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    2.
    发明专利
    未知

    公开(公告)号：AT556441T

    公开(公告)日：2012-05-15

    申请号：AT06838743

    申请日：2006-12-01

    Applicant: CORNING INC

    Inventor： BECKEN KEITH J ,  LOGUNOV STEPHAN L

    IPC: H01L51/52 ,  B23K26/06 ,  C03C27/06

    Abstract: A method of minimizing stress in an OLED device laser sealing process using an elongated laser beam. A laser beam having an intensity distribution which decreases as a function of distance from the longitudinal axis of the beam is passed through a mask to create an elongated beam having a length-wise intensity distribution which decreases as a function of distance from the axis of the beam and a substantially constant width-wise intensity distribution. The elongated beam is traversed over a line of frit disposed between two substrates. The tails of the length-wise intensity distribution provide for a slow cool down of the frit as the beam traverses the line of frit.

    HERMETICALLY SEALED GLASS PACKAGE AND METHOD OF MANUFACTURE
    4.
    发明申请
    HERMETICALLY SEALED GLASS PACKAGE AND METHOD OF MANUFACTURE 审中-公开
    密封玻璃包装及其制造方法

    公开(公告)号：WO2007067384A3

    公开(公告)日：2009-04-30

    申请号：PCT/US2006045479

    申请日：2006-11-27

    Applicant: CORNING INC ,  BECKEN KEITH J ,  LOGUNOV STEPHAN L ,  ZHANG AIYU ,  BAYNE JOHN F

    Inventor： BECKEN KEITH J ,  LOGUNOV STEPHAN L ,  ZHANG AIYU ,  BAYNE JOHN F

    IPC: H01J1/62

    CPC classification number: B65B7/00 ,  C03C27/06 ,  H01L21/50 ,  H01L51/5246

    Abstract: A method for manufacturing a hermetically sealed package is provided, the method comprising the steps of: using a laser to heat a frit, disposed in a pattern between two substrates, such that the heated frit forms a hermetic seal which connects the substrates and further comprising: directing the laser to enter the frit pattern, then to trace the frit pattern, then to retrace a portion of the frit pattern, and then to exit the frit pattern; and selecting an initial laser power which, when the laser enters the frit pattern, is insufficient to heat the frit to form a hermetic seal; then increasing the laser power over a first section of the frit pattern to a target laser power at least sufficient to heat the frit to form a hermetic seal; and then decreasing the laser power over a second section of the frit pattern until the laser power is insufficient to heat the frit to form a hermetic seal before the laser exits the frit pattern.

    Abstract translation: 提供一种用于制造密封包装的方法，所述方法包括以下步骤：使用激光加热以两个基板之间的图案设置的玻璃料，使得加热的玻璃料形成密封件，该密封件连接基板，还包括 ：引导激光进入玻璃料图案，然后跟踪玻璃料图案，然后回扫玻璃料图案的一部分，然后退出玻璃料图案; 以及选择当激光进入玻璃料图案时的初始激光功率不足以加热玻璃料以形成气密密封; 然后将玻璃料图案的第一部分上的激光功率增加至至少足以加热玻璃料以形成气密密封的目标激光功率; 然后在玻璃料图案的第二部分上降低激光功率，直到激光功率不足以加热玻璃料以在激光器离开玻璃料图案之前形成气密密封。

    SYSTEM AND METHOD FOR FRIT SEALING GLASS PACKAGES
    5.
    发明申请
    SYSTEM AND METHOD FOR FRIT SEALING GLASS PACKAGES 审中-公开
    用于密封玻璃包装的系统和方法

    公开(公告)号：WO2007067533A3

    公开(公告)日：2009-04-23

    申请号：PCT/US2006046382

    申请日：2006-12-05

    Applicant: CORNING INC ,  BECKEN KEITH J ,  LOGUNOV STEPHAN L ,  WAGNER ROBERT S ,  ZHANG AIYU ,  ZHANG LU

    Inventor： BECKEN KEITH J ,  LOGUNOV STEPHAN L ,  WAGNER ROBERT S ,  ZHANG AIYU ,  ZHANG LU

    IPC: H01J9/26

    CPC classification number: C03C27/06 ,  H01L51/5237 ,  H01L51/5246

    Abstract: A sealing device and method are described herein that can be used to manufacture a hermetically sealed glass package. In one embodiment, the hermetically sealed glass package is suitable to protect thin film devices which are sensitive to the ambient environment (e.g., oxygen, moisture) . Some examples of such glass packages are organic emitting light diode (OLED) displays, sensors, and other optical devices. The present invention is demonstrated using an OLED display as an example.

    Abstract translation: 本文描述了可用于制造密封玻璃包装的密封装置和方法。 在一个实施例中，密封玻璃封装适用于保护对周围环境（例如，氧气，湿气）敏感的薄膜器件。 这种玻璃封装的一些实例是有机发光二极管（OLED）显示器，传感器和其它光学器件。 以OLED显示器为例进行了说明。

    METHOD OF MAKING A GLASS ENVELOPE
    6.
    发明申请
    METHOD OF MAKING A GLASS ENVELOPE 审中-公开
    制作玻璃包装的方法

    公开(公告)号：WO2007067420A3

    公开(公告)日：2009-04-23

    申请号：PCT/US2006045936

    申请日：2006-12-01

    Applicant: CORNING INC ,  BECKEN KEITH J ,  LOGUNOV STEPHAN L

    Inventor： BECKEN KEITH J ,  LOGUNOV STEPHAN L

    IPC: H01J9/00

    CPC classification number: H01L51/5246 ,  H01L51/56

    Abstract: A method of minimizing stress in an OLED device laser sealing process using an elongated laser beam. A laser beam having an intensity distribution which decreases as a function of distance from the longitudinal axis of the beam is passed- through a mask to create an elongated beam having a length- wise intensity distribution which decreases as a function of distance from the axis of the beam and a substantially constant width- wise intensity distribution. The elongated beam is traversed over a line of frit disposed between two substrates. The tails of the length- wise intensity distribution provide for a slow cool down of the frit as the beam traverses the line of frit.

    Abstract translation: 使用细长激光束在OLED器件激光密封过程中使应力最小化的方法。 具有作为距离光束的纵轴的距离的函数减小的强度分布的激光束通过掩模以产生具有纵向强度分布的细长光束，该光束分布随着距离光轴的距离的距离而减小 光束和基本上恒定的宽度强度分布。 细长的横梁穿过设置在两个基板之间的玻璃料线。 长度强度分布的尾部提供了当波束穿过玻璃料线时玻璃料的缓慢冷却。

    METHOD OF ENCAPSULATING A DISPLAY ELEMENT
    7.
    发明申请
    METHOD OF ENCAPSULATING A DISPLAY ELEMENT 审中-公开
    包装显示元件的方法

    公开(公告)号：WO2007067403A3

    公开(公告)日：2007-11-15

    申请号：PCT/US2006045745

    申请日：2006-11-28

    Applicant: CORNING INC ,  BECKEN KEITH J ,  LOGUNOV STEPHAN L

    Inventor： BECKEN KEITH J ,  LOGUNOV STEPHAN L

    IPC: H01J1/62

    CPC classification number: H05B33/04 ,  C03C27/06 ,  H01L51/5246 ,  H01L51/56 ,  H01L2251/55

    Abstract: A method of encapsulating a display device between substrates with a glass frit. The method includes depositing a frit having an optical absorption a which is a function of wavelength onto a first substrate wherein the deposited frit has a height h, placing a second substrate in contact with the frit, sealing together the substrates by traversing a laser light having a wavelength ? over the frit at a speed greater than about 5 mm/s, and wherein a h at ? is greater than or equal to 0.4.

    Abstract translation: 用玻璃料将显示装置封装在基板之间的方法。 该方法包括将具有作为波长的函数的光吸收α的玻璃料沉积到第一基底上，其中沉积的玻璃料具有高度h，将第二基底放置成与玻璃料接触，通过穿过具有高度h的激光 波长？ 以大于约5mm / s的速度在玻璃料上方，并且其中， 大于或等于0.4。

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