公开(公告)号：EP1684560A3

公开(公告)日：2009-01-21

申请号：EP06075019.7

申请日：2006-01-06

Applicant: Delphi Technologies, Inc.

Inventor： Kulhman, Frederick F. ,  Duff, Brentt C. ,  Pepples, Michael J.

IPC: H05K1/18 ,  H05K3/34

CPC classification number: H05K3/3452 ,  H05K1/181 ,  H05K3/3442 ,  H05K3/3489 ,  H05K2201/09772 ,  H05K2201/09909 ,  H05K2201/10022 ,  H05K2201/10636 ,  Y02P70/611 ,  Y02P70/613

Abstract: An electronic assembly (200) includes a substrate (10) and at least one surface mounted electronic component (14). The substrate (10) includes a first side and a second side opposite the first side. The first side of the substrate (10) includes a plurality of conductive traces formed thereon. The plurality of conductive traces includes a first conductive trace (18A) and a second conductive trace (18B). The electronic component (14) is electrically coupled between the first and second conductive traces (18A,18B). A component body of the electronic component (14) is subject to interaction with a flux, which is utilized during electrical coupling of the electronic component (14) to the first and second conductive traces (18A,18B), to form a current leakage path. The substrate (10) is configured to prevent the formation of the current leakage path.

Abstract translation: 电子组件（200）包括衬底（10）和至少一个表面安装的电子部件（14）。 衬底（10）包括第一侧和与第一侧相对的第二侧。 衬底（10）的第一侧包括形成在其上的多个导电迹线。 多个导电迹线包括第一导电迹线（18A）和第二导电迹线（18B）。 电子组件（14）电耦合在第一和第二导电迹线（18A，18B）之间。 电子部件（14）的部件主体与在电子部件（14）与第一和第二导电迹线（18A，18B）电耦合期间利用的通量相互作用，以形成电流泄漏路径 。 衬底（10）被配置为防止形成电流泄漏路径。

公开(公告)号：EP1684560A2

公开(公告)日：2006-07-26

申请号：EP06075019.7

申请日：2006-01-06

Applicant: Delphi Technologies, Inc.

Inventor： Kulhman, Frederick F. ,  Duff, Brentt C. ,  Pepples, Michael J.

IPC: H05K1/18 ,  H05K3/34

CPC classification number: H05K3/3452 ,  H05K1/181 ,  H05K3/3442 ,  H05K3/3489 ,  H05K2201/09772 ,  H05K2201/09909 ,  H05K2201/10022 ,  H05K2201/10636 ,  Y02P70/611 ,  Y02P70/613

Abstract: An electronic assembly (200) includes a substrate (10) and at least one surface mounted electronic component (14). The substrate (10) includes a first side and a second side opposite the first side. The first side of the substrate (10) includes a plurality of conductive traces formed thereon. The plurality of conductive traces includes a first conductive trace (18A) and a second conductive trace (18B). The electronic component (14) is electrically coupled between the first and second conductive traces (18A,18B). A component body of the electronic component (14) is subject to interaction with a flux, which is utilized during electrical coupling of the electronic component (14) to the first and second conductive traces (18A,18B), to form a current leakage path. The substrate (10) is configured to prevent the formation of the current leakage path.

Abstract translation: 电子组件（200）包括基板（10）和至少一个表面安装的电子部件（14）。 基板（10）包括与第一侧相对的第一侧和第二侧。 基板（10）的第一面包括形成在其上的多个导电迹线。 多个导电迹线包括第一导电迹线（18A）和第二导电迹线（18B）。 电子部件（14）电耦合在第一和第二导电迹线（18A，18B）之间。 电子部件（14）的组件主体经受与在电子部件（14）电耦合到第一和第二导电迹线（18A，18B）的电耦合期间所使用的焊剂的相互作用，以形成电流泄漏路径 。 基板（10）被配置为防止形成电流泄漏路径。