公开(公告)号：US20150290769A1

公开(公告)日：2015-10-15

申请号：US14682477

申请日：2015-04-09

Applicant: EBARA CORPORATION

Inventor： Hideo AIZAWA ,  Tadakazu SONE ,  Masao UMEMOTO ,  Ryuichi KOSUGE

IPC: B24B57/02 ,  B24B37/10

CPC classification number: B24B57/02 ,  B24B37/10 ,  B24B37/107

Abstract: The invention suppresses generation of noises attributable to rotation of a rotary joint.A rotary joint 160 includes a rotating body 1600 that rotates on a rotating axis A, a housing 1620 disposed so as to surround the rotating body 1600, and at least one bearing 1630 disposed between the rotating body 1600 and the housing 1620 and adapted to support rotation of the rotating body 1600. The rotary joint 160 supplies fluids through fluid connection ports formed in the housing 1620 and fluid passages formed inside the rotating body 1600 to a polishing table having attached thereto a polishing pad for polishing a substrate or a holding portion that is adapted to hold the substrate while pressing the substrate against the polishing pad. At least one elastic member 1640 is interposed at least either between the rotating body 1600 and the at least one bearing 1630 or between the housing 1620 and the at least one bearing 1630.

Abstract translation: 本发明抑制由旋转接头的旋转引起的噪声的产生。 旋转接头160包括在旋转轴线A上旋转的旋转体1600，围绕旋转体1600设置的壳体1620以及设置在旋转体1600与壳体1620之间的至少一个轴承1630，并且适于支撑 旋转接头160通过形成在壳体1620中的流体连接端口和形成在旋转体1600内部的流体通道提供流体到具有附着到其上的抛光台，抛光台用于抛光基板或保持部分 适于在将衬底压靠在抛光垫上的同时保持衬底。 至少一个弹性构件1640至少插入在旋转体1600和至少一个轴承1630之间或壳体1620和至少一个轴承1630之间。

公开(公告)号：US20140162536A1

公开(公告)日：2014-06-12

申请号：US14067723

申请日：2013-10-30

Applicant: EBARA CORPORATION

Inventor： Masao UMEMOTO ,  Tadakazu SONE ,  Hideo AIZAWA ,  Ryuichi KOSUGE ,  Masaaki ERIGUCHI

IPC: B24B53/017 ,  B24B37/32 ,  B24B37/10

CPC classification number: B24B53/017 ,  B24B37/04

Abstract: A polishing apparatus includes: a rotatable polishing table for supporting a polishing pad having a polishing surface; a top ring head having a top ring; a top ring head cover surrounding the top ring head; a dresser head having a dresser configured to dress the polishing surface; a dresser head cover surrounding the dresser head; a spray nozzle configured to spray a cleaning liquid onto an upper surface of the top ring and an outer surface of the top ring head cover when the top ring is in the substrate transfer position; and a spray nozzle configured to spray a cleaning liquid onto an outer surface of the dresser head cover when the dresser is in the retreated position.

Abstract translation: 抛光装置包括：可旋转抛光台，用于支撑具有抛光表面的抛光垫; 具有顶环的顶环头; 围绕顶环头部的顶环头盖; 修整器头部具有修整器，该修整器构造成用来装饰抛光表面; 围绕梳妆台头的梳妆台头罩; 喷嘴，其构造成当所述顶环处于所述基板转移位置时，将清洗液喷射到所述顶环的上表面和所述顶环头盖的外表面; 以及喷雾喷嘴，其构造成当所述修整器处于退避位置时将清洁液体喷射到所述修整器盖罩的外表面上。

公开(公告)号：US20160008948A1

公开(公告)日：2016-01-14

申请号：US14792062

申请日：2015-07-06

Applicant: EBARA CORPORATION

Inventor： Hideo AIZAWA ,  Masao UMEMOTO ,  Tadakazu SONE ,  Ryuichi KOSUGE

IPC: B24B37/015 ,  B24B37/10

CPC classification number: B24B37/015 ,  B24B37/04 ,  B24B37/107

Abstract: A polishing apparatus which can continue stable operation of the apparatus without generating torsional vibration in a rotary joint and without generating an abnormal sound at an engagement part between a cooling water pipe and a polishing table is disclosed. The polishing apparatus includes a rotary joint fixed to a rotating part of the polishing table or a rotating part of the top ring to supply a fluid into the polishing table or the top ring and discharge the fluid from the polishing table or the top ring, and a rotation-prevention mechanism which connects the rotary joint with an apparatus frame to prevent the rotary joint from being rotated. The rotation-prevention mechanism includes a link mechanism having at least one spherical plain bearing.

Abstract translation: 公开了一种可以在不在旋转接头中产生扭转振动并且在冷却水管和抛光台之间的接合部分处不产生异常声音的情况下继续稳定操作设备的抛光装置。 抛光装置包括固定到抛光台的旋转部分或顶环的旋转部分的旋转接头，以将流体供应到抛光台或顶环中并从抛光台或顶环排出流体，以及 旋转防止机构，其将旋转接头与装置框架连接以防止旋转接头旋转。 旋转防止机构包括具有至少一个球面滑动轴承的连杆机构。

公开(公告)号：US20140080385A1

公开(公告)日：2014-03-20

申请号：US14030718

申请日：2013-09-18

Applicant: EBARA CORPORATION

Inventor： Masao UMEMOTO ,  Tadakazu SONE ,  Hideo AIZAWA ,  Ryuichi KOSUGE

IPC: B24B37/34

CPC classification number: B24B37/34 ,  B24B37/30

Abstract: A polishing apparatus is used for polishing and planarizing a surface of a substrate such as a semiconductor wafer. The polishing apparatus includes a polishing table having a polishing surface, and a top ring configured to hold a substrate and press the substrate against the polishing surface. The top ring has an extendable and contractable connection sheet configured to cover a gap between a retainer ring guide fixed to a top ring body and a retainer ring guided by the retainer ring guide to move vertically. The polishing apparatus has a nozzle configured to eject a cleaning liquid in a horizontal direction toward the connection sheet and apply a flow of the cleaning liquid directly onto the connection sheet for cleaning the connection sheet.

Abstract translation: 抛光装置用于抛光和平面化诸如半导体晶片的基板的表面。 抛光装置包括具有抛光表面的抛光台和构造成保持基板并将基板压靠在抛光表面上的顶环。 顶环具有可延伸和可收缩的连接片，其构造成覆盖固定到顶环主体的保持环导向件和由保持器环引导件引导的保持环之间的间隙，以垂直移动。 抛光装置具有：喷嘴，被配置为朝向连接片向水平方向喷出清洗液，并将清洗液的流动直接施加到连接片上，以清洁连接片。

公开(公告)号：US20130240000A1

公开(公告)日：2013-09-19

申请号：US13789733

申请日：2013-03-08

Applicant: EBARA CORPORATION

Inventor： Hideo AIZAWA ,  Tadakazu SONE ,  Masao UMEMOTO

IPC: B08B3/14

CPC classification number: B08B3/14 ,  B01D19/0057 ,  B04C2003/006 ,  B24B57/02

Abstract: A gas-liquid separator separates gas-liquid two-phase flow into a gas and a liquid. The gas-liquid separator includes: a container having a bottom and a side portion, the bottom having a liquid discharge outlet and the side portion having a gas discharge outlet; a gas-liquid introduction pipe for introducing a gas-liquid two-phase flow into the container, the gas-liquid introduction pipe extending downward from above the container and having a lower end located in an interior of the container, the gas discharge outlet of the container being located above the lower end of the gas-liquid introduction pipe; and a guide device disposed in the gas-liquid introduction pipe and configured so as to impart a swirling motion to the gas-liquid two-phase flow in the gas-liquid introduction pipe.

Abstract translation: 气液分离器将气液两相流分离成气体和液体。 气液分离器包括：具有底部和侧部的容器，底部具有液体排出口，侧部具有气体排出口; 用于将气液两相流引入容器的气液引入管，气液导入管从容器的上方向下方延伸，下端位于容器的内部，气体排出口 所述容器位于所述气液导入管的下端的上方; 以及引导装置，其设置在所述气液导入管中，并且构成为对所述气液导入管内的气液二相流赋予旋转运动。

公开(公告)号：US20190351526A1

公开(公告)日：2019-11-21

申请号：US16408960

申请日：2019-05-10

Applicant: Ebara Corporation

Inventor： Masao UMEMOTO ,  Ryuichi KOSUGE ,  Shuichi KAMATA ,  Kento YOSHIDA

IPC: B24B49/16 ,  B24B37/27 ,  B24B37/005

Abstract: A method capable of accurately detecting a polishing surface of a polishing pad using a polishing head without being influenced by passage of time is disclosed. The includes: moving a polishing head in a direction perpendicular to a polishing surface of a polishing pad while applying thrust from the polishing head to the polishing pad; during the movement of the polishing head, detecting deflection of a head arm with a strain sensor, the head arm supporting the polishing head; and determining a position of the polishing head corresponding to a point in time at which an output signal from the strain sensor reaches a preset threshold value.

公开(公告)号：US20140213158A1

公开(公告)日：2014-07-31

申请号：US14167941

申请日：2014-01-29

Applicant: EBARA CORPORATION

Inventor： Masao UMEMOTO ,  Tadakazu SONE ,  Ryuichi KOSUGE ,  Hideo AIZAWA

IPC: B24B37/34

CPC classification number: B24B37/34 ,  B24B37/105 ,  B24B53/017

Abstract: A polishing apparatus is used for polishing a substrate such as a semiconductor. The polishing apparatus includes a polishing table configured to hold a polishing tool having a polishing surface, a polishing head having a top ring configured to press a substrate against the polishing surface, and a polishing head cover configured to cover the polishing head. The polishing apparatus further includes a first cleaning liquid supply mechanism configured to supply a cleaning liquid to an outer surface of the polishing head cover, and a second cleaning liquid supply mechanism configured to supply a cleaning liquid to an inner surface of the polishing head cover.

Abstract translation: 抛光装置用于抛光诸如半导体的衬底。 抛光装置包括：抛光台，其被配置为保持具有抛光表面的抛光工具;抛光头，其具有被配置为将基板压靠在抛光表面上的顶环;以及抛光头盖，其构造成覆盖抛光头。 抛光装置还包括：第一清洗液供给机构，其构造成将清洗液供给到研磨头盖的外表面;第二清洗液供给机构，其构造成将清洗液供给到研磨头罩的内表面。