Abstract:
PROBLEM TO BE SOLVED: To decrease the number of production stages in the method for forming a barrier-rib structure and to obtain a precision barrier-rib structure. SOLUTION: A material 12 contg. a glass, ceramic or glass ceramic frit delivered on an applicator roll 14 and capable of being shaped is brought into contact with a recessed pattern 16 formed on an intaglio roll 18, and the material 12 is formed into the shape of a desired self-supporting structure. The material 12 contains a UV-curing polymer as an org. carrier. A UV is then radiated from a UV source 26 to solidify the material 12 in an enough amt. to maintain the shape.
Abstract:
A sealing glass material comprising a sealing glass frit and a vehicle, the vehicle being an aqueous solution of a cellulosic polymer, and a method of preparing the sealing glass material.
Abstract:
An optical waveguide fiber amplifier comprising a core region comprises at least in part between 1300 wt.ppm and 3600 wt.ppm Er2O3, between 6.0 wt. % to 10.0 wt. % Al2O3 and between 9.0 wt. % and 20.0 wt. % GeO2. The amplifier also comprising an inner clad surrounding the core region and an outer clad surrounding the inner clad. The relative refractive index percentages and radii of the core region, inner clad and outer clad are chosen from the following ranges: the relative refractive index percent of the core segment within the range of from about 0.5% to about 2.0%; the relative refractive index percent of the inner clad within the range of from about 0.0% to about 0.4%; the outer radius of the core region within the range of from about 0.7 mum to about 1.5 mum; and, the outer radius of the inner clad within the range of from about 4.3 mum to about 18.8 mum.
Abstract:
Hydrophobic polymer surfaces whose level of protein binding is less than about 50-80 ng/cm2 are achieved by: (1) applying a coating solution composed of a solvent and a non-ionic surfactant having a HLB number of less than 5 to the surface; and (2) drying the surface to remove the solvent and thereby bring the surfactant into direct contact with the hydrophobic polymer. The combination of a low HLB number and the drying step have been found to produce low binding surfaces which can withstand multiple washes with water and/or protein-containing solutions Alternatively, the low binding surfaces can be produced by applying the non-ionic surfactant to the mold surfaces which contact molten polymer and form the polymer into a desired shape, e.g., into a multi-well plate, a pipette tip, or the like. Further, the low binding surfaces may be produced by incorporating non-soluble, non-ionic surfactants having an HLB number of less than or equal to 10 into a polymer blend prior to molding the article.
Abstract:
A method of attaching dialdehyde starch to surfaces is disclosed. A substrate to which substances may be coupled, which substrate comprises at least one surface coated with dialdehyde starch, and products produced utilizing the substrate are also provided.
Abstract:
Hydrophobic polymer surfaces whose level of protein binding is less than about 50-80 ng/cm2 are achieved by: (1) applying a coating solution composed of a solvent and a non-ionic surfactant having a HLB number of less than 5 to the surface; and (2) drying the surface to remove the solvent and thereby bring the surfactant into direct contact with the hydrophobic polymer. The combination of a low HLB number and the drying step have been found to produce low binding surfaces which can withstand multiple washes with water and/or protein-containing solutions Alternatively, the low binding surfaces can be produced by applying the non-ionic surfactant to the mold surfaces which contact molten polymer and form the polymer into a desired shape, e.g., into a multi-well plate, a pipette tip, or the like. Further, the low binding surfaces may be produced by incorporating non-soluble, non-ionic surfactants having an HLB number of less than or equal to 10 into a polymer blend prior to molding the article.
Abstract:
Hydrophobic polymer surfaces whose level of protein binding is less than about 50-80 ng/cm2 are achieved by: (1) applying a coating solution composed of a solvent and a non-ionic surfactant having a HLB number of less than 5 to the surface; and (2) drying the surface to remove the solvent and thereby bring the surfactant into direct contact with the hydrophobic polymer. The combination of a low HLB number and the drying step have been found to produce low binding surfaces which can withstand multiple washes with water and/or protein-containing solutions Alternatively, the low binding surfaces can be produced by applying the non-ionic surfactant to the mold surfaces which contact molten polymer and form the polymer into a desired shape, e.g., into a multi-well plate, a pipette tip, or the like. Further, the low binding surfaces may be produced by incorporating non-soluble, non-ionic surfactants having an HLB number of less than or equal to 10 into a polymer blend prior to molding the article.
Abstract:
Hydrophobic polymer surfaces whose level of protein binding is less than about 50-80 ng/cm2 are achieved by: (1) applying a coating solution composed of a solvent and a non-ionic surfactant having a HLB number of less than 5 to the surface; and (2) drying the surface to remove the solvent and thereby bring the surfactant into direct contact with the hydrophobic polymer. The combination of a low HLB number and the drying step have been found to produce low binding surfaces which can withstand multiple washes with water and/or protein-containing solutions Alternatively, the low binding surfaces can be produced by applying the non-ionic surfactant to the mold surfaces which contact molten polymer and form the polymer into a desired shape, e.g., into a multi-well plate, a pipette tip, or the like. Further, the low binding surfaces may be produced by incorporating non-soluble, non-ionic surfactants having an HLB number of less than or equal to 10 into a polymer blend prior to molding the article.
Abstract:
An optical waveguide fiber amplifier 10 comprising a core region 12 comprises at least in part between 1300 wt.ppm and 3600 wt.ppm Er203, between 6.0 wt. % to 10.0 wt. % A1203 and between 9.0 wt. % and 20.0 wt. % Ge02. The fiber amplifier 10 also comprises an inner clad 14 surrounding the core region 12 and an outer clad 16 surrounding the inner clad 14. The relative refractive index percentages and radii of the core region 12, inner clad 14 and outer clad 16 are chosen from the following ranges: the relative refractive index percent of the core segment 12 within the range of from about 0.5% to about 2.0% the relative refractive index percent of the inner clad 14 within the range of from about 0.0% to about 0.4%.
Abstract translation:包含核心区域12的光波导光纤放大器10包含至少部分介于1300重量ppm与3600重量ppm之间的Er 2 O 3, %至10.0wt。 %Al 2 O 3和9.0wt。 %和20.0wt。 %Ge02。 光纤放大器10还包括围绕芯区12的内包层14和围绕内包层14的外包层16.纤芯区12,内包层14和外包层16的相对折射率百分比和半径选自 以下范围:芯部段12的相对折射率百分比在从大约0.0%至大约0.4%的范围内从约0.5%至约2.0%的范围内,内部包层14的相对折射率百分比在约0.0%至约0.4%的范围内。
Abstract:
An optical waveguide fiber amplifier comprising a core region comprises at least in part between 1300 wt.ppm and 3600 wt.ppm Er2O3, between 6.0 wt. % to 10.0 wt. % Al2O3 and between 9.0 wt. % and 20.0 wt. % GeO2. The amplifier also comprising an inner clad surrounding the core region and an outer clad surrounding the inner clad. The relative refractive index percentages and radii of the core region, inner clad and outer clad are chosen from the following ranges: the relative refractive index percent of the core segment within the range of from about 0.5% to about 2.0%; the relative refractive index percent of the inner clad within the range of from about 0.0% to about 0.4%; the outer radius of the core region within the range of from about 0.7 mum to about 1.5 mum; and, the outer radius of the inner clad within the range of from about 4.3 mum to about 18.8 mum.
Abstract translation:包括芯区域的光波导光纤放大器至少部分地包括在1300重量ppm和3600重量ppm Er 2 O 3之间,6.0重量% %至10.0重量% %Al 2 O 3和9.0重量% %和20.0重量% %GeO2。 放大器还包括围绕芯区域的内包层和围绕内包层的外包层。 芯区域,内包层和外包层的相对折射率百分比和半径选自以下范围:核心片段的相对折射率百分比在约0.5%至约2.0%的范围内; 内包层的相对折射率百分比在约0.0%至约0.4%的范围内; 芯区域的外半径在约0.7μm至约1.5μm的范围内; 并且内包层的外半径在约4.3μm至约18.8μm的范围内。