公开(公告)号：US20240342854A1

公开(公告)日：2024-10-17

申请号：US18294730

申请日：2022-07-04

Applicant: EBARA CORPORATION

Inventor： Hiroki NAKAMURA ,  Yuta SUZUKI ,  Yusuke WATANABE ,  Michiaki MATSUDA ,  Koki YAMAMOTO ,  Taro TAKAHASHI

IPC: B24B37/013 ,  B24B49/00 ,  B24B49/04

CPC classification number: B24B37/013 ,  B24B49/003 ,  B24B49/045

Abstract: To accurately detect a polishing end point even if a change in a polishing frictional force is small. A polishing apparatus includes a polishing table for holding a polishing pad, a holder for holding a polishing target object such that the polishing target object faces the polishing pad, and an end point detector that detects, based on a signal indicating a state of polishing of the polishing target object by the polishing pad, a polishing end point indicating an end of the polishing. The end point detector is configured to remove noise of the signal, exponentiate the signal subjected to the noise removal with an exponent greater than 1, and detect the polishing end point based on the exponentiated signal.