公开(公告)号：WO2013103437A1

公开(公告)日：2013-07-11

申请号：PCT/US2012/063044

申请日：2012-11-01

Applicant: CRAY INC.

Inventor： KIM, Hyunjun ,  CONGER, Jeffrey Scott ,  SCOTT, Gregory Erwin

IPC: H01P1/00

CPC classification number: H05K1/0225 ,  H05K1/0219 ,  H05K1/0222 ,  H05K1/0245 ,  H05K1/0298 ,  H05K1/114 ,  H05K1/115 ,  H05K3/4007 ,  H05K3/42 ,  H05K2201/093 ,  H05K2201/09336 ,  H05K2201/09609 ,  H05K2201/09618 ,  Y10T29/49155 ,  Y10T29/49165

Abstract: A multi-layer printed circuit board has a number of landing pads that are configured to engage a connector secured thereto. Between the landing pads associated with different signals is at least one micro via that is electrically connected to a ground plane on an outer surface of the multi-layer printed circuit board, and a ground plane on an inner layer of the multi-layer printed circuit board.

Abstract translation: 多层印刷电路板具有多个着陆焊盘，其被配置为接合固定到其上的连接器。 在与不同信号相关联的着陆垫之间是至少一个微通孔，其电连接到多层印刷电路板的外表面上的接地平面，以及多层印刷电路的内层上的接地平面 板。

公开(公告)号：EP2801123A1

公开(公告)日：2014-11-12

申请号：EP12864500.9

申请日：2012-11-01

Applicant: Cray Inc.

Inventor： KIM, Hyunjun ,  CONGER, Jeffrey Scott ,  SCOTT, Gregory Erwin

IPC: H01P1/00

CPC classification number: H05K1/0225 ,  H05K1/0219 ,  H05K1/0222 ,  H05K1/0245 ,  H05K1/0298 ,  H05K1/114 ,  H05K1/115 ,  H05K3/4007 ,  H05K3/42 ,  H05K2201/093 ,  H05K2201/09336 ,  H05K2201/09609 ,  H05K2201/09618 ,  Y10T29/49155 ,  Y10T29/49165

Abstract: A multi-layer printed circuit board has a number of landing pads that are configured to engage a connector secured thereto. Between the landing pads associated with different signals is at least one micro via that is electrically connected to a ground plane on an outer surface of the multi-layer printed circuit board, and a ground plane on an inner layer of the multi-layer printed circuit board.