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    POLISHER
    1.
    发明公开
    POLISHER 有权
    POLIERVORRICHTUNG

    公开(公告)号：EP1334802A4

    公开(公告)日：2005-08-31

    申请号：EP01901492

    申请日：2001-01-22

    Applicant: EBARA CORP

    Inventor： KAMIMURA KENJI ,  KIMURA NORIO ,  OKAMURA SATOSHI ,  AIZAWA HIDEO ,  AKAGI MAKOTO ,  TOKUSHIGE KATSUHIKO ,  MATSUO HISANORI ,  TSUJIMURA MANABU

    IPC: B24B53/00 ,  B24B53/007 ,  B24B53/017 ,  H01L21/306 ,  B24B37/04

    CPC classification number: B24B53/017 ,  B24B29/005 ,  B24B53/003 ,  H01L21/30625

    Abstract: The invention relates to a polisher for polishing a workpiece, such as a semiconductor wafer, so that it may have a flat mirror finish. The polisher comprises a polisher table (1) with a polishing face, and a top ring (3). A workpiece is placed between the polisher table (1) and the top ring (3) and polished by application of a predetermined pressure. The polisher includes at least two dressing units equipped with dressers (7, 11) that are in contact with the surface of polishing cloth to dress the polishing face.

    Abstract translation: 本发明涉及一种用于抛光诸如半导体晶片的工件的抛光器，以使其可以具有平坦的镜面抛光。 抛光机包括具有抛光面的抛光机台（1）和顶环（3）。 将工件放置在抛光机台（1）和顶环（3）之间并通过施加预定压力抛光。 该抛光机包括至少两个配备有修整器（7,11）的修整单元，修整器（7,11）与抛光布的表面接触以修整抛光面。

    SUBSTRATE PROCESSING APPARATUS AND HAND SHOWER GUN
    2.
    发明专利
    SUBSTRATE PROCESSING APPARATUS AND HAND SHOWER GUN 未知

    公开(公告)号：SG10201807640RA

    公开(公告)日：2018-10-30

    申请号：SG10201807640R

    申请日：2016-03-03

    Applicant: EBARA CORP

    Inventor： AONO HIROSHI ,  AIZAWA HIDEO ,  SONE TADAKAZU ,  SHINKAI KENJI ,  OMATA NOBUTAKA

    Abstract: OF THE DISCLOSURE SUBSTRATE PROCESSING APPARATUS AND HAND SHOWER GUN A substrate processing apparatus includes a substrate processing part 3 and a washing unit 40. The washing unit 40 includes a main body 43 having a liquid supplying port 41 and a liquid jetting port 42, a flow channel 44 formed between the liquid supplying port 41 and the liquid jetting port 42, and a valve 45 provided in the flow channel 44. In the washing unit 40, when the valve 45 is opened, the flow channel 44 is opened, thereby causing the liquid jetting port 42 to jet liquid, and when the valve 45 is closed, the flow channel 44 is closed, thereby causing the liquid jetting port 42 to stop jetting liquid. The flow channel 44 is provided with a water-hammer reducing mechanism 48 that operates to reduce damage to the flow channel 44 caused by a water hammer phenomenon when the valve 45 is closed. Figure 5

    BUFF PROCESSING DEVICE AND SUBSTRATE PROCESSING DEVICE
    3.
    发明专利
    BUFF PROCESSING DEVICE AND SUBSTRATE PROCESSING DEVICE 未知

    公开(公告)号：SG11201804066PA

    公开(公告)日：2018-06-28

    申请号：SG11201804066P

    申请日：2016-10-11

    Applicant: EBARA CORP

    Inventor： AIZAWA HIDEO ,  KUNISAWA JUNJI ,  MIYAZAKI MITSURU ,  TOYOMURA NAOKI

    IPC: H01L21/304 ,  B24B41/047

    Abstract: BUFF PROCESSING DEVICE AND SUBSTRATE PROCESSING DEVICE In-plane uniformity of buff processing is improved. According to a first form, a buff processing device for executing buff processing of a substrate is provided. Such buff processing device has a rotatable shaft, a buff head body, a torque transmission mechanism for transmitting rotation of the shaft to the buff head body, and an elastic member for elastically supporting the buff head body in a longitudinal direction of the shaft. Figure 5

    8.
    发明专利
    未知

    公开(公告)号：DE60133306T2

    公开(公告)日：2009-03-05

    申请号：DE60133306

    申请日：2001-01-22

    Applicant: EBARA CORP

    Inventor： KAMIMURA KENJI ,  KIMURA NORIO ,  OKAMURA SATOSHI ,  AIZAWA HIDEO ,  AKAGI MAKOTO ,  TOKUSHIGE KATSUHIKO ,  MATSUO HISANORI ,  TSUJIMURA MANABU

    IPC: B24B53/00 ,  B24B53/007 ,  B24B53/017 ,  H01L21/306

    Abstract: The present invention relates to a polishing apparatus for polishing a workpiece, such as a semiconductor wafer, to a flat mirror finish. The polishing apparatus comprises a polishing table having a polishing surface, and a top ring, and the workpiece is interposed between the polishing table and the top ring and pressed at a predetermined pressure to polish the workpiece. The polishing apparatus comprises at least two dressing units for dressing the polishing surface by being brought into contact with the polishing surface, which is a surface of a polishing cloth.

    Substrate Polishing Apparatus
    9.
    发明专利
    Substrate Polishing Apparatus 未知

    公开(公告)号：SG10201808052SA

    公开(公告)日：2018-10-30

    申请号：SG10201808052S

    申请日：2015-04-29

    Applicant: EBARA CORP

    Inventor： SHINOZAKI HIROYUKI ,  AONO HIROSHI ,  SONE TADAKAZU ,  SHINKAI KENJI ,  AIZAWA HIDEO

    Abstract: SUBSTRATE POLISHING APPARATUS A substrate processing apparatus has a table on which a polishing surface for polishing a substrate is provided, and a discharge suction section which has a discharge port which communicates with a fluid supply source and through which a fluid is discharged to the polishing surface and a suction opening which communicates with a vacuum source and through which the fluid existing on the polishing surface is sucked. Fig. 4

    POLISHING APPARATUS
    10.
    发明专利
    POLISHING APPARATUS 未知

    公开(公告)号：SG10201505284QA

    公开(公告)日：2016-02-26

    申请号：SG10201505284Q

    申请日：2015-07-03

    Applicant: EBARA CORP

    Inventor： AIZAWA HIDEO ,  UMEMOTO MASAO ,  SONE TADAKAZU ,  KOSUGE RYUICHI

    Abstract: A polishing apparatus which can continue stable operation of the apparatus without generating torsional vibration in a rotary joint and without generating an abnormal sound at an engagement part between a cooling water pipe and a polishing table is disclosed. The polishing apparatus includes a rotary joint fixed to a rotating part of the polishing table or a rotating part of the top ring to supply a fluid into the polishing table or the top ring and discharge the fluid from the polishing table or the top ring, and a rotation-prevention mechanism which connects the rotary joint with an apparatus frame to prevent the rotary joint from being rotated. The rotation-prevention mechanism includes a link mechanism having at least one spherical plain bearing.

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