公开(公告)号：EP2034321A2

公开(公告)日：2009-03-11

申请号：EP08162957.8

申请日：2008-08-26

Applicant: Delphi Technologies, Inc.

Inventor： Cluff, Charles A. ,  Cheng, Chean F. ,  Chan, Aik Huang ,  Chua, Sze Lam

IPC: G01P1/02 ,  G01P15/18

CPC classification number: G01P1/023 ,  G01P15/18 ,  Y10T29/53183

Abstract: A multiple-axis sensor package (20) and method of assembling a multiple-axis sensor package (20) arc provided. The package (20) includes a first substrate (30) having a first accelerometer (32) for sensing acceleration (A x ) in a first sensing axis (X-axis). The package (20) also includes a second substrate (40) having a second accelerometer (42) for sensing acceleration (A y ) in a second sensing axis (Y-axis). The package (20) further includes one or more bent lead connectors (90) connecting the first substrate (30) to the second substrate (40), wherein the one or more bent lead connectors (90) are bent so that the first sensing axis (X-axis) is different than the second sensing axis (Y-axis).

Abstract translation: 提供多轴传感器封装（20）和组装多轴传感器封装（20）的方法。 封装（20）包括具有用于感测第一感测轴（X轴）中的加速度（A x）的第一加速度计（32）的第一基板（30）。 封装（20）还包括具有用于感测第二检测轴（Y轴）中的加速度（A y）的第二加速度计（42）的第二基板（40）。 所述包装（20）还包括将所述第一基板（30）连接到所述第二基板（40）的一个或多个弯曲引导连接器（90），其中所述一个或多个弯曲引线连接器（90）被弯曲，使得所述第一感测轴 （X轴）与第二感测轴（Y轴）不同。

公开(公告)号：EP2034321A3

公开(公告)日：2009-11-18

申请号：EP08162957.8

申请日：2008-08-26

Applicant: Delphi Technologies, Inc.

Inventor： Cluff, Charles A. ,  Cheng, Chean F. ,  Chan, Aik Huang ,  Chua, Sze Lam

IPC: G01P1/02 ,  G01P15/18

CPC classification number: G01P1/023 ,  G01P15/18 ,  Y10T29/53183

Abstract: A multiple-axis sensor package (20) and method of assembling a multiple-axis sensor package (20) arc provided. The package (20) includes a first substrate (30) having a first accelerometer (32) for sensing acceleration (A x ) in a first sensing axis (X-axis). The package (20) also includes a second substrate (40) having a second accelerometer (42) for sensing acceleration (A y ) in a second sensing axis (Y-axis). The package (20) further includes one or more bent lead connectors (90) connecting the first substrate (30) to the second substrate (40), wherein the one or more bent lead connectors (90) are bent so that the first sensing axis (X-axis) is different than the second sensing axis (Y-axis).

公开(公告)号：EP1758436A1

公开(公告)日：2007-02-28

申请号：EP06076589.8

申请日：2006-08-17

Applicant: Delphi Technologies, Inc.

Inventor： Chan, Aik Huang

IPC: H05K3/34 ,  H05K13/08

CPC classification number: H05K1/111 ,  H05K1/0268 ,  H05K2201/09663 ,  H05K2201/10636 ,  H05K2203/162 ,  Y02P70/611

Abstract: An electronic package (10) is provided having a circuit board (36) including a substrate electrical circuitry including circuit traces and first and second contacts (22 and 24) for connecting to surface mount device(s) (16A). The first and second contacts (22 and 24) each have multiple components including first and second pads (22A and 22B). The first pad (22A) is separate from the second pad (22B) to allow for low cost and easy testing of the electrical circuit.

Abstract translation: 电子封装（10）具有电路板（36），电路板（36）包括一个包括电路迹线的基板电路和用于连接到表面安装器件（16A）的第一和第二触点（22和24）。 第一和第二触点（22和24）各自具有包括第一和第二焊盘（22A和22B）的多个部件。 第一焊盘（22A）与第二焊盘（22B）分离，以允许低成本且易于测试电路。