公开(公告)号：EP0617568B1

公开(公告)日：1997-07-02

申请号：EP94301987.7

申请日：1994-03-21

Applicant: Compaq Computer Corporation

Inventor： Stoddard, D Joe

IPC: H05K1/11

CPC classification number: H05K3/3442 ,  H05K1/0231 ,  H05K1/113 ,  H05K1/114 ,  H05K3/0094 ,  H05K2201/0792 ,  H05K2201/09772 ,  H05K2201/10636 ,  Y02P70/611 ,  Y02P70/613

公开(公告)号：EP0617568A1

公开(公告)日：1994-09-28

申请号：EP94301987.7

申请日：1994-03-21

Applicant: Compaq Computer Corporation

Inventor： Stoddard, D Joe

IPC: H05K1/11

CPC classification number: H05K3/3442 ,  H05K1/0231 ,  H05K1/113 ,  H05K1/114 ,  H05K3/0094 ,  H05K2201/0792 ,  H05K2201/09772 ,  H05K2201/10636 ,  Y02P70/611 ,  Y02P70/613

Abstract: A capacitor mounting structure for printed circuit boards wherein the capacitor includes first and second terminals (15a,15b) which are connected to first and second conductor planes (44,45) in the printed circuit board (B). Three vias (41,42,43) are mounted in the printed circuit board (B) in a position to be aligned with the middle of the capacitor. A first conductor pad (45) is mounted underneath one end of the capacitor and includes spaced apart extension portions (45b,45c) which electrically attach to the first (41) and third via (43). A second conductor pad (44) is mounted under the other end of the capacitor and includes a central extension portion (44b) which attaches to the second or middle via (42). In this manner, the region available for generation of parasitic inductance is minimized thereby increasing the operating efficiency of the capacitor.

Abstract translation: 一种用于印刷电路板的电容器安装结构，其中电容器包括连接到印刷电路板（B）中的第一和第二导体平面（44,45）的第一和第二端子（15a，15b）。 三个通孔（41,42,43）安装在印刷电路板（B）中以与电容器的中间对准的位置。 第一导体焊盘（45）安装在电容器的一端下方，并且包括电连接到第一（41）和第三通孔（43）的间隔开的延伸部分（45b，45c）。 第二导体焊盘（44）安装在电容器的另一端之下，并且包括连接到第二或中间通孔（42）的中心延伸部分（44b）。 以这种方式，可用于产生寄生电感的区域被最小化，从而提高了电容器的工作效率。