-
1.发明申请Manufacturing a Semiconductor Package Including an Embedded Circuit Component within a Support Structure of the Package 审中-公开在封装的支持结构内制造包含嵌入式电路元件的半导体封装公开(公告)号：US20150342053A1
公开(公告)日：2015-11-26
申请号：US14815184
申请日：2015-07-31
Applicant: Cisco Technology, Inc.
Inventor： Jovica Savic , Zhiping Yang , Jie Xue , Li Li
IPC: H05K1/18 , H05K1/11 , H01L23/498
CPC classification number: H05K1/183 , H01L23/24 , H01L23/3107 , H01L23/49838 , H01L2224/16225 , H01L2924/0002 , H05K1/115 , H05K1/181 , H05K2201/095 , H05K2201/10492 , H05K2201/10507 , H01L2924/00
Abstract: An apparatus includes a cavity formed in a support structure, the support structure being operable to support a semiconductor device. A circuit element is disposed in the cavity in the support structure, and the cavity in the support structure is filled with an electrically non-conductive filling material so as to at least partially surround the circuit element with the non-conductive filling material. The semiconductor device is electrically connected to the circuit element. In an example embodiment, the circuit element is operable to substantially block direct current that is output by the semiconductor device or another semiconductor device.
Abstract translation: 一种装置包括形成在支撑结构中的空腔，所述支撑结构可操作以支撑半导体器件。 电路元件设置在支撑结构中的空腔中，并且支撑结构中的空腔填充有不导电的填充材料，以便至少部分地围绕电路元件与非导电填充材料。 半导体器件电连接到电路元件。 在示例性实施例中，电路元件可操作以基本上阻挡由半导体器件或另一半导体器件输出的直流电流。
-
2.发明授权Semiconductor package including an embedded circuit component within a support structure of the package 有权半导体封装包括在封装的支撑结构内的嵌入式电路部件公开(公告)号：US09414497B2
公开(公告)日：2016-08-09
申请号：US14815184
申请日：2015-07-31
Applicant: Cisco Technology, Inc.
Inventor： Jovica Savic , Zhiping Yang , Jie Xue , Li Li
CPC classification number: H05K1/183 , H01L23/24 , H01L23/3107 , H01L23/49838 , H01L2224/16225 , H01L2924/0002 , H05K1/115 , H05K1/181 , H05K2201/095 , H05K2201/10492 , H05K2201/10507 , H01L2924/00
Abstract: An apparatus includes a cavity formed in a support structure, the support structure being operable to support a semiconductor device. A circuit element is disposed in the cavity in the support structure, and the cavity in the support structure is filled with an electrically non-conductive filling material so as to at least partially surround the circuit element with the non-conductive filling material. The semiconductor device is electrically connected to the circuit element. In an example embodiment, the circuit element is operable to substantially block direct current that is output by the semiconductor device or another semiconductor device.
Abstract translation: 一种装置包括形成在支撑结构中的空腔，所述支撑结构可操作以支撑半导体器件。 电路元件设置在支撑结构中的空腔中，并且支撑结构中的空腔填充有不导电的填充材料，以便至少部分地围绕电路元件与非导电填充材料。 半导体器件电连接到电路元件。 在示例性实施例中，电路元件可操作以基本上阻挡由半导体器件或另一半导体器件输出的直流电流。
-
Search Results
2
records
(took 0.023 seconds)
