公开(公告)号：JP2014065915A

公开(公告)日：2014-04-17

申请号：JP2013243015

申请日：2013-11-25

Applicant: Dow Corning Corp ,  ダウ コーニング コーポレーションDow Corning Corporation

Inventor： KLEYER DON L ,  LUTZ MICHAEL ANDREW

IPC: C09J183/06 ,  C09J183/07 ,  C08K5/00 ,  C08K5/04 ,  C08K5/053 ,  C08K5/5419 ,  C08L83/00 ,  C09J9/02 ,  C09J11/04 ,  C09J11/06 ,  C09J183/04 ,  C09J183/05 ,  C09J201/06

CPC classification number: C09J183/04 ,  C08K5/0091 ,  C08K5/04 ,  C08K5/053 ,  C08K5/5419 ,  C08L83/00 ,  C08L2666/28 ,  C08L2666/34 ,  C08L2666/54 ,  C09J9/02

Abstract: PROBLEM TO BE SOLVED: To provide a silicone composition for preparing a silicone adhesive having an excellent electroconductivity, in particular.SOLUTION: The prepared composition comprises: an organopolysiloxane including, on the average per molecule, at least two silicon-bonded alkenyl groups; an organohydrodiene polysiloxane including, on the average per molecule, at least two silicon-bonded hydrogen atoms at a concentration sufficient for curing the provided composition; an electroconductive filler at a quantitative ratio sufficient for conferring electroconductivity onto the silicone adhesive (the filler includes particles having outer surfaces constituted by a metal selected from the group consisting of silver, gold, platinum, palladium, and their alloys); an effective quantity of a hydroxy-functional organic compound having an upper limit molecular weight of 1000 and including at least one hydroxyl group per molecule, assuming that the compound in question includes no acetylenic hydroxyl groups and that the compound in question does not substantially hinder the curing of the composition; and a catalytic quantitative ratio of a hydrosilylation catalyst.

Abstract translation: 要解决的问题：提供一种用于制备具有优异导电性的硅氧烷粘合剂的硅氧烷组合物。特别是。制备的组合物包含：有机聚硅氧烷，其平均每分子包含至少两个与硅键合的烯基; 有机氢二烯聚硅氧烷，其平均每分子包含至少两个硅键合的氢原子，其浓度足以固化所提供的组合物; 导电填料，其量子比足以使导电性赋予硅氧烷粘合剂（填料包括具有由选自银，金，铂，钯及其合金的金属构成的外表面的颗粒）; 有效量的上限分子量为1000并且每分子包含至少一个羟基的羟基官能有机化合物，假定所讨论的化合物不包含炔属羟基，并且所述化合物基本上不妨碍 固化组合物; 和氢化硅烷化催化剂的催化定量比。

公开(公告)号：JP2002371185A

公开(公告)日：2002-12-26

申请号：JP2001302240

申请日：2001-09-28

Applicant: Dow Corning Corp ,  ダウ・コ−ニング・コ−ポレ−ション

Inventor： AHN DONGCHAN ,  LUTZ MICHAEL ANDREW

IPC: C08L83/07 ,  C08K5/00 ,  C08K5/057 ,  C08L83/05

CPC classification number: C08K5/0091 ,  C08G77/12 ,  C08G77/20 ,  C08L83/04 ,  C09D183/04 ,  C08L83/14 ,  C08L83/00

Abstract: PROBLEM TO BE SOLVED: To provide a silicone composition having excellent characteristics. SOLUTION: This silicone composition comprises (A) an organopolysiloxane containing at least average 2 silicon-bound alkenyl groups per molecule, (B) an organohydrogenpolysiloxane containing at least average 2 silicon-bound hydrogen atoms per molecule at a concentration sufficient to cure the composition, (C) an effective amount of a transition metal compound and (D) a catalytic amount of a hydrosilylating catalyst.

Abstract translation: 要解决的问题：提供具有优异特性的硅氧烷组合物。 解决方案：该硅氧烷组合物包含（A）每分子含有至少平均2个硅键合的烯基的有机聚硅氧烷，（B）每分子含有至少平均2个硅键合氢原子的有机氢聚硅氧烷，其浓度足以固化该组合物， （C）有效量的过渡金属化合物和（D）催化量的氢化硅烷化催化剂。

公开(公告)号：JP2002363415A

公开(公告)日：2002-12-18

申请号：JP2001302212

申请日：2001-09-28

Applicant: DOW CORNING

Inventor： AHN DONGCHAN ,  LUTZ MICHAEL ANDREW

IPC: C08L83/07 ,  C07C33/02 ,  C08K5/057 ,  C08L83/04 ,  C08L83/05 ,  C09D183/04 ,  C09J183/04

Abstract: PROBLEM TO BE SOLVED: To obtain a silicone composition having excellent properties. SOLUTION: The silicone composition is produced by blending together (A) 100 pts.mass of an organopolysiloxane, (B) an organohydrogenpolysiloxane with a concentration enough to cure the composition, (C) 0.5-50 pt(s).mass of a hydroxyfunctional organic compound, (D) 1-10 pt(s).mass of a titanium chelate compound and (E) a catalytic amount of a hydrosilylation catalyst.

公开(公告)号：JP2002088227A

公开(公告)日：2002-03-27

申请号：JP2001239653

申请日：2001-08-07

Applicant: DOW CORNING

Inventor： KLEYER DON L ,  LUTZ MICHAEL ANDREW

IPC: C08L63/00 ,  C08K5/00 ,  C08K5/04 ,  C08K5/54 ,  C08K9/02 ,  C08L83/04 ,  C08L83/06 ,  C09D183/06 ,  C08K5/541

Abstract: PROBLEM TO BE SOLVED: To provide a silicone composition containing a conductive filler and a hydroxyl-functional organic compound. SOLUTION: This silicone composition, for preparing a cured silicone product, is prepared by mixing (A) an organopolysiloxane having, on average, at least two epoxy-functional organic groups per molecule, (B) a curing agent containing no phenolic hydroxyl group, in an amount enough to cure the composition, (C) a conductive filler containing particles having the surface coated with a metal selected from among silver, gold, platinum, palladium, and their alloys, in an amount enough to impart electric conductivity to the composition, and (D) an effective amount of a hydroxyl-functional organic compound having a mol.wt. of 1,000 or lower and at least one hydroxyl group per molecule (provided this compound does not substantially inhibit the curing of the composition).

公开(公告)号：JP2000086991A

公开(公告)日：2000-03-28

申请号：JP24149399

申请日：1999-08-27

Applicant: DOW CORNING

Inventor： FENG QIAN JANE ,  LEE KENNETH MICHAEL ,  LUTZ MICHAEL ANDREW ,  OWEN MICHAEL JAMES ,  PERZ SUSAN VICTORIA ,  SUZUKI TOSHIO

IPC: C08J3/24 ,  C08G77/442 ,  C08J5/12 ,  C08K5/1515 ,  C08K5/541 ,  C08L23/22 ,  C08L43/04 ,  C08L83/04 ,  C09J123/22

Abstract: PROBLEM TO BE SOLVED: To obtain a sticky polyolefin composition having improved adhesivity to various substrates by adding a specific adhesion accelerator to a polyolefin containing a curing agent. SOLUTION: This sticky polyolefin composition comprises (A) a polyolefin having at least two ethylenic unsaturated substituents capable of curing the polyolefin and (B) an adhesion accelerator comprising (i) an epoxide-containing compound (preferably 3-glycosidoxypropyltrimethoxysilane, etc.), selected from organic compounds and organic silicon compounds and (ii) a compound (preferably dihydrocarveol) having a substituent selected from a silanol (=SiOH), a hydrolyzable silanol precursor and a carbinol (=COH) and a substituent capable of reacting during the curing of the component A. The component B is added in a content of 1.5-7.5 wt.% based on the total weight of the composition. The component i is used in an amount of 10-90 wt.% based on the total amount of the components i and ii.

公开(公告)号：JP2000038510A

公开(公告)日：2000-02-08

申请号：JP19212599

申请日：1999-07-06

Applicant: DOW CORNING

Inventor： KLEYER DON L ,  LUTZ MICHAEL ANDREW ,  MINE KATSUTOSHI ,  MITANI OSAMU ,  NAKAYOSHI KAZUMI ,  VANWERT BERNARD

IPC: C08L83/05 ,  C08K3/08 ,  C08L83/04 ,  C08L83/07 ,  H01B1/22

Abstract: PROBLEM TO BE SOLVED: To provide an electrically conductive silicone composition the cured material of which is suitable for use as an adhesive for an electronic device and has low volume resistivity and/or rubber elasticity. SOLUTION: This electrically conductive silicone composition comprises an organopolysiloxane having two or more alkenyl groups per molecule, an organohydrogen polysiloxane having two or more silicon-bonded hydrogen atoms per molecule, a catalyst containing a platinum group metal, a finely-divided electrically conductive metal particle, a pre-crosslinked elastomeric silicone particle and a non-reactive volatile diluent. The electrically conductive silicone composition can be used for an electrically conductive adhesive or a coating applied to an electrical or electronic device. The cured electrically conductive silicone composition has a high electrical conductivity and rubber elasticity.

公开(公告)号：JP2002088337A

公开(公告)日：2002-03-27

申请号：JP2001222310

申请日：2001-07-23

Applicant: DOW CORNING

Inventor： KLEYER DON L ,  LUTZ MICHAEL ANDREW

IPC: C09J183/06 ,  C08K5/00 ,  C08K5/04 ,  C08K5/053 ,  C08K5/5419 ,  C08L83/00 ,  C09J9/02 ,  C09J183/04 ,  C09J183/05 ,  C09J183/07 ,  C09J201/06

Abstract: PROBLEM TO BE SOLVED: To obtain a silicone composition for preparing a silicone adhesive having excellent electric conductivity particularly. SOLUTION: In this invention, the objective composition comprises an organopolysiloxane bearing at least two alkenyl groups bonding to every silicon molecule on the average; an organohydrogenpolysiloxane bearing at least two hydrogen atoms bonding to every silicon molecule on the average in a concentration sufficient for curing the composition; an electroconductive filler (for example, including particles having at least the outer surfaces covered with a metal selected from silver, gold, platinum, palladium or their alloys) in an amount enough to impart the electric conductivity to the above silicone adhesive; an effective amount of a hydroxy-functional organic compound that has a molecular weight of 1,000 at maximum and bears at least one hydroxy group every molecule where the organic compound does not include an acetylenic hydroxy group and substantially does not inhibit the composition from being hardened; and a catalytic amount of a hydrosilylation catalyst.

公开(公告)号：JP2002080816A

公开(公告)日：2002-03-22

申请号：JP2001222309

申请日：2001-07-23

Applicant: DOW CORNING

Inventor： KLEYER DON L ,  LUTZ MICHAEL ANDREW

IPC: C09J183/06 ,  C08K5/04 ,  C08K5/05 ,  C08K5/053 ,  C08K5/098 ,  C08K5/54 ,  C08K9/02 ,  C08L83/04 ,  C09J9/02 ,  C09J183/04 ,  C09J183/08 ,  H01B1/22

Abstract: PROBLEM TO BE SOLVED: To improve the electrical conductivity of a curable silicone composition for preparing silicone adhesives. SOLUTION: The silicone composition is prepared by mixing a catalytic amount of a condensation catalyst containing (A) an organopolysiloxane containing at least two silicon-bound hydroxyl groups per molecule on average, (B) a crosslinking agent comprising at least one silane of the formula: R2nSiX4-n (R2 is a 1-8C monovalent hydrocarbon or a monovalent hydrocarbon halide group; n is 0 or 1; and X is -OR2 or -OCH2CH2OR2) or its partial hydrolysate, (C) an electrically conductive filler containing a particle of which at least the outer surface comprises silver, gold, platinum, palladium or their alloys, (D) a hydroxyl-functional organic compound having a molecular weight of

公开(公告)号：JP2000073034A

公开(公告)日：2000-03-07

申请号：JP24156599

申请日：1999-08-27

Applicant: DOW CORNING

Inventor： FENG QIAN JANE ,  LEE KENNETH MICHAEL ,  LUTZ MICHAEL ANDREW ,  OWEN MICHAEL JAMES ,  PERZ SUSAN VICTORIA ,  SUZUKI TOSHIO

IPC: C08J3/24 ,  C08G77/442 ,  C08J5/12 ,  C08K5/5419 ,  C08L23/22 ,  C08L83/04 ,  C09J123/22

Abstract: PROBLEM TO BE SOLVED: To obtain a poluolefin composition capable of exhibiting storing binding forces to various substrates by mixing a polyolefin with a specific organic silicon compound as an adhesive-accelerating agent. SOLUTION: This polyolefin composition comprises (A) at least one polyolefin which contains repeating units derived from at least one olefin and functional groups capable of cross-linking the polyolefin, and (B) an effective amount of an adhesive-accelerating agent. The component B is the reaction product of a polyhydric alcohol of formula I [R1 is a m-valiant hydrocarbon containing no ethylenic unsaturated group or the like; and (m) is an integer of at least 2] with a silane of formula II [R2 is a non-substituted hydrocarbon or the like; (n) is 0 or 1; and X is a hydrolyzable group] or a bissilylalkane of formula III (R3 is an alkylene). The composition shows adhesivity to inorganic and organic substrates.

公开(公告)号：JP2002322363A

公开(公告)日：2002-11-08

申请号：JP2001111614

申请日：2001-04-10

Applicant: DOW CORNING

Inventor： BHAGWAGAR DORAB EDUL ,  KLEYER DON LEE ,  LUTZ MICHAEL ANDREW

IPC: C08L83/07 ,  C08K5/5419 ,  C08K9/02 ,  C08L83/05 ,  C09J9/02 ,  C09J183/05 ,  C09J183/07

Abstract: PROBLEM TO BE SOLVED: To obtain a conductive silicone adhesive having superior electric characteristics. SOLUTION: The silicone composition contains (A) a polydiorganosiloxane of 10 to 50 pts.mass; (B) an organopolysiloxane resin of 50 to 90 pts.mass constituting of R 3 SiO1/2 siloxane unit and SiO4/2 siloxane unit; (C) an organo hydrodienepolysiloxane having silicon bound hydrogen atom of at least average two per one molecule with a sufficient quantity to curing the composition; (D) a conductive filler of a sufficient quantity to give conductivity to the composition and (E) a hydrosilyl catalyst of a catalytic quantity.