对周围环境(例如,氧气,湿气)敏感的薄膜器件。 这种玻璃封装的一些实例是有机发光二极管(OLED)显示器,传感器和其它光学器件。 以OLED显示器为例进行了说明。

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