公开(公告)号：WO2006022452A3

公开(公告)日：2006-06-08

申请号：PCT/JP2005016063

申请日：2005-08-26

Applicant: EBARA CORP ,  KODERA MASAKO ,  MOCHIZUKI YOSHIHIRO ,  FUKUDA AKIRA ,  KODERA AKIRA ,  HIYAMA HIROKUNI ,  TSUJIMURA MANABU ,  HIROKAWA KAZUTO ,  FUKUNAGA AKIRA

Inventor： KODERA MASAKO ,  MOCHIZUKI YOSHIHIRO ,  FUKUDA AKIRA ,  KODERA AKIRA ,  HIYAMA HIROKUNI ,  TSUJIMURA MANABU ,  HIROKAWA KAZUTO ,  FUKUNAGA AKIRA

IPC: B24B37/04 ,  B24B49/00 ,  H01L21/00

CPC classification number: H01L21/6708 ,  B24B37/005 ,  B24B37/042 ,  B24B37/046 ,  B24B49/006 ,  B24B57/02

Abstract: A polishing apparatus (30) has a polishing surface (32), a top ring (36) for holding a wafer (W), motors (46, 56) to move the polishing surface (32) and the wafer (W) relative to each other at a relative speed, and a vertical movement mechanism (54) to press the wafer (W) against the polishing surface (32) under a pressing pressure. The polishing apparatus (30) also has a controller (44) to adjust a polishing condition in a non-Preston range in which a polishing rate is not proportional to a product of the pressing pressure and the relative speed. The polishing apparatus (30) can simultaneously achieve uniform supply of a chemical liquid to a surface of the wafer (W) and a uniform polishing rate within the surface of the wafer (W).

Abstract translation: 研磨装置（30）具有研磨面（32），保持晶片（W）的顶圈（36），使研磨面（32）和晶片（W）相对移动的马达（46,56） 以相对速度彼此相对移动;以及垂直移动机构（54），用于在压力下将晶片（W）压靠在抛光表面（32）上。 抛光装置（30）还具有控制器（44），用于在抛光速率不与压制压力和相对速度的乘积成比例的非普雷斯顿范围内调节抛光条件。 抛光装置（30）可以同时实现向晶片（W）的表面均匀供应化学液并且在晶片（W）的表面内实现均匀的抛光速率。

公开(公告)号：WO9926763A2

公开(公告)日：1999-06-03

申请号：PCT/JP9805252

申请日：1998-11-20

Applicant: EBARA CORP ,  KATSUOKA SEIJI ,  TSUJIMURA MANABU ,  SAKURAI KUNIHIKO ,  OSAWA HIROYUKI

Inventor： KATSUOKA SEIJI ,  TSUJIMURA MANABU ,  SAKURAI KUNIHIKO ,  OSAWA HIROYUKI

IPC: B24B37/04 ,  B24B1/00 ,  B24B27/00 ,  B24B37/10 ,  B24B37/11 ,  B24B37/27 ,  B24B37/34 ,  B24B49/12 ,  B24B53/007 ,  B24B53/017 ,  B24B37/0413

CPC classification number: B24B37/345 ,  B24B27/0023 ,  B24B37/10 ,  B24B37/11 ,  B24B49/12 ,  B24B53/017 ,  Y10T29/53961

Abstract: A polishing apparatus has two parallel processing lines that enables to carry out efficient parallel processing by minimizing the idle time for the turntable and maximizing the through-put. The polishing apparatus comprises at least two processing lines extending in parallel from a storage section. Each line is provided with a cleaning unit (18a, 18b) and a polishing unit (10a, 10b), a temporary storage station (20) disposed between the cleaning unit (18a, 18b) and the polishing unit (10a, 10b) and shared by the processing lines. At least two robotic devices (22, 24) are disposed on each of the processing lines for transferring workpieces among the temporary storage station (20), the polishing unit (10a, 10b) and the cleaning unit (18a, 18b).

Abstract translation: 抛光装置具有两个平行的处理线，其能够通过最小化转台的空闲时间并使通过最大化来执行有效的并行处理。 抛光装置包括从存储部分平行延伸的至少两条处理线。 每条线设置有清洁单元（18a，18b）和抛光单元（10a，10b），设置在清洁单元（18a，18b）和抛光单元（10a，10b）之间的临时存储站（20）和 由处理线共享。 在临时存储站（20），抛光单元（10a，10b）和清洁单元（18a，18b）之间的每个处理线上设置至少两个机器人装置（22,24），用于传送工件。

公开(公告)号：WO9929505A8

公开(公告)日：1999-07-15

申请号：PCT/JP9805541

申请日：1998-12-08

Applicant: EBARA CORP ,  KIMURA NORIO ,  HIYAMA HIROKUNI ,  WADA YUTAKA ,  KAWASHIMA KIYOTAKA ,  TSUJIMURA MANABU ,  KAWAMOTO TAKAYOSHI

Inventor： KIMURA NORIO ,  HIYAMA HIROKUNI ,  WADA YUTAKA ,  KAWASHIMA KIYOTAKA ,  TSUJIMURA MANABU ,  KAWAMOTO TAKAYOSHI

IPC: B24B37/04 ,  B24B57/02

CPC classification number: B24B37/04 ,  B24B57/02 ,  Y10S451/91

Abstract: A polishing solution feeder capable of stably feeding a polishing solution having a predetermined abrasive grain size distribution to a polisher (22), including an ultrasonic oscillator (72) in at least a part of a polishing solution passage through which a polishing solution flows.

Abstract translation: 一种研磨液供给装置，其能够稳定地将具有规定的研磨粒度分布的研磨液供给到抛光机（22），所述抛光机（22）在抛光液通过的至少一部分抛光液流动时包括超声波振荡器（72）。

公开(公告)号：EP1334802A4

公开(公告)日：2005-08-31

申请号：EP01901492

申请日：2001-01-22

Applicant: EBARA CORP

Inventor： KAMIMURA KENJI ,  KIMURA NORIO ,  OKAMURA SATOSHI ,  AIZAWA HIDEO ,  AKAGI MAKOTO ,  TOKUSHIGE KATSUHIKO ,  MATSUO HISANORI ,  TSUJIMURA MANABU

IPC: B24B53/00 ,  B24B53/007 ,  B24B53/017 ,  H01L21/306 ,  B24B37/04

CPC classification number: B24B53/017 ,  B24B29/005 ,  B24B53/003 ,  H01L21/30625

Abstract: The invention relates to a polisher for polishing a workpiece, such as a semiconductor wafer, so that it may have a flat mirror finish. The polisher comprises a polisher table (1) with a polishing face, and a top ring (3). A workpiece is placed between the polisher table (1) and the top ring (3) and polished by application of a predetermined pressure. The polisher includes at least two dressing units equipped with dressers (7, 11) that are in contact with the surface of polishing cloth to dress the polishing face.

Abstract translation: 本发明涉及一种用于抛光诸如半导体晶片的工件的抛光器，以使其可以具有平坦的镜面抛光。 抛光机包括具有抛光面的抛光机台（1）和顶环（3）。 将工件放置在抛光机台（1）和顶环（3）之间并通过施加预定压力抛光。 该抛光机包括至少两个配备有修整器（7,11）的修整单元，修整器（7,11）与抛光布的表面接触以修整抛光面。

公开(公告)号：DE60133306D1

公开(公告)日：2008-04-30

申请号：DE60133306

申请日：2001-01-22

Applicant: EBARA CORP

Inventor： KAMIMURA KENJI ,  KIMURA NORIO ,  OKAMURA SATOSHI ,  AIZAWA HIDEO ,  AKAGI MAKOTO ,  TOKUSHIGE KATSUHIKO ,  MATSUO HISANORI ,  TSUJIMURA MANABU

IPC: B24B53/00 ,  B24B53/007 ,  B24B53/017 ,  H01L21/306

Abstract: The present invention relates to a polishing apparatus for polishing a workpiece, such as a semiconductor wafer, to a flat mirror finish. The polishing apparatus comprises a polishing table having a polishing surface, and a top ring, and the workpiece is interposed between the polishing table and the top ring and pressed at a predetermined pressure to polish the workpiece. The polishing apparatus comprises at least two dressing units for dressing the polishing surface by being brought into contact with the polishing surface, which is a surface of a polishing cloth.

公开(公告)号：DE69333322D1

公开(公告)日：2004-01-08

申请号：DE69333322

申请日：1993-09-22

Applicant: EBARA CORP

Inventor： HIROSE MASAYOSHI ,  TSUJIMURA MANABU ,  ISHIKAWA SEIJI ,  KIMURA NORIO ,  ISHII YOU

IPC: B24B37/10 ,  B24B37/30 ,  H01L21/304 ,  B24B37/04

Abstract: A polishing apparatus for polishing a surface of a workpiece (6), comprising: a turntable (20); a top ring (3) for supporting the workpiece to be polished and pressing the workpiece against said turntable; and a transferring device (66) for transferring the workpiece to and from said top ring, said transferring device having holding means for holding the workpiece, said hold means being raised when the workpiece is transferred to and from said top ring located above said transferring device.

公开(公告)号：DE69530446D1

公开(公告)日：2003-05-28

申请号：DE69530446

申请日：1995-08-24

Applicant: TOSHIBA KAWASAKI KK ,  EBARA CORP

Inventor： HARADA MINORU ,  SHINJO RYOICHI ,  TSUJIMURA MANABU ,  NAKATA REMPEI ,  MIYAZAKI KUNIHIRO ,  KAJI NARUHIKO

IPC: C01B13/11

Abstract: In an improved ozonizer, at least those parts of an ozone gas delivery path located downstream of an ozone generating cell which are to come into contact with ozone gas are either composed of or coated with at least one ozone-resistant, Cr-free material selected from among aluminum (Al), an aluminum alloy, Teflon, fluorinated nickel, a nickel alloy, a silicon oxide based glass and a high-purity aluminium oxide. The ozonizer is capable of producing ozone that is not contaminated with Cr compounds at all or which is insufficiently contaminated to cause any practical problem in the fabrication of highly integrated semiconductor devices.

公开(公告)号：EP1174912A4

公开(公告)日：2009-11-25

申请号：EP00985855

申请日：2000-12-25

Applicant: EBARA CORP ,  TOSHIBA KK

Inventor： KIMURA NORIO ,  MISHIMA KOJI ,  KUNISAWA JUNJI ,  ODAGAKI MITSUKO ,  MAKINO NATSUKI ,  TSUJIMURA MANABU ,  INOUE HIROAKI ,  NAKAMURA KENJI ,  MATSUMOTO MORIJI ,  MATSUDA TETSUO ,  KANEKO HISASHI ,  MORITA TOSHIYUKI ,  HAYASAKA NOBUO ,  OKUMURA KATSUYA

IPC: B24B37/04 ,  C23C18/16 ,  C25D7/12 ,  C25D17/12 ,  C25D17/14 ,  H01L21/00 ,  H01L21/02 ,  H01L21/288 ,  H01L21/306 ,  H01L21/321 ,  H01L21/3213 ,  H01L21/677 ,  H01L21/768 ,  H05K3/42

CPC classification number: H01L21/67161 ,  B24B37/04 ,  C23C18/1619 ,  C23C18/1632 ,  C23C18/1678 ,  C23C18/1692 ,  C25D7/123 ,  C25D17/001 ,  C25D17/12 ,  C25D17/14 ,  H01L21/02063 ,  H01L21/02074 ,  H01L21/02087 ,  H01L21/0209 ,  H01L21/288 ,  H01L21/2885 ,  H01L21/3212 ,  H01L21/32134 ,  H01L21/67046 ,  H01L21/67051 ,  H01L21/6708 ,  H01L21/6715 ,  H01L21/67173 ,  H01L21/67184 ,  H01L21/6719 ,  H01L21/67219 ,  H01L21/67253 ,  H01L21/67742 ,  H01L21/76843 ,  H01L21/76849 ,  H01L21/76873 ,  H01L21/76877 ,  H01L2221/1089 ,  H05K3/423

公开(公告)号：EP1666639A4

公开(公告)日：2007-05-23

申请号：EP04771507

申请日：2004-08-04

Applicant: EBARA CORP

Inventor： OGURE NAOAKI ,  TSUJIMURA MANABU

IPC: C25B11/12 ,  C02F1/461

CPC classification number: C02F1/46109 ,  C02F1/46114 ,  C02F2001/46138 ,  C02F2001/46152 ,  C02F2101/308 ,  C02F2103/34 ,  Y10T29/49117

Abstract: [PROBLEMS] To provide an electrode that is stable in liquid and is capable of treating a large volume of liquid and a small electrode that is capable of treating a large volume of liquid at high speed; provide a liquid treating apparatus and method of liquid treatment in which the electrode is used; provide an electrode material being resistant to damaging by thermal stress; and provide an electrode, liquid treating apparatus and method of liquid treatment in which the electrode material is used. [MEANS FOR SOLVING PROBLEMS] An electrode of configuration resulting from first coating solid pieces of 5 to 60 mm size with conductive diamond, supporting them on supports and bringing the same into contact with each other so as to realize current passage as a whole is used in various electrochemical treatments. Also, use is made of an electrode comprising conductive substrate (1), coating layer (2) covering the conductive substrate and conductive diamond particles (3) immobilized on the coating layer characterized in that part of each of the conductive diamond particles is in contact with the conductive substrate while another part thereof is exposed on the surface of the coating layer. Further, use is made of an electrode material comprising a columnar or tubular substrate having its whole side surface coated with conductive diamond.

公开(公告)号：EP1179617A4

公开(公告)日：2007-01-24

申请号：EP00985856

申请日：2000-12-25

Applicant: EBARA CORP ,  TOSHIBA KK

Inventor： KUNISAWA JUNJI ,  ODAGAKI MITSUKO ,  MAKINO NATSUKI ,  MISHIMA KOJI ,  NAKAMURA KENJI ,  INOUE HIROAKI ,  KIMURA NORIO ,  MATSUDA TETSUO ,  KANEKO HISASHI ,  HAYASAKA NOBUO ,  OKUMURA KATSUYA ,  TSUJIMURA MANABU ,  MORITA TOSHIYUKI

IPC: C23C18/16 ,  C25D7/12 ,  C25D17/12 ,  C25D17/14 ,  H01L21/00 ,  H01L21/288 ,  H01L21/768 ,  H05K3/42

CPC classification number: H01L21/6719 ,  C25D7/123 ,  C25D17/001 ,  C25D17/12 ,  C25D17/14 ,  H01L21/2885 ,  H01L21/67046 ,  H01L21/67051 ,  H01L21/6708 ,  H01L21/6715 ,  H01L21/6723 ,  H01L21/76877 ,  H01L21/76879 ,  H01L2924/0002 ,  H05K3/423 ,  H01L2924/00

Abstract: An apparatus for plating a substrate by filling a fine interconnection pattern (recess) formed in a semiconductor substrate with a metal such as copper (Cu) comprises a substrate holding section (36) for horizontally holding and rotating a substrate so oriented that the surface to be plate faces up, a sealer (90) that comes into contact with the periphery of the surface to be plated of the held substrate to seal the periphery water-tightly, and a cathode (88) that comes into contact with the substrate to supply current thereto, and further comprises a cathode section (38) rotatable with the substrate holding section (36), an electrode arm section (30) provided horizontally and vertically movably above the cathode section (38) and having an anode (98) oriented down, and plating solution injecting means for injecting a plating solution into the space between the surface to be plated of the held substrate and the anode of the electrode arm section (30) brought near to the surface to be plated. Therefore, the processings including the plating and its collateral processings are carried out by means of a single unit. A method for plating a substrate is also disclosed.