公开(公告)号：DE60133306D1

公开(公告)日：2008-04-30

申请号：DE60133306

申请日：2001-01-22

Applicant: EBARA CORP

Inventor： KAMIMURA KENJI ,  KIMURA NORIO ,  OKAMURA SATOSHI ,  AIZAWA HIDEO ,  AKAGI MAKOTO ,  TOKUSHIGE KATSUHIKO ,  MATSUO HISANORI ,  TSUJIMURA MANABU

IPC: B24B53/00 ,  B24B53/007 ,  B24B53/017 ,  H01L21/306

Abstract: The present invention relates to a polishing apparatus for polishing a workpiece, such as a semiconductor wafer, to a flat mirror finish. The polishing apparatus comprises a polishing table having a polishing surface, and a top ring, and the workpiece is interposed between the polishing table and the top ring and pressed at a predetermined pressure to polish the workpiece. The polishing apparatus comprises at least two dressing units for dressing the polishing surface by being brought into contact with the polishing surface, which is a surface of a polishing cloth.

公开(公告)号：DE60133306T2

公开(公告)日：2009-03-05

申请号：DE60133306

申请日：2001-01-22

Applicant: EBARA CORP

Inventor： KAMIMURA KENJI ,  KIMURA NORIO ,  OKAMURA SATOSHI ,  AIZAWA HIDEO ,  AKAGI MAKOTO ,  TOKUSHIGE KATSUHIKO ,  MATSUO HISANORI ,  TSUJIMURA MANABU

IPC: B24B53/00 ,  B24B53/007 ,  B24B53/017 ,  H01L21/306

Abstract: The present invention relates to a polishing apparatus for polishing a workpiece, such as a semiconductor wafer, to a flat mirror finish. The polishing apparatus comprises a polishing table having a polishing surface, and a top ring, and the workpiece is interposed between the polishing table and the top ring and pressed at a predetermined pressure to polish the workpiece. The polishing apparatus comprises at least two dressing units for dressing the polishing surface by being brought into contact with the polishing surface, which is a surface of a polishing cloth.

公开(公告)号：EP1334802A4

公开(公告)日：2005-08-31

申请号：EP01901492

申请日：2001-01-22

Applicant: EBARA CORP

Inventor： KAMIMURA KENJI ,  KIMURA NORIO ,  OKAMURA SATOSHI ,  AIZAWA HIDEO ,  AKAGI MAKOTO ,  TOKUSHIGE KATSUHIKO ,  MATSUO HISANORI ,  TSUJIMURA MANABU

IPC: B24B53/00 ,  B24B53/007 ,  B24B53/017 ,  H01L21/306 ,  B24B37/04

CPC classification number: B24B53/017 ,  B24B29/005 ,  B24B53/003 ,  H01L21/30625

Abstract: The invention relates to a polisher for polishing a workpiece, such as a semiconductor wafer, so that it may have a flat mirror finish. The polisher comprises a polisher table (1) with a polishing face, and a top ring (3). A workpiece is placed between the polisher table (1) and the top ring (3) and polished by application of a predetermined pressure. The polisher includes at least two dressing units equipped with dressers (7, 11) that are in contact with the surface of polishing cloth to dress the polishing face.

Abstract translation: 本发明涉及一种用于抛光诸如半导体晶片的工件的抛光器，以使其可以具有平坦的镜面抛光。 抛光机包括具有抛光面的抛光机台（1）和顶环（3）。 将工件放置在抛光机台（1）和顶环（3）之间并通过施加预定压力抛光。 该抛光机包括至少两个配备有修整器（7,11）的修整单元，修整器（7,11）与抛光布的表面接触以修整抛光面。

公开(公告)号：JP2002200552A

公开(公告)日：2002-07-16

申请号：JP2001009536

申请日：2001-01-17

Applicant: EBARA CORP

Inventor： OKAMURA SATOSHI ,  AIZAWA HIDEO ,  AKAGI MAKOTO ,  TOKUSHIGE KATSUHIKO ,  MATSUO NAONORI ,  TSUJIMURA MANABU

IPC: B24B53/00 ,  B24B53/017 ,  B24B53/02 ,  B24B55/06 ,  H01L21/304 ,  B24B37/00

Abstract: PROBLEM TO BE SOLVED: To provide a polishing device capable of carrying out polishing according to the distribution of the thickness of the film formed on the surface of the workpiece such as a semiconductor wafer and obtaining uniformity of the film thickness after polishing. SOLUTION: The polishing device for polishing a semiconductor wafer W, which is a workpiece, pressed against the polishing face of a polishing table 11 is provided with a dresser 39 for dressing the polishing face of the polishing table 11, a rocking motor 36 for moving the dresser 39 on the polishing face of the polishing table 11, a control device 50, which controls the speed of the motion of the dresser 39 caused by the rocking motor 36 according to the thickness of a film to be polished at a specified position in the region in the polishing face used for polishing a specified position in the polished face of the semiconductor wafer W.

公开(公告)号：JP2010129704A

公开(公告)日：2010-06-10

申请号：JP2008301738

申请日：2008-11-26

Applicant: Ebara Corp ,  株式会社荏原製作所

Inventor： OKAMURA SATOSHI ,  KADOWAKI TOMOO ,  EZAKI KAZUAKI

IPC: H01L21/304

Abstract: PROBLEM TO BE SOLVED: To provide an adjusting method of inter-roll gap of a substrate processing apparatus which can be installed with suitable pressing amount between a first roll and a second roll by accurately detecting positions where the first roll and second roll come into contact with a substrate.
SOLUTION: A substrate jig 50, a first roll jig 40-1 and a second roll jig 40-2 are prepared, and an outer periphery of the substrate jig 50 is inserted into a circumferential groove 12a of a head 12 to be supported. The second roll jig is positioned through position adjustment so that the gap between a reverse surface of the substrate jig 50 and the second roll jig 40-2 has a predetermined value, the first roll jig 40-1 is opposed to the second roll jig 40-2, and the first roll jig is positioned through position adjustment so that the gap between the second roll jig and the first roll jig has a predetermined value. Then the first roll is held by a first roll rotating mechanism 17 holding the first roll jig 40-1 and the second roll is held by a second roll rotating mechanism 18 holding the second roll jig 40-2.
COPYRIGHT: (C)2010,JPO&INPIT

Abstract translation: 要解决的问题：为了提供基板处理装置的辊间间隙的调整方法，其可以通过精确地检测第一辊和第二辊的位置而在第一辊和第二辊之间安装合适的挤压量 与基材接触。 解决方案：制备基板夹具50，第一辊夹具40-1和第二辊夹具40-2，将基板夹具50的外周插入头部12的周向槽12a中 支持的。 第二辊夹具通过位置调节定位，使得基板夹具50的反面与第二辊夹具40-2之间的间隙具有预定值，第一辊夹具40-1与第二辊夹具40相对 -2，并且第一辊夹具通过位置调整定位，使得第二辊夹具和第一辊夹具之间的间隙具有预定值。 然后，第一辊由保持第一辊夹具40-1的第一辊旋转机构17保持，并且第二辊由保持第二辊夹具40-2的第二辊旋转机构18保持。 版权所有（C）2010，JPO＆INPIT

公开(公告)号：JP2003133277A

公开(公告)日：2003-05-09

申请号：JP2001332710

申请日：2001-10-30

Applicant: EBARA CORP

Inventor： TORII HIROOMI ,  AIZAWA HIDEO ,  OKAMURA SATOSHI

IPC: B24B55/06 ,  B24B53/017 ,  H01L21/304 ,  B24B37/00

Abstract: PROBLEM TO BE SOLVED: To provide an apparatus for cleaning the polishing surface of a polishing apparatus which prevents foreign particles removed from the polishing surface of a polishing table from being deposited and adhered to the inner wall of a cover that is attached in such a manner to surround injection nozzles of the polishing surface cleaning apparatus of atomizer system. SOLUTION: The apparatus for cleaning the polishing surface of the polishing apparatus in which mixed fluids 14 comprising cleaning liquid and gas are injected from the injection nozzles 7-1 to 7-4 to the polishing surface of the polishing apparatus which presses an object to be polished to the polishing surface of the polishing table (top surface of a polishing cloth 2) to polish the object to be polished by relative motions of the polishing surface and the object to be polished, wherein a cover 12 is provided that surrounds a predetermined outer region ranging from front ends the injection nozzles to the polishing surface where the mixed fluids are injected, and a space adjustment mechanism 13 is provided for adjusting a space between the front end of the cover and the polishing surface.

公开(公告)号：JP2002079461A

公开(公告)日：2002-03-19

申请号：JP2000271761

申请日：2000-09-07

Applicant: EBARA CORP

Inventor： TORII HIROOMI ,  AIZAWA HIDEO ,  OKAMURA SATOSHI ,  ISOBE SOICHI

IPC: B24B37/30 ,  B24B53/017 ,  B24B53/02 ,  B24B53/12 ,  B24B55/06 ,  H01L21/304 ,  B24B37/04 ,  B24B37/00

Abstract: PROBLEM TO BE SOLVED: To provide a polishing device that can improve the polishing quality of a polished object by easily and reliably removing polishing dust and polishing liquid that adhere to a top ring and a dresser to cause a scratch. SOLUTION: The polishing device comprises a polishing table 11 with an abrasive surface, a top ring 23 for pressing a semiconductor wafer W on the abrasive surface of the polishing table 11, a dresser 33 for dressing the abrasive surface of the polishing table 11, and cleaning devices 14 and 18 for cleaning the top ring 23 and the dresser 33. The surfaces of the top ring 23 and the dresser 33 are coated with a fluororesin.