公开(公告)号：EP3135783A4

公开(公告)日：2017-10-11

申请号：EP15782584

申请日：2015-04-23

Applicant: DENKA COMPANY LTD

Inventor： ISHIHARA YOSUKE ,  MIYAKAWA TAKESHI ,  TSUKAMOTO HIDEO ,  NARITA SHINYA

IPC: C22C26/00 ,  C01B32/28 ,  C01B32/914 ,  C22C1/05 ,  C22C1/10 ,  F28F13/18 ,  F28F21/08 ,  H01L23/373

CPC classification number: F28F13/18 ,  C01B32/28 ,  C01B32/914 ,  C22C1/05 ,  C22C1/10 ,  C22C26/00 ,  C22C2026/008 ,  F28F21/084 ,  F28F21/089 ,  F28F2255/06 ,  H01L23/373 ,  H01L23/3732 ,  H01L2924/0002 ,  H01L2924/00

Abstract: The purpose of the present invention is to provide an aluminum-diamond composite that exhibits both high thermal conductivity and a coefficient of thermal expansion close to that of semiconductor devices, and that can suppress the occurrence of swelling, etc., of a surface metal layer portion even in actual use under a high load. Provided is an aluminum-diamond composite comprising 65-80 vol% of a diamond powder having a roundness of at least 0.94, for which a first peak in a volumetric distribution of grain size lies at 5-25 µm, and a second peak lies at 55-195 µm, and a ratio between the area of the volumetric distribution of grain sizes of 1-35 µm and the area of the volumetric distribution of grain sizes of 45-205 µm is from 1 : 9 to 4 : 6; the balance being composed of a metal containing aluminum.

公开(公告)号：EP3151270A4

公开(公告)日：2018-01-17

申请号：EP15799652

申请日：2015-05-26

Applicant: DENKA COMPANY LTD

Inventor： MIYAKAWA TAKESHI ,  KINO MOTONORI ,  ISHIHARA YOSUKE

IPC: H01L23/373 ,  B22F1/00 ,  B22F7/06 ,  B23K35/30 ,  B23K35/36 ,  C22C26/00 ,  H01L23/047 ,  H01L23/10

CPC classification number: H01L23/3737 ,  B22F1/0011 ,  B22F1/0014 ,  B22F1/0018 ,  B22F1/0062 ,  B22F1/02 ,  B22F7/064 ,  B22F2301/255 ,  B22F2302/25 ,  B23K1/0016 ,  B23K35/3006 ,  B23K35/3602 ,  C22C5/06 ,  C22C5/08 ,  C22C26/00 ,  C22C30/02 ,  C22C30/06 ,  H01L21/4882 ,  H01L23/047 ,  H01L23/10 ,  H01L23/367 ,  H01L23/373 ,  H01L23/3732 ,  H01L23/3736 ,  H01L23/40 ,  H01L2924/16195

Abstract: [Problem] To provide an inexpensive semiconductor package having excellent heat dissipation properties. [Solution] The present invention provides a semiconductor package having, stacked in the following order, a heat dissipating member, a joining layer and an insulation member, wherein the heat dissipating member comprises an aluminum-diamond composite containing diamond grains and a metal containing aluminum; and the joining layer that joins the heat dissipating member and the insulation member is formed using a composite material comprising silver oxide fine particles or organic-coated silver fine particles having an average particle size of at least 1 nm and at most 100 µm.