公开(公告)号：US12131985B2

公开(公告)日：2024-10-29

申请号：US17470519

申请日：2021-09-09

Applicant: CORNING INCORPORATED

Inventor： Mandakini Kanungo ,  Prantik Mazumder ,  Chukwudi Azubuike Okoro ,  Ah-Young Park ,  Scott Christopher Pollard ,  Rajesh Vaddi

IPC: C25D3/38 ,  C03C3/06 ,  C03C15/00 ,  C03C17/06 ,  C03C17/10 ,  C03C23/00 ,  C23C14/18 ,  C23C18/38 ,  C23C28/02 ,  H01L21/48 ,  H01L21/768 ,  H01L23/15 ,  H01L23/48 ,  H01L23/498 ,  H05K1/02 ,  H05K1/03 ,  H05K1/11 ,  H05K3/38 ,  C03C3/076 ,  C25D7/12 ,  H01L23/00 ,  H01L23/492 ,  H05K3/00 ,  H05K3/42

CPC classification number: H01L23/49827 ,  C03C3/06 ,  C03C15/00 ,  C03C17/06 ,  C03C17/10 ,  C03C23/0025 ,  C23C14/18 ,  C23C18/38 ,  C23C28/02 ,  H01L21/76877 ,  H01L23/15 ,  H01L23/481 ,  H01L23/49838 ,  H05K1/0271 ,  H05K1/0306 ,  H05K1/115 ,  H05K3/388 ,  C03C3/076 ,  C03C2218/115 ,  C25D3/38 ,  C25D7/123 ,  H01L21/486 ,  H01L23/4924 ,  H01L23/49866 ,  H01L23/564 ,  H05K3/002 ,  H05K3/0029 ,  H05K3/0055 ,  H05K3/423 ,  H05K3/425 ,  H05K3/428 ,  H05K2201/068 ,  H05K2201/09545 ,  H05K2201/09563 ,  H05K2201/09609 ,  H05K2201/09827 ,  H05K2201/09854 ,  H05K2201/0989 ,  H05K2201/10378 ,  H05K2203/1194 ,  H05K2203/1361 ,  H05K2203/143 ,  H05K2203/1438 ,  H05K2203/162 ,  Y10T428/24273 ,  Y10T428/24479 ,  Y10T428/24851 ,  Y10T428/24917 ,  Y10T428/24926

Abstract: According to various embodiments described herein, an article comprises a glass or glass-ceramic substrate having a first major surface and a second major surface opposite the first major surface, and a via extending through the substrate from the first major surface to the second major surface over an axial length in an axial direction. The article further comprises a helium hermetic adhesion layer disposed on the interior surface; and a metal connector disposed within the via, wherein the metal connector is adhered to the helium hermetic adhesion layer. The metal connector coats the interior surface of the via along the axial length of the via to define a first cavity from the first major surface to a first cavity length, the metal connector comprising a coating thickness of less than 12 μm at the first major surface. Additionally, the metal connector coats the interior surface of the via along the axial length of the via to define a second cavity from the second major surface to a second cavity length, the metal connector comprising a coating thickness of less than 12 μm at the second major surface and fully fills the via between the first cavity and the second cavity.

公开(公告)号：US11709397B2

公开(公告)日：2023-07-25

申请号：US17292790

申请日：2019-11-05

Applicant: Corning Incorporated

Inventor： Kirk Richard Allen ,  Fedor Dmitrievich Kiselev ,  Dmitri Vladislavovich Kuksenkov ,  Christopher Michael Lynn ,  Pamela Arlene Maurey ,  Xiang-Dong Mi ,  Scott Christopher Pollard ,  Nikolay Timofeyevich Timofeev ,  Andrii Varanytsia

IPC: G02F1/13357 ,  G02F1/1335

CPC classification number: G02F1/133606 ,  G02F1/133524 ,  G02F1/133605

Abstract: A backlight includes a substrate, a plurality of light sources, a reflective layer, a light guide plate, a pattern of light extractors, a plurality of patterned reflectors, and a diffusive layer. The plurality of light sources are proximate the substrate. The reflective layer is on the substrate. The light guide plate is proximate the plurality of light sources. The pattern of light extractors is on the light guide plate. The plurality of patterned reflectors are on the light guide plate. Each patterned reflector is aligned with a corresponding light source. The diffusive layer is on the light guide plate.

公开(公告)号：US11630076B2

公开(公告)日：2023-04-18

申请号：US16608500

申请日：2018-04-27

Applicant: CORNING INCORPORATED

Inventor： Robert Alan Bellman ,  Jeffrey Stapleton King ,  Scott Christopher Pollard

IPC: C03B33/02 ,  G01N27/404 ,  G01N27/406 ,  C03C27/10 ,  C03C17/06

Abstract: A method of forming a glass electrochemical sensor is described. In some embodiments, the method may include forming a plurality of electrical through glass vias (TGVs) in an electrode substrate; filling each of the plurality of electrical TGVs with an electrode material; forming a plurality of contact TGVs in the electrode substrate; filling each of the plurality of contact TGVs with a conductive material; patterning the conductive material to connect the electrical TGVs with the contact TGVs; forming a cavity in a first glass layer; and bonding a first side of the first glass layer to the electrode substrate.

公开(公告)号：US20210043528A1

公开(公告)日：2021-02-11

申请号：US17044713

申请日：2019-04-03

Applicant: CORNING INCORPORATED

Inventor： Jin Su Kim ,  Scott Christopher Pollard

IPC: H01L23/15 ,  H01L23/00 ,  H01L23/538 ,  H01L23/36 ,  H05K1/02 ,  H05K1/03 ,  H01L21/50 ,  H01L23/66

Abstract: An electronic package assembly includes a glass substrate including an upper glass cladding layer, a lower glass cladding layer, a glass core layer coupled to the upper glass cladding layer and the lower glass cladding layer, where the upper glass cladding layer and the lower glass cladding layer have a higher etch rate in an etchant than the glass core layer, a first cavity positioned within one of the upper glass cladding layer or the lower glass cladding layer, and a second cavity positioned within one of the upper glass cladding layer or the lower glass cladding layer, a microprocessor positioned within the first cavity, and a micro-electronic component positioned within the second cavity.

公开(公告)号：US20200251424A1

公开(公告)日：2020-08-06

申请号：US16744776

申请日：2020-01-16

Applicant: CORNING INCORPORATED

Inventor： Prantik Mazumder ,  Chukwudi Azubuike Okoro ,  Ah-Young Park ,  Scott Christopher Pollard ,  Navaneetha Krishnan Subbaiyan

IPC: H01L23/00 ,  H01L23/15 ,  H01L23/498 ,  H01L21/48

Abstract: According to various embodiments, an article including a glass or glass-ceramic substrate having a first major surface and a second major surface, and a via extending through the substrate from the first major surface to the second major surface over an axial length, L, the via defining a first axial portion, a third axial portion, and a second axial portion disposed between the first and third axial portions. The article further includes a helium hermetic adhesion layer disposed on the interior surface in the first and/or third axial portions and a metal connector disposed within the via, the metal connector being adhered to the helium hermetic adhesion layer. The metal connector fully fills the via over the axial length, L, the via has a maximum diameter, Φmax, of less than or equal to 30 μm, and the axial length, L, and the maximum diameter, Φmax, satisfy an equation: L Φ max > 20   micron 1 / 2 .

公开(公告)号：US20200173956A1

公开(公告)日：2020-06-04

申请号：US16608500

申请日：2018-04-27

Applicant: CORNING INCORPORATED

Inventor： Robert Alan Bellman ,  Jeffrey Stapleton King ,  Scott Christopher Pollard

IPC: G01N27/404

Abstract: A method of forming a glass electrochemical sensor is described. In some embodiments, the method may include forming a plurality of electrical through glass vias (TGVs) in an electrode substrate; filling each of the plurality of electrical TGVs with an electrode material; forming a plurality of contact TGVs in the electrode substrate; filling each of the plurality of contact TGVs with a conductive material; patterning the conductive material to connect the electrical TGVs with the contact TGVs; forming a cavity in a first glass layer; and bonding a first side of the first glass layer to the electrode substrate.

公开(公告)号：US11953462B2

公开(公告)日：2024-04-09

申请号：US18122192

申请日：2023-03-16

Applicant: CORNING INCORPORATED

Inventor： Robert Alan Bellman ,  Jeffrey Stapleton King ,  Scott Christopher Pollard

IPC: G01N27/404 ,  C03B33/02 ,  C03C15/00 ,  C03C17/06 ,  C03C23/00 ,  C03C27/10 ,  G01N27/406 ,  G01N27/413

CPC classification number: G01N27/404 ,  C03B33/0222 ,  C03C15/00 ,  C03C17/06 ,  C03C23/0025 ,  C03C27/10 ,  G01N27/4062 ,  G01N27/413 ,  C03C2217/254

Abstract: A method of forming a glass electrochemical sensor is described. In some embodiments, the method may include forming a plurality of electrical through glass vias (TGVs) in an electrode substrate; filling each of the plurality of electrical TGVs with an electrode material; forming a plurality of contact TGVs in the electrode substrate; filling each of the plurality of contact TGVs with a conductive material; patterning the conductive material to connect the electrical TGVs with the contact TGVs; forming a cavity in a first glass layer; and bonding a first side of the first glass layer to the electrode substrate.

公开(公告)号：US20210397049A1

公开(公告)日：2021-12-23

申请号：US17292790

申请日：2019-11-05

Applicant: Corning Incorporated

Inventor： Kirk Richard Allen ,  Fedor Dmitrievich Kiselev ,  Dmitri Vladislavovich Kuksenkov ,  Christopher Michael Lynn ,  Pamela Arlene Maurey ,  Xiang-Dong Mi ,  Scott Christopher Pollard ,  Nikolay Timofeyevich Timofeev ,  Andrii Varanytsia

IPC: G02F1/13357 ,  G02B5/02 ,  G02F1/1335

Abstract: A backlight includes a substrate, a plurality of light sources, a reflective layer, a light guide plate, a pattern of light extractors, a plurality of patterned reflectors, and a diffusive layer. The plurality of light sources are proximate the substrate. The reflective layer is on the substrate. The light guide plate is proximate the plurality of light sources. The pattern of light extractors is on the light guide plate. The plurality of patterned reflectors are on the light guide plate. Each patterned reflector is aligned with a corresponding light source. The diffusive layer is on the light guide plate.

公开(公告)号：US11171094B2

公开(公告)日：2021-11-09

申请号：US16744776

申请日：2020-01-16

Applicant: CORNING INCORPORATED

Inventor： Prantik Mazumder ,  Chukwudi Azubuike Okoro ,  Ah-Young Park ,  Scott Christopher Pollard ,  Navaneetha Krishnan Subbaiyan

IPC: H01L23/495 ,  H01L23/00 ,  H01L23/15 ,  H01L21/48 ,  H01L23/498

Abstract: According to various embodiments, an article including a glass or glass-ceramic substrate having a first major surface and a second major surface, and a via extending through the substrate from the first major surface to the second major surface over an axial length, L, the via defining a first axial portion, a third axial portion, and a second axial portion disposed between the first and third axial portions. The article further includes a helium hermetic adhesion layer disposed on the interior surface in the first and/or third axial portions and a metal connector disposed within the via, the metal connector being adhered to the helium hermetic adhesion layer. The metal connector fully fills the via over the axial length, L, the via has a maximum diameter, Φmax, of less than or equal to 30 μm, and the axial length, L, and the maximum diameter, Φmax, satisfy an equation: L Φ max > 20 ⁢ ⁢ micron 1 / 2 .

公开(公告)号：US20160128202A1

公开(公告)日：2016-05-05

申请号：US14933315

申请日：2015-11-05

Applicant: CORNING INCORPORATED

Inventor： Robert Alan Bellman ,  John Tyler Keech ,  Ekaterina Aleksandrovna Kuksenkova ,  Scott Christopher Pollard

IPC: H05K3/00 ,  H05K3/42

CPC classification number: H05K3/0094 ,  C25D1/04 ,  C25D5/022 ,  C25D7/123 ,  H01L21/486 ,  H01L21/76898 ,  H01L23/15 ,  H01L23/49827 ,  H01L2924/0002 ,  H05K3/423 ,  H01L2924/00

Abstract: Disclosed herein is a bottom-up electrolytic via plating method wherein a first carrier substrate and a second substrate having at least one through-via are temporarily bonded together. The method includes applying a seed layer on a surface of the first substrate, forming a surface modification layer on the seed layer or the second substrate, bonding the second substrate to the first substrate with the surface modification layer to create an assembly wherein the seed layer and the surface modification layer are disposed between the first and second substrates, applying conductive material to the through-via, removing the second substrate having the through-via containing conductive material from the assembly.

Abstract translation: 本文公开了一种自下而上的电解通孔电镀方法，其中具有至少一个通孔的第一载体基板和第二基板临时粘合在一起。 该方法包括将种子层施加在第一衬底的表面上，在种子层或第二衬底上形成表面改性层，用表面改性层将第二衬底粘合到第一衬底以产生组件，其中种子层 并且所述表面改性层设置在所述第一和第二基板之间，将导电材料施加到所述通孔，从所述组件移除具有包含导电材料的所述通孔的所述第二基板。