公开(公告)号：WO1992015832A1

公开(公告)日：1992-09-17

申请号：PCT/US1992001814

申请日：1992-03-03

Applicant: CRAY COMPUTER CORPORATION

Inventor： CRAY COMPUTER CORPORATION ,  CRAY, Seymour, R. ,  SHERWOOD, Gregory, J.

IPC: F28F13/12

CPC classification number: H05K7/20763 ,  G06F1/20 ,  G06F2200/201 ,  Y10S165/908 ,  Y10S165/911

Abstract: A cooling system (20) employs a cooling liquid (38) and a cooling gas in a combined thermodynamic cycle to overcome the flow resistance of dense assemblies of heat generating components (28) and to improve heat transfer by inducing turbulence, thereby reducing the effects of thermal hysteresis and boundary layer formation. Sensible heat gain to the cooling liquid (38) and gas and latent heat of vaporization of the cooling liquid (38) also occur in channels through and over the components (28). The flow of cooling as propels the cooling liquid through the channels. The cooling system is advantageous for cooling electronic components (28) such as integrated circuits which exhibit relatively high degrees of energy and physical density, in supercomputers. The cooling system may also be advantageously combined with an immersion cooling system for the power supply components (29) in the computer.

公开(公告)号：WO1990013992A1

公开(公告)日：1990-11-15

申请号：PCT/US1990002456

申请日：1990-05-03

Applicant: CRAY COMPUTER CORPORATION

Inventor： CRAY COMPUTER CORPORATION ,  CRAY, Seymour, R. ,  KRAZEWSKI, Nicholas, J.

IPC: H05K03/36

CPC classification number: H01L24/11 ,  H01L21/4853 ,  H01L2224/05644 ,  H01L2224/1134 ,  H01L2224/13099 ,  H01L2224/13144 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/4943 ,  H01L2225/06524 ,  H01L2225/06527 ,  H01L2225/06541 ,  H01L2225/06589 ,  H01L2225/06593 ,  H01L2225/06596 ,  H01L2924/00011 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10329 ,  H01L2924/12033 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/3011 ,  H01R12/523 ,  H05K3/308 ,  H05K3/328 ,  H05K3/36 ,  H05K3/368 ,  H05K2201/096 ,  H05K2201/1059 ,  H05K2201/10825 ,  H05K2201/10909 ,  H05K2201/10946 ,  H05K2203/0495 ,  Y10T29/49126 ,  Y10T29/4914 ,  Y10T29/49144 ,  Y10T29/49153 ,  H01L2924/00 ,  H01L2224/48 ,  H01L2924/20757

Abstract: A method and apparatus for interconnecting electronic circuit boards (212, 214, 219, 221) through the use of twisted wire jumpers (231) which are formed from multifilament wire and which have enlarged bird cages (300) formed along the jumpers. The jumpers are drawn through a stack of circuit boards to position the cages in contact with plated interconnection apertures (303) located in the printed circuit boards. The frictional engagement of the cages (300) in the apertures (303) provides both electrical interconnection of, and mechanical coupling between the printed circuit boards (212, 214, 219, 221).

Abstract translation: 一种用于通过使用由多丝线形成并具有沿着跳线形成的扩大的鸟笼（300）的双绞线跳线（231）来互连电子电路板（212,214,219,221）的方法和装置。 跳线穿过电路板堆叠以将网格定位成与位于印刷电路板中的电镀互连孔（303）接触。 保持架（300）在孔（303）中的摩擦接合提供印刷电路板（212,214,219,221）之间的电互连和机械耦合。