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Patent Agency Ranking
公开(公告)号：US20140345787A1
公开(公告)日：2014-11-27
申请号：US13900840
申请日：2013-05-23
Applicant: DATACARD CORPORATION
IPC: B29C53/18
CPC classification number: B29C53/18 , B29L2017/006 , B32B37/0015 , B32B37/14 , B32B38/145 , B32B2037/0061 , B32B2425/00 , B65H29/70 , B65H2301/512565 , B65H2701/1914 , Y10T156/1002
Abstract: A substrate de-bowing mechanism, system and method are described. The mechanism can include a substrate support, one or more stationary contact members, and one or more dynamic or movable contact members that are adapted to contact the substrate and bend the substrate in a desired direction to reduce or eliminate bowing of the substrate. The mechanism is controlled by a CPU or other controller that can adjust the de-bow parameters of the de-bowing mechanism based on input settings that can be dynamic and/or static settings. The mechanism can be used to de-bow a variety of substrates including plastic cards, passports, and passport pages.
Abstract translation: 描述了衬底去弓形机构，系统和方法。 该机构可以包括衬底支撑件，一个或多个固定接触构件以及一个或多个动态或可动接触构件，其适于接触衬底并在期望的方向上弯曲衬底以减少或消除衬底的弯曲。 该机构由CPU或其他控制器控制，该控制器可以基于可以是动态和/或静态设置的输入设置来调节去弓形机构的去弓参数。 该机制可用于去除各种基材，包括塑料卡，护照和护照页。
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公开(公告)号：US10384883B2
公开(公告)日：2019-08-20
申请号：US13773753
申请日：2013-02-22
Applicant: DATACARD CORPORATION
Abstract: Systems and methods that utilize a card reorienting mechanism are described. Generally, the card reorienting mechanism can transport and rotate a card without substantially contacting one of the principal surfaces of the card. The use of the card reorienting mechanism permits reorienting of the card without substantially contacting the principal surface of the card after the operation has been performed on the principal surface of the card. The card reorienting mechanism of the present disclosure can be useful where rotation of the card without contacting the principal surfaces of the card is desired moments after ink is applied to one of the principal surfaces of the card. In addition, substantially the entire principle surface is accessible for processing operations while the card is on the reorienting mechanism, such as for laser personalization or for image capture.
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公开(公告)号：US09751253B2
公开(公告)日：2017-09-05
申请号：US15172402
申请日：2016-06-03
Applicant: ENTRUST DATACARD CORPORATION
CPC classification number: B29C53/18 , B29L2017/006 , B32B37/0015 , B32B37/14 , B32B38/145 , B32B2037/0061 , B32B2425/00 , B65H29/70 , B65H2301/512565 , B65H2701/1914 , Y10T156/1002
Abstract: A substrate de-bowing mechanism, system and method are described. The mechanism can include a substrate support, one or more stationary contact members, and one or more dynamic or movable contact members that are adapted to contact the substrate and bend the substrate in a desired direction to reduce or eliminate bowing of the substrate. The mechanism is controlled by a CPU or other controller that can adjust the de-bow parameters of the de-bowing mechanism based on input settings that can be dynamic and/or static settings. The mechanism can be used to de-bow a variety of substrates including plastic cards, passports, and passport pages.
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公开(公告)号：US20160279857A1
公开(公告)日：2016-09-29
申请号：US15172402
申请日：2016-06-03
Applicant: ENTRUST DATACARD CORPORATION
CPC classification number: B29C53/18 , B29L2017/006 , B32B37/0015 , B32B37/14 , B32B38/145 , B32B2037/0061 , B32B2425/00 , B65H29/70 , B65H2301/512565 , B65H2701/1914 , Y10T156/1002
Abstract: A substrate de-bowing mechanism, system and method are described. The mechanism can include a substrate support, one or more stationary contact members, and one or more dynamic or movable contact members that are adapted to contact the substrate and bend the substrate in a desired direction to reduce or eliminate bowing of the substrate. The mechanism is controlled by a CPU or other controller that can adjust the de-bow parameters of the de-bowing mechanism based on input settings that can be dynamic and/or static settings. The mechanism can be used to de-bow a variety of substrates including plastic cards, passports, and passport pages.
Abstract translation: 描述了衬底去弓形机构，系统和方法。 该机构可以包括衬底支撑件，一个或多个固定接触构件以及一个或多个动态或可动接触构件，其适于接触衬底并在期望的方向上弯曲衬底以减少或消除衬底的弯曲。 该机构由CPU或其他控制器控制，该控制器可以基于可以是动态和/或静态设置的输入设置来调节去弓形机构的去弓参数。 该机制可用于去除各种基材，包括塑料卡，护照和护照页。
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公开(公告)号：US09381695B2
公开(公告)日：2016-07-05
申请号：US13900840
申请日：2013-05-23
Applicant: DATACARD CORPORATION
CPC classification number: B29C53/18 , B29L2017/006 , B32B37/0015 , B32B37/14 , B32B38/145 , B32B2037/0061 , B32B2425/00 , B65H29/70 , B65H2301/512565 , B65H2701/1914 , Y10T156/1002
Abstract: A substrate de-bowing mechanism, system and method are described. The mechanism can include a substrate support, one or more stationary contact members, and one or more dynamic or movable contact members that are adapted to contact the substrate and bend the substrate in a desired direction to reduce or eliminate bowing of the substrate. The mechanism is controlled by a CPU or other controller that can adjust the de-bow parameters of the de-bowing mechanism based on input settings that can be dynamic and/or static settings. The mechanism can be used to de-bow a variety of substrates including plastic cards, passports, and passport pages.
Abstract translation: 描述了衬底去弓形机构，系统和方法。 该机构可以包括衬底支撑件，一个或多个固定接触构件以及一个或多个动态或可动接触构件，其适于接触衬底并在期望的方向上弯曲衬底以减少或消除衬底的弯曲。 该机构由CPU或其他控制器控制，该控制器可以基于可以是动态和/或静态设置的输入设置来调节去弓形机构的去弓参数。 该机制可用于去除各种基材，包括塑料卡，护照和护照页。
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