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公开(公告)号：WO2013103437A1
公开(公告)日：2013-07-11
申请号：PCT/US2012/063044
申请日：2012-11-01
Applicant: CRAY INC.
Inventor： KIM, Hyunjun , CONGER, Jeffrey Scott , SCOTT, Gregory Erwin
IPC: H01P1/00
CPC classification number: H05K1/0225 , H05K1/0219 , H05K1/0222 , H05K1/0245 , H05K1/0298 , H05K1/114 , H05K1/115 , H05K3/4007 , H05K3/42 , H05K2201/093 , H05K2201/09336 , H05K2201/09609 , H05K2201/09618 , Y10T29/49155 , Y10T29/49165
Abstract: A multi-layer printed circuit board has a number of landing pads that are configured to engage a connector secured thereto. Between the landing pads associated with different signals is at least one micro via that is electrically connected to a ground plane on an outer surface of the multi-layer printed circuit board, and a ground plane on an inner layer of the multi-layer printed circuit board.
Abstract translation: 多层印刷电路板具有多个着陆焊盘，其被配置为接合固定到其上的连接器。 在与不同信号相关联的着陆垫之间是至少一个微通孔，其电连接到多层印刷电路板的外表面上的接地平面，以及多层印刷电路的内层上的接地平面 板。
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公开(公告)号：WO2020028207A1
公开(公告)日：2020-02-06
申请号：PCT/US2019/043831
申请日：2019-07-28
Applicant: CRAY INC.
Inventor： KIM, Hyunjun , BECKER, Andy , FITZKE, Jim , SMITH, Brad , WILDES, Paul
Abstract: To eliminate signal loss and sources of signal attenuation, a connection methodology is utilized which enables high-speed signals to be directly communicated from particular integrated circuits housed on a printed circuit board, to other locations within a system. More specifically, a signal escape strategy directly connects a high-speed cable to a point on the circuit board which is very close to the integrated circuit itself. A back-side connection methodology is utilized so that electrical signals pass directly from the integrated circuit through a via, to a connection point on the backside of the circuit board. To accommodate this connection, a specially designed interposer and related paddle cards are utilized so the high-speed communication cable can be easily attached.
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公开(公告)号：EP2801123A1
公开(公告)日：2014-11-12
申请号：EP12864500.9
申请日：2012-11-01
Applicant: Cray Inc.
Inventor： KIM, Hyunjun , CONGER, Jeffrey Scott , SCOTT, Gregory Erwin
IPC: H01P1/00
CPC classification number: H05K1/0225 , H05K1/0219 , H05K1/0222 , H05K1/0245 , H05K1/0298 , H05K1/114 , H05K1/115 , H05K3/4007 , H05K3/42 , H05K2201/093 , H05K2201/09336 , H05K2201/09609 , H05K2201/09618 , Y10T29/49155 , Y10T29/49165
Abstract: A multi-layer printed circuit board has a number of landing pads that are configured to engage a connector secured thereto. Between the landing pads associated with different signals is at least one micro via that is electrically connected to a ground plane on an outer surface of the multi-layer printed circuit board, and a ground plane on an inner layer of the multi-layer printed circuit board.
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公开(公告)号：EP3361837A1
公开(公告)日：2018-08-15
申请号：EP18155527.7
申请日：2018-02-07
Applicant: Cray Inc.
Inventor： BECKER, Andy , KIM, Hyunjun , UTZ, Shawn , WILDES, Paul
CPC classification number: H05K1/0251 , G06F17/5009 , G06F17/5072 , G06F17/5081 , H05K1/024 , H05K1/112 , H05K1/113 , H05K1/116 , H05K3/0005 , H05K3/4007 , H05K3/4038 , H05K3/429 , H05K2201/09454 , H05K2201/096 , H05K2201/09718 , H05K2201/09781
Abstract: The various structures forming communication paths on a printed circuit board can create several undesired effects, especially when high frequency signals are considered. Non-functional pads created during the manufacturing process have the potential to create an undesired effect, but when the overall collection of non-functional pads are carefully configured, an optimized communication path can be formed. More specifically, by selectively removing some collection of the non-functional pads, the high frequency characteristics of the communication paths can be optimized.
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