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公开(公告)号：US20190131150A1
公开(公告)日：2019-05-02
申请号：US16175445
申请日：2018-10-30
Applicant: EBARA CORPORATION
Inventor： Yuta SUZUKI , Taro TAKAHASHI
IPC: H01L21/67 , B24B29/04 , B24B49/10 , B24B37/013 , B24B37/10 , H01L21/306
Abstract: A current detection section detects a current value of a swing shaft motor 14 and generates a first output. A first processing section obtains a contact pressure corresponding to the first output from the first output using first data indicating a correspondence relationship between a contact pressure applied to a semiconductor wafer by a top ring and the first output. A second processing section obtains a second output corresponding to a contact pressure obtained by the first processing section using second data indicating a correspondence relationship between the contact pressure obtained by the first processing section and the second output.
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公开(公告)号：US20170282325A1
公开(公告)日：2017-10-05
申请号：US15508034
申请日：2015-08-27
Applicant: EBARA CORPORATION
Inventor： Taro TAKAHASHI , Yuta SUZUKI
IPC: B24B37/013
Abstract: An end point detection method is provided for detecting an end point based on a drive current supplied to a drive unit that rotates and drives one of a polishing table and a holding unit. The end point detection method includes: a step (S102) of determining whether a polishing condition of a polishing process to be executed coincides with a preset specific polishing condition; a step (S103) of adjusting a current control parameter in a drive control unit that controls the drive current, the current control parameter related to a change in the drive current with respect to a change in a driving load of the drive unit, if it is determined that the polishing condition coincides with the specific polishing condition; and a step (S105) of detecting the drive current supplied to the drive unit based on the adjusted current control parameter.
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公开(公告)号：US20240210353A1
公开(公告)日：2024-06-27
申请号：US18545448
申请日：2023-12-19
Applicant: EBARA CORPORATION
Inventor： Taro TAKAHASHI , Shinpei TOKUNAGA
CPC classification number: G01N27/9006 , G01N27/023 , G01N27/9046 , H01L22/12
Abstract: The eddy current sensor includes a first detector that detects an eddy current generated in a semiconductor wafer WH and a second detector that detects the eddy current. The first detector includes a first exciting coil configured to generate the eddy current and a first detecting coil configured to detect the eddy current. The first exciting coil and the first detecting coil are air-core coils. The second detector includes second exciting coil configured to generate the eddy current and second detecting coil configured to detect the eddy current. The second exciting coil and the second detecting coil are coils with a magnetic core.
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4.发明公开公开(公告)号：US20240077297A1
公开(公告)日：2024-03-07
申请号：US18504301
申请日：2023-11-08
Applicant: EBARA CORPORATION
Inventor： Hiroto YAMADA , Taro TAKAHASHI , Hiroaki SHIBUE , Atsushi ABE , Shinpei TOKUNAGA
CPC classification number: G01B7/105 , H01L21/67253
Abstract: An eddy current sensor assembly includes an eddy current sensor and an output signal processing circuit that processes an output signal from the eddy current sensor. The output signal processing circuit includes a mixer circuit that accepts the output signal and a signal of the predetermined frequency as input, multiplies the two signals received as input, and outputs an output signal obtained by the multiplication, and a low-pass filter that accepts the output signal output by the mixer circuit as input, cuts a high-frequency signal included in the output signal received as input, and outputs at least a direct-current (DC) signal.
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公开(公告)号：US20220063056A1
公开(公告)日：2022-03-03
申请号：US17410099
申请日：2021-08-24
Applicant: EBARA CORPORATION
Inventor： Atsushi ABE , Taro TAKAHASHI , Hiroaki SHIBUE , Shinpei TOKUNAGA , Katsuhide WATANABE
Abstract: An eddy current sensor has an exciting coil and a detection coil. A holding circuit holds reference data indicating a characteristic of an output signal output from the detection coil at a reference state and outputs the reference data at a state other than the reference state. A pseudo signal generating circuit generates and outputs a balance coil pseudo signal corresponding to the output signal output from the detection coil at the reference state from the reference data output from the holding circuit. A bridge circuit, at the state other than the reference state, receives the output signal output from the detection coil and the balance coil pseudo signal and outputs a bridge output signal corresponding to a difference between the output signal and the balance coil pseudo signal as a bridge output signal.
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Patent Agency Ranking
公开(公告)号：US20190168355A1
公开(公告)日：2019-06-06
申请号：US16207958
申请日：2018-12-03
Applicant: EBARA CORPORATION
Inventor： Yuta SUZUKI , Taro TAKAHASHI
IPC: B24B37/10 , B24B37/013 , B24B49/10 , H01L21/304
Abstract: A polishing pad is held using a polishing table. The polishing table is driven to rotate using a first electric motor. The top ring for holding a semiconductor wafer and pressing the top ring against a polishing pad is driven to rotate by a top ring motor. The top ring is held by the swing arm. The swing arm is made to swing around a swing center on the swing arm by a swing shaft motor. A first output is generated by detecting a current value of the swing shaft motor. While polishing the semiconductor wafer by causing the semiconductor wafer to swing around the swing center on the swing arm, a change of a frictional force between the polishing pad and the semiconductor wafer is detected by increasing a change amount of the first output.
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公开(公告)号：US20170259394A1
公开(公告)日：2017-09-14
申请号：US15438505
申请日：2017-02-21
Applicant: EBARA CORPORATION
Inventor： Taro TAKAHASHI , Akira NAKAMURA , Hiroaki SHIBUE , Mitsuo TADA
IPC: B24B37/013 , H01L21/304 , H01L21/67 , B24B37/20 , B24B37/30
CPC classification number: B24B37/013 , B24B37/20 , B24B37/30 , H01L21/304 , H01L21/67092 , H01L22/14 , H01L22/26
Abstract: An end-point detection sensor 50 detects an end point of polishing, the end-point detection sensor 50 being arranged in a polishing table 100. The end-point detection sensor 50 has a pot core. The pot core 60 has a bottom portion 61a, a magnetic core base portion 61b and a peripheral wall base portion 61c. The end-point detection sensor 50 has an exciting coil 62, and a detection coil 63. The back surface 101b of the polishing pad 101 has a space 30 which is arranged at a portion facing the polishing table 100 and houses a magnetic core extension portion 8 and a peripheral wall extension portion 11. The magnetic core extension portion 8 and the peripheral wall extension portion 11 extending to the space 30 are located in the space 30.
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公开(公告)号：US20160121452A1
公开(公告)日：2016-05-05
申请号：US14925063
申请日：2015-10-28
Applicant: EBARA CORPORATION
Inventor： Taro TAKAHASHI
IPC: B24B37/015
CPC classification number: B24B37/015
Abstract: A polishing apparatus capable of polishing a substrate while accurately measuring a temperature at a desired measuring point near a surface of the substrate is disclosed. The polishing apparatus includes: a polishing pad having a polishing surface for polishing a substrate; a polishing table supporting the polishing pad; a table motor configured to rotate the polishing table; a polishing head configured to press a surface of the substrate against the polishing surface of the polishing pad; a polishing liquid supply nozzle configured to supply a polishing liquid onto the polishing surface of the polishing pad; and a temperature sensor mounted to the polishing table. The temperature sensor is located so as to move across the surface of the substrate each time the polishing table makes one revolution.
Abstract translation: 公开了一种抛光装置，其能够在精确测量基板表面附近的期望测量点处的温度的同时抛光基板。 抛光装置包括：抛光垫，其具有用于抛光基板的抛光表面; 支撑抛光垫的抛光台; 配置为旋转所述抛光台的工作台马达; 抛光头，其构造成将所述基板的表面压靠在抛光垫的抛光表面上; 抛光液供给喷嘴，其构造成将研磨液供给到所述研磨垫的研磨面上; 和安装在抛光台上的温度传感器。 每当抛光台转一圈时，温度传感器就位于基板的表面上。
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公开(公告)号：US20240300068A1
公开(公告)日：2024-09-12
申请号：US18589145
申请日：2024-02-27
Applicant: EBARA CORPORATION
Inventor： Hiroto YAMADA , Taro TAKAHASHI
CPC classification number: B24B49/04 , B24B49/105 , B24B49/16
Abstract: A polishing apparatus includes a polishing table with a polishing pad for polishing a film formed on a semiconductor wafer. The polishing apparatus includes a first sensor that outputs a first signal corresponding to the film thickness of the film and a second sensor that is more sensitive than the first sensor and that outputs a second signal corresponding to the film thickness of the film. When the film thickness of the film is equal to or less than a predetermined film thickness, the film thickness detector detects the film thickness of the film according to a second signal. When the film is thicker than the predetermined film thickness, the film thickness detector detects the film thickness of the film according to the first signal and the second signal.
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公开(公告)号：US20230194477A1
公开(公告)日：2023-06-22
申请号：US18080510
申请日：2022-12-13
Applicant: EBARA CORPORATION
Inventor： Yuta SUZUKI , Taro TAKAHASHI
CPC classification number: G01N29/12 , G01H1/06 , G01N29/30 , B24B37/34 , B24B49/003
Abstract: A method in which an acoustic sensor disposed in a polishing apparatus can be accurately calibrated is disclosed. In this method, polishing sounds of a substrate are acquired using an acoustic sensor; and then at least two distinctive sounds, having distinctive frequencies respectively, are selected from the acquired polishing sounds. Further, the at least two distinctive sounds are output from a sound source coupled to any of a polishing table, the acoustic sensor, and a substrate holder to cause the at least two distinctive sounds to be input to the acoustic sensor. Next, output values of the acoustic sensor are calibrated, such that the output values of the acoustic sensor relative to the at least two distinctive sounds come within an allowable range.
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