公开(公告)号：US20090077799A1

公开(公告)日：2009-03-26

申请号：US12232189

申请日：2008-09-12

Applicant: Chih Kui Yang

Inventor： Chih Kui Yang

IPC: H05K1/18 ,  H05K3/10

CPC classification number: H05K1/162 ,  H05K3/0023 ,  H05K3/107 ,  H05K3/4602 ,  H05K3/4644 ,  H05K2201/0166 ,  H05K2201/0175 ,  H05K2201/0209 ,  H05K2201/0959 ,  Y10T29/49155

Abstract: The present invention relates to a circuit board structure with a capacitor embedded therein and the method for fabricating the same. The disclosed structure comprises: a core board; a buffer layer disposed on two surfaces of the core board and having a plurality of open areas; a first circuit layer disposed in the open areas; a high dielectric material film disposed over the first circuit layer and the buffer layer on at least one surface of the core board; and a second circuit layer disposed on the high dielectric material film, wherein the region where the second circuit layer corresponds to the first circuit layer functions as a capacitor, and the first circuit layer on two surfaces of the core board electrically connects to each other by at least one plated through hole. The present invention improves the problem of void generation and enhances the precision of the capacitor region.

Abstract translation: 本发明涉及一种其中嵌有电容器的电路板结构及其制造方法。 所公开的结构包括：芯板; 缓冲层，设置在所述芯板的两个表面上并具有多个开放区域; 布置在所述开放区域中的第一电路层; 设置在所述芯板的至少一个表面上的所述第一电路层和所述缓冲层之上的高电介质材料膜; 以及设置在高电介质材料膜上的第二电路层，其中第二电路层对应于第一电路层的区域用作电容器，并且芯板的两个表面上的第一电路层通过 至少一个电镀通孔。 本发明改善了空穴产生的问题，提高了电容器区域的精度。