公开(公告)号：WO2019190593A1

公开(公告)日：2019-10-03

申请号：PCT/US2018/053652

申请日：2018-09-28

Applicant: CSP TECHNOLOGIES, INC.

Inventor： HUBER, Donald ,  FREEDMAN, Jonathan R. ,  TIFFT, Brian ,  LUCAS, JR., Franklin Lee

IPC: B29C45/00 ,  B65D43/16 ,  B65D47/08 ,  B29L31/56 ,  B29C45/16

Abstract: A method of over-molding materials includes: providing a first material in a groove in a first portion of a mold such that only a single surface of the first material is exposed to a vacant portion of the mold; providing, via an injection molding process, a second material in a liquid form in the vacant portion of the mold adjacent to, and in engagement with, the first material; and allowing the second material to solidify and become directly coupled to the first material, thus forming a single component. During the method, the entire single surface of the first material is flush with a plane defined by outer surface of the first portion of the mold. The second material has one or both of a greater hardness when solidified than the first material and/or a higher melting temperature than the first material.

公开(公告)号：WO2018183791A1

公开(公告)日：2018-10-04

申请号：PCT/US2018/025325

申请日：2018-03-30

Applicant: CSP TECHNOLOGIES, INC.

Inventor： HUBER, Donald ,  FREEDMAN, Jonathan R. ,  TIFFT, Brian ,  LUCAS, JR., Franklin Lee

IPC: B29C45/00 ,  B65D43/16 ,  B65D47/08

Abstract: A method of over- molding materials includes: providing a first material in a groove in a first portion of a mold such that only a single surface of the first material is exposed to a vacant portion of the mold; providing, via an injection molding process, a second material in a liquid form in the vacant portion of the mold adjacent to, and in engagement with, the first material; and allowing the second material to solidify and become directly coupled to the first material, thus forming a single component. The second material has one or both of a greater hardness when solidified than the first material and/or a higher melting temperature than the first material.

公开(公告)号：EP3774261A1

公开(公告)日：2021-02-17

申请号：EP18786198.4

申请日：2018-09-28

Applicant: CSP Technologies, Inc.

Inventor： HUBER, Donald ,  FREEDMAN, Jonathan R. ,  TIFFT, Brian ,  LUCAS, JR., Franklin Lee

IPC: B29C45/00 ,  B65D43/16 ,  B65D47/08 ,  B29L31/56 ,  B29C45/16

公开(公告)号：EP3600820A1

公开(公告)日：2020-02-05

申请号：EP18718374.4

申请日：2018-03-30

Applicant: CSP Technologies, Inc.

Inventor： HUBER, Donald ,  FREEDMAN, Jonathan R. ,  TIFFT, Brian ,  LUCAS, Franklin Lee, Jr.

IPC: B29C45/00 ,  B65D43/16 ,  B65D47/08