公开(公告)号：US20150314418A1

公开(公告)日：2015-11-05

申请号：US14699075

申请日：2015-04-29

Applicant: EBARA CORPORATION

Inventor： Hiroyuki SHINOZAKI ,  Hiroshi AONO ,  Tadakazu SONE ,  Kenji SHINKAI ,  Hideo AIZAWA

IPC: B24B55/12 ,  B24B37/34

Abstract: A substrate polishing apparatus includes a polishing table 30 having a polishing surface 10 in the upper surface, a substrate holding portion 31 that holds a substrate W having a surface to be polished in the lower surface, and a holding portion cover 36 that covers the outer side of the substrate holding portion 31. Between the lower portion of the holding portion cover 36 and the upper surface of the polishing table 30, a gap portion for intake 37 is provided, and in the upper portion of the holding portion cover 36, a pipe for exhaust 39 connected to an exhaust mechanism 38 is provided. By operating the exhaust mechanism 38, a rising air current from the gap portion 37 toward the pipe 39 is formed between the outer surface of the substrate holding portion 31 and the inner surface of the holding portion cover 36.

Abstract translation: 基板研磨装置具备：上表面具有研磨面10的研磨台30，在下表面保持具有被研磨面的基板W的基板保持部31;以及覆盖外侧的保持部覆盖部36 在保持部盖36的下部与研磨台30的上表面之间，设置有用于吸入口37的间隙部，在保持部罩36的上部设有 设置有与排气机构38连接的排气管39。 通过操作排气机构38，在基板保持部31的外表面和保持部盖36的内表面之间形成有从间隙部37向管39的上升气流。

公开(公告)号：US20150290769A1

公开(公告)日：2015-10-15

申请号：US14682477

申请日：2015-04-09

Applicant: EBARA CORPORATION

Inventor： Hideo AIZAWA ,  Tadakazu SONE ,  Masao UMEMOTO ,  Ryuichi KOSUGE

IPC: B24B57/02 ,  B24B37/10

CPC classification number: B24B57/02 ,  B24B37/10 ,  B24B37/107

Abstract: The invention suppresses generation of noises attributable to rotation of a rotary joint.A rotary joint 160 includes a rotating body 1600 that rotates on a rotating axis A, a housing 1620 disposed so as to surround the rotating body 1600, and at least one bearing 1630 disposed between the rotating body 1600 and the housing 1620 and adapted to support rotation of the rotating body 1600. The rotary joint 160 supplies fluids through fluid connection ports formed in the housing 1620 and fluid passages formed inside the rotating body 1600 to a polishing table having attached thereto a polishing pad for polishing a substrate or a holding portion that is adapted to hold the substrate while pressing the substrate against the polishing pad. At least one elastic member 1640 is interposed at least either between the rotating body 1600 and the at least one bearing 1630 or between the housing 1620 and the at least one bearing 1630.

Abstract translation: 本发明抑制由旋转接头的旋转引起的噪声的产生。 旋转接头160包括在旋转轴线A上旋转的旋转体1600，围绕旋转体1600设置的壳体1620以及设置在旋转体1600与壳体1620之间的至少一个轴承1630，并且适于支撑 旋转接头160通过形成在壳体1620中的流体连接端口和形成在旋转体1600内部的流体通道提供流体到具有附着到其上的抛光台，抛光台用于抛光基板或保持部分 适于在将衬底压靠在抛光垫上的同时保持衬底。 至少一个弹性构件1640至少插入在旋转体1600和至少一个轴承1630之间或壳体1620和至少一个轴承1630之间。

公开(公告)号：US20190299360A1

公开(公告)日：2019-10-03

申请号：US16366546

申请日：2019-03-27

Applicant: EBARA CORPORATION

Inventor： Tadakazu SONE ,  Ryuichi KOSUGE ,  Kenji SHINKAI ,  Hiroshi AONO ,  Hideo AIZAWA

IPC: B24B57/00 ,  B24B37/24 ,  B24B37/22

Abstract: A polishing apparatus includes a polishing table supplied with liquid on a upper surface and rotating around a central axis, a liquid receiver having an annular shape and disposed below a peripheral portion of the polishing table, and a drain member having a tubular shape, attached to a peripheral portion of the polishing table, and including a lower end portion extending toward the liquid receiver.

公开(公告)号：US20140080385A1

公开(公告)日：2014-03-20

申请号：US14030718

申请日：2013-09-18

Applicant: EBARA CORPORATION

Inventor： Masao UMEMOTO ,  Tadakazu SONE ,  Hideo AIZAWA ,  Ryuichi KOSUGE

IPC: B24B37/34

CPC classification number: B24B37/34 ,  B24B37/30

Abstract: A polishing apparatus is used for polishing and planarizing a surface of a substrate such as a semiconductor wafer. The polishing apparatus includes a polishing table having a polishing surface, and a top ring configured to hold a substrate and press the substrate against the polishing surface. The top ring has an extendable and contractable connection sheet configured to cover a gap between a retainer ring guide fixed to a top ring body and a retainer ring guided by the retainer ring guide to move vertically. The polishing apparatus has a nozzle configured to eject a cleaning liquid in a horizontal direction toward the connection sheet and apply a flow of the cleaning liquid directly onto the connection sheet for cleaning the connection sheet.

Abstract translation: 抛光装置用于抛光和平面化诸如半导体晶片的基板的表面。 抛光装置包括具有抛光表面的抛光台和构造成保持基板并将基板压靠在抛光表面上的顶环。 顶环具有可延伸和可收缩的连接片，其构造成覆盖固定到顶环主体的保持环导向件和由保持器环引导件引导的保持环之间的间隙，以垂直移动。 抛光装置具有：喷嘴，被配置为朝向连接片向水平方向喷出清洗液，并将清洗液的流动直接施加到连接片上，以清洁连接片。

公开(公告)号：US20130240000A1

公开(公告)日：2013-09-19

申请号：US13789733

申请日：2013-03-08

Applicant: EBARA CORPORATION

Inventor： Hideo AIZAWA ,  Tadakazu SONE ,  Masao UMEMOTO

IPC: B08B3/14

CPC classification number: B08B3/14 ,  B01D19/0057 ,  B04C2003/006 ,  B24B57/02

Abstract: A gas-liquid separator separates gas-liquid two-phase flow into a gas and a liquid. The gas-liquid separator includes: a container having a bottom and a side portion, the bottom having a liquid discharge outlet and the side portion having a gas discharge outlet; a gas-liquid introduction pipe for introducing a gas-liquid two-phase flow into the container, the gas-liquid introduction pipe extending downward from above the container and having a lower end located in an interior of the container, the gas discharge outlet of the container being located above the lower end of the gas-liquid introduction pipe; and a guide device disposed in the gas-liquid introduction pipe and configured so as to impart a swirling motion to the gas-liquid two-phase flow in the gas-liquid introduction pipe.

Abstract translation: 气液分离器将气液两相流分离成气体和液体。 气液分离器包括：具有底部和侧部的容器，底部具有液体排出口，侧部具有气体排出口; 用于将气液两相流引入容器的气液引入管，气液导入管从容器的上方向下方延伸，下端位于容器的内部，气体排出口 所述容器位于所述气液导入管的下端的上方; 以及引导装置，其设置在所述气液导入管中，并且构成为对所述气液导入管内的气液二相流赋予旋转运动。

公开(公告)号：US20160008948A1

公开(公告)日：2016-01-14

申请号：US14792062

申请日：2015-07-06

Applicant: EBARA CORPORATION

Inventor： Hideo AIZAWA ,  Masao UMEMOTO ,  Tadakazu SONE ,  Ryuichi KOSUGE

IPC: B24B37/015 ,  B24B37/10

CPC classification number: B24B37/015 ,  B24B37/04 ,  B24B37/107

Abstract: A polishing apparatus which can continue stable operation of the apparatus without generating torsional vibration in a rotary joint and without generating an abnormal sound at an engagement part between a cooling water pipe and a polishing table is disclosed. The polishing apparatus includes a rotary joint fixed to a rotating part of the polishing table or a rotating part of the top ring to supply a fluid into the polishing table or the top ring and discharge the fluid from the polishing table or the top ring, and a rotation-prevention mechanism which connects the rotary joint with an apparatus frame to prevent the rotary joint from being rotated. The rotation-prevention mechanism includes a link mechanism having at least one spherical plain bearing.

Abstract translation: 公开了一种可以在不在旋转接头中产生扭转振动并且在冷却水管和抛光台之间的接合部分处不产生异常声音的情况下继续稳定操作设备的抛光装置。 抛光装置包括固定到抛光台的旋转部分或顶环的旋转部分的旋转接头，以将流体供应到抛光台或顶环中并从抛光台或顶环排出流体，以及 旋转防止机构，其将旋转接头与装置框架连接以防止旋转接头旋转。 旋转防止机构包括具有至少一个球面滑动轴承的连杆机构。

公开(公告)号：US20180345452A1

公开(公告)日：2018-12-06

申请号：US15776733

申请日：2016-10-11

Applicant: EBARA CORPORATION

Inventor： Hideo AIZAWA ,  Junji KUNISAWA ,  Mitsuru MIYAZAKI ,  Naoki TOYOMURA

IPC: B24B41/047

CPC classification number: B24B41/047 ,  H01L21/304

Abstract: In-plane uniformity of buff processing is improved. According to a first form, a buff processing device for executing buff processing of a substrate is provided. Such buff processing device has a rotatable shaft, a buff head body, a torque transmission mechanism for transmitting rotation of the shaft to the buff head body, and an elastic member for elastically supporting the buff head body in a longitudinal direction of the shaft.

公开(公告)号：US20160233118A1

公开(公告)日：2016-08-11

申请号：US15132674

申请日：2016-04-19

Applicant: EBARA CORPORATION

Inventor： Ryuichi KOSUGE ,  Hiroaki NISHIDA ,  Tadakazu SONE ,  Hideo AIZAWA ,  Tomohiro TANAKA

IPC: H01L21/673 ,  B65G47/90 ,  H01L21/67

CPC classification number: H01L21/67313 ,  B24B37/345 ,  B65G47/901 ,  H01L21/67092 ,  H01L21/677 ,  H01L21/68707 ,  H01L21/68728 ,  H01L21/68735

Abstract: A workpiece transport device for transporting a workpiece having a substrate layer and a layer to be processed on a portion of the substrate layer is provided. This workpiece transport device has a workpiece holding mechanism arranged to operate so as to hold and release the workpiece. The workpiece holding mechanism has at least one tapered workpiece holding surface on which the substrate layer of the workpiece is held in a state where the layer to be processed is positioned below the substrate layer. The tapered workpiece holding surface is formed so that a clearance equal to or larger than a predetermined distance R exists between the workpiece holding surface and the layer to be processed of the workpiece when the workpiece is held by the workpiece holding mechanism.

Abstract translation: 提供了一种用于在衬底层的一部分上传送具有衬底层和待加工层的工件的工件传送装置。 该工件输送​​装置具有工件保持机构，该工件保持机构被布置成操作以保持和释放工件。 工件保持机构具有至少一个锥形工件保持表面，工件的基底层保持在其上待处理层位于基底层下方的状态下。 当工件被工件保持机构保持时，锥形工件保持表面形成为在工件保持表面和待加工的被加工层之间存在等于或大于预定距离R的间隙。

公开(公告)号：US20140162536A1

公开(公告)日：2014-06-12

申请号：US14067723

申请日：2013-10-30

Applicant: EBARA CORPORATION

Inventor： Masao UMEMOTO ,  Tadakazu SONE ,  Hideo AIZAWA ,  Ryuichi KOSUGE ,  Masaaki ERIGUCHI

IPC: B24B53/017 ,  B24B37/32 ,  B24B37/10

CPC classification number: B24B53/017 ,  B24B37/04

Abstract: A polishing apparatus includes: a rotatable polishing table for supporting a polishing pad having a polishing surface; a top ring head having a top ring; a top ring head cover surrounding the top ring head; a dresser head having a dresser configured to dress the polishing surface; a dresser head cover surrounding the dresser head; a spray nozzle configured to spray a cleaning liquid onto an upper surface of the top ring and an outer surface of the top ring head cover when the top ring is in the substrate transfer position; and a spray nozzle configured to spray a cleaning liquid onto an outer surface of the dresser head cover when the dresser is in the retreated position.

Abstract translation: 抛光装置包括：可旋转抛光台，用于支撑具有抛光表面的抛光垫; 具有顶环的顶环头; 围绕顶环头部的顶环头盖; 修整器头部具有修整器，该修整器构造成用来装饰抛光表面; 围绕梳妆台头的梳妆台头罩; 喷嘴，其构造成当所述顶环处于所述基板转移位置时，将清洗液喷射到所述顶环的上表面和所述顶环头盖的外表面; 以及喷雾喷嘴，其构造成当所述修整器处于退避位置时将清洁液体喷射到所述修整器盖罩的外表面上。

公开(公告)号：US20170008144A1

公开(公告)日：2017-01-12

申请号：US14787424

申请日：2015-03-27

Applicant: EBARA CORPORATION

Inventor： Kenji SHINKAI ,  Tadakazu SONE ,  Hideo AIZAWA ,  Hiroshi AONO

IPC: B24B37/34 ,  B24B53/017

CPC classification number: B24B37/34 ,  B24B53/017

Abstract: There is provided a cover to which a polishing liquid is less likely to stick and solidify. The cover for a component of a polishing apparatus for polishing substrates is provided with a locking mechanism disposed inside the cover and configured to latch together a main body of the component and the cover. An external surface of the cover exposed to the outside has no recessed portion, and has no horizontal plane, except on the top portion of the cover.

Abstract translation: 提供了一种不太可能粘附和固化的抛光液的盖子。 用于抛光基板的抛光装置的部件的盖设置有设置在盖内并被构造成将部件的主体和盖闩锁在一起的锁定机构。 暴露于外部的盖的外表面没有凹部，除了盖的顶部以外，没有水平面。