公开(公告)号：US20160008948A1

公开(公告)日：2016-01-14

申请号：US14792062

申请日：2015-07-06

Applicant: EBARA CORPORATION

Inventor： Hideo AIZAWA ,  Masao UMEMOTO ,  Tadakazu SONE ,  Ryuichi KOSUGE

IPC: B24B37/015 ,  B24B37/10

CPC classification number: B24B37/015 ,  B24B37/04 ,  B24B37/107

Abstract: A polishing apparatus which can continue stable operation of the apparatus without generating torsional vibration in a rotary joint and without generating an abnormal sound at an engagement part between a cooling water pipe and a polishing table is disclosed. The polishing apparatus includes a rotary joint fixed to a rotating part of the polishing table or a rotating part of the top ring to supply a fluid into the polishing table or the top ring and discharge the fluid from the polishing table or the top ring, and a rotation-prevention mechanism which connects the rotary joint with an apparatus frame to prevent the rotary joint from being rotated. The rotation-prevention mechanism includes a link mechanism having at least one spherical plain bearing.

Abstract translation: 公开了一种可以在不在旋转接头中产生扭转振动并且在冷却水管和抛光台之间的接合部分处不产生异常声音的情况下继续稳定操作设备的抛光装置。 抛光装置包括固定到抛光台的旋转部分或顶环的旋转部分的旋转接头，以将流体供应到抛光台或顶环中并从抛光台或顶环排出流体，以及 旋转防止机构，其将旋转接头与装置框架连接以防止旋转接头旋转。 旋转防止机构包括具有至少一个球面滑动轴承的连杆机构。

公开(公告)号：US20170287755A1

公开(公告)日：2017-10-05

申请号：US15475860

申请日：2017-03-31

Applicant: EBARA CORPORATION

Inventor： Tomohiro TANAKA ,  Kenichiro SAITO ,  Koichi TAKEDA ,  Masumi NISHIJIMA ,  Ryuichi KOSUGE

IPC: H01L21/67 ,  H01L21/687

CPC classification number: H01L21/67259 ,  H01L21/67173 ,  H01L21/67265 ,  H01L21/67742

Abstract: A substrate processing apparatus includes transport mechanisms 121a to 127a, a sensor 40 for detecting whether a wafer W is held by the transport mechanisms 121a to 127a, a sensor controller 82 for controlling the sensor 40, a position information acquiring part 81 for acquiring position information of the substrate W in the transport passage, a detection result acquiring part 83 for acquiring a detection result from the sensor 40, and a determination processor 84 for determining whether the detection result of the sensor and the position information are consistent with each other. When it is determined that the detection result of the sensor 40 is inconsistent with the position information, the sensor controller 82 makes the sensor 40 retry to detect whether the substrate W is held.

公开(公告)号：US20150290769A1

公开(公告)日：2015-10-15

申请号：US14682477

申请日：2015-04-09

Applicant: EBARA CORPORATION

Inventor： Hideo AIZAWA ,  Tadakazu SONE ,  Masao UMEMOTO ,  Ryuichi KOSUGE

IPC: B24B57/02 ,  B24B37/10

CPC classification number: B24B57/02 ,  B24B37/10 ,  B24B37/107

Abstract: The invention suppresses generation of noises attributable to rotation of a rotary joint.A rotary joint 160 includes a rotating body 1600 that rotates on a rotating axis A, a housing 1620 disposed so as to surround the rotating body 1600, and at least one bearing 1630 disposed between the rotating body 1600 and the housing 1620 and adapted to support rotation of the rotating body 1600. The rotary joint 160 supplies fluids through fluid connection ports formed in the housing 1620 and fluid passages formed inside the rotating body 1600 to a polishing table having attached thereto a polishing pad for polishing a substrate or a holding portion that is adapted to hold the substrate while pressing the substrate against the polishing pad. At least one elastic member 1640 is interposed at least either between the rotating body 1600 and the at least one bearing 1630 or between the housing 1620 and the at least one bearing 1630.

Abstract translation: 本发明抑制由旋转接头的旋转引起的噪声的产生。 旋转接头160包括在旋转轴线A上旋转的旋转体1600，围绕旋转体1600设置的壳体1620以及设置在旋转体1600与壳体1620之间的至少一个轴承1630，并且适于支撑 旋转接头160通过形成在壳体1620中的流体连接端口和形成在旋转体1600内部的流体通道提供流体到具有附着到其上的抛光台，抛光台用于抛光基板或保持部分 适于在将衬底压靠在抛光垫上的同时保持衬底。 至少一个弹性构件1640至少插入在旋转体1600和至少一个轴承1630之间或壳体1620和至少一个轴承1630之间。

公开(公告)号：US20190299360A1

公开(公告)日：2019-10-03

申请号：US16366546

申请日：2019-03-27

Applicant: EBARA CORPORATION

Inventor： Tadakazu SONE ,  Ryuichi KOSUGE ,  Kenji SHINKAI ,  Hiroshi AONO ,  Hideo AIZAWA

IPC: B24B57/00 ,  B24B37/24 ,  B24B37/22

Abstract: A polishing apparatus includes a polishing table supplied with liquid on a upper surface and rotating around a central axis, a liquid receiver having an annular shape and disposed below a peripheral portion of the polishing table, and a drain member having a tubular shape, attached to a peripheral portion of the polishing table, and including a lower end portion extending toward the liquid receiver.

公开(公告)号：US20180345447A1

公开(公告)日：2018-12-06

申请号：US15996988

申请日：2018-06-04

Applicant: EBARA CORPORATION

Inventor： Kenichiro SAITO ,  Ryuichi KOSUGE

IPC: B24B37/22 ,  B24D3/32

Abstract: An object of the present invention is to provide a polishing table capable of preventing peeling or detachment of a coating of the polishing table, thereby to enable an operation for replacement of a polishing pad to be easily conducted. One embodiment of the present invention provides a polishing table having a support surface configured to support a polishing pad, the polishing pad being adapted to be used for polishing a substrate, the polishing table comprising: a stacked body comprising a stack of a porous layer and a non-porous layer, the porous layer including open pores formed in a surface thereof disposed to face a polishing pad; and a resin-based coating material disposed in the open pores so as to form at least a part of the support surface of the polishing table.

公开(公告)号：US20140080385A1

公开(公告)日：2014-03-20

申请号：US14030718

申请日：2013-09-18

Applicant: EBARA CORPORATION

Inventor： Masao UMEMOTO ,  Tadakazu SONE ,  Hideo AIZAWA ,  Ryuichi KOSUGE

IPC: B24B37/34

CPC classification number: B24B37/34 ,  B24B37/30

Abstract: A polishing apparatus is used for polishing and planarizing a surface of a substrate such as a semiconductor wafer. The polishing apparatus includes a polishing table having a polishing surface, and a top ring configured to hold a substrate and press the substrate against the polishing surface. The top ring has an extendable and contractable connection sheet configured to cover a gap between a retainer ring guide fixed to a top ring body and a retainer ring guided by the retainer ring guide to move vertically. The polishing apparatus has a nozzle configured to eject a cleaning liquid in a horizontal direction toward the connection sheet and apply a flow of the cleaning liquid directly onto the connection sheet for cleaning the connection sheet.

Abstract translation: 抛光装置用于抛光和平面化诸如半导体晶片的基板的表面。 抛光装置包括具有抛光表面的抛光台和构造成保持基板并将基板压靠在抛光表面上的顶环。 顶环具有可延伸和可收缩的连接片，其构造成覆盖固定到顶环主体的保持环导向件和由保持器环引导件引导的保持环之间的间隙，以垂直移动。 抛光装置具有：喷嘴，被配置为朝向连接片向水平方向喷出清洗液，并将清洗液的流动直接施加到连接片上，以清洁连接片。

公开(公告)号：US20160233118A1

公开(公告)日：2016-08-11

申请号：US15132674

申请日：2016-04-19

Applicant: EBARA CORPORATION

Inventor： Ryuichi KOSUGE ,  Hiroaki NISHIDA ,  Tadakazu SONE ,  Hideo AIZAWA ,  Tomohiro TANAKA

IPC: H01L21/673 ,  B65G47/90 ,  H01L21/67

CPC classification number: H01L21/67313 ,  B24B37/345 ,  B65G47/901 ,  H01L21/67092 ,  H01L21/677 ,  H01L21/68707 ,  H01L21/68728 ,  H01L21/68735

Abstract: A workpiece transport device for transporting a workpiece having a substrate layer and a layer to be processed on a portion of the substrate layer is provided. This workpiece transport device has a workpiece holding mechanism arranged to operate so as to hold and release the workpiece. The workpiece holding mechanism has at least one tapered workpiece holding surface on which the substrate layer of the workpiece is held in a state where the layer to be processed is positioned below the substrate layer. The tapered workpiece holding surface is formed so that a clearance equal to or larger than a predetermined distance R exists between the workpiece holding surface and the layer to be processed of the workpiece when the workpiece is held by the workpiece holding mechanism.

Abstract translation: 提供了一种用于在衬底层的一部分上传送具有衬底层和待加工层的工件的工件传送装置。 该工件输送​​装置具有工件保持机构，该工件保持机构被布置成操作以保持和释放工件。 工件保持机构具有至少一个锥形工件保持表面，工件的基底层保持在其上待处理层位于基底层下方的状态下。 当工件被工件保持机构保持时，锥形工件保持表面形成为在工件保持表面和待加工的被加工层之间存在等于或大于预定距离R的间隙。

公开(公告)号：US20150273649A1

公开(公告)日：2015-10-01

申请号：US14668866

申请日：2015-03-25

Applicant: EBARA CORPORATION

Inventor： Ryuichi KOSUGE ,  Hiroshi SOTOZAKI ,  Takahiro KAWANO ,  Akihiro MOCHIDA

IPC: B24B37/005

CPC classification number: B24B37/0053

Abstract: A polishing apparatus which can reduce scratches that are generated on a surface of a substrate during polishing by detecting a foreign matter such as a fragment of the substrate on an inner circumferential surface of a retaining ring for holding an edge portion (peripheral portion) of the substrate is disclosed. The polishing apparatus includes a polishing table having a polishing surface, and a top ring having a substrate holding surface to hold a beck surface of a substrate and a retaining ring to retain the substrate on the substrate holding surface. The top ring holds the substrate and presses the substrate against the polishing surface. The polishing apparatus includes an imaging device configured to image an inner circumferential surface of the retaining ring, and an image processor configured to process an image obtained by the imaging device to judge whether there is a foreign matter on the inner circumferential surface of the retaining ring.

Abstract translation: 一种抛光装置，其能够通过在保持环的保持环的内周面上检测诸如基片的碎片等异物来保持边缘部（周边部），从而能够减少在研磨时在基板表面产生的划痕 底物被公开。 抛光装置包括具有抛光表面的抛光台和具有用于保持基板的表面的基板保持表面和保持环以将基板保持在基板保持表面上的顶环。 顶环保持基板并将基板压靠在抛光表面上。 抛光装置包括：成像装置，其被构造成对保持环的内周面进行成像;以及图像处理器，被配置为处理由成像装置获得的图像，以判断在保持环的内周面上是否存在异物 。

公开(公告)号：US20140162536A1

公开(公告)日：2014-06-12

申请号：US14067723

申请日：2013-10-30

Applicant: EBARA CORPORATION

Inventor： Masao UMEMOTO ,  Tadakazu SONE ,  Hideo AIZAWA ,  Ryuichi KOSUGE ,  Masaaki ERIGUCHI

IPC: B24B53/017 ,  B24B37/32 ,  B24B37/10

CPC classification number: B24B53/017 ,  B24B37/04

Abstract: A polishing apparatus includes: a rotatable polishing table for supporting a polishing pad having a polishing surface; a top ring head having a top ring; a top ring head cover surrounding the top ring head; a dresser head having a dresser configured to dress the polishing surface; a dresser head cover surrounding the dresser head; a spray nozzle configured to spray a cleaning liquid onto an upper surface of the top ring and an outer surface of the top ring head cover when the top ring is in the substrate transfer position; and a spray nozzle configured to spray a cleaning liquid onto an outer surface of the dresser head cover when the dresser is in the retreated position.

Abstract translation: 抛光装置包括：可旋转抛光台，用于支撑具有抛光表面的抛光垫; 具有顶环的顶环头; 围绕顶环头部的顶环头盖; 修整器头部具有修整器，该修整器构造成用来装饰抛光表面; 围绕梳妆台头的梳妆台头罩; 喷嘴，其构造成当所述顶环处于所述基板转移位置时，将清洗液喷射到所述顶环的上表面和所述顶环头盖的外表面; 以及喷雾喷嘴，其构造成当所述修整器处于退避位置时将清洁液体喷射到所述修整器盖罩的外表面上。

公开(公告)号：US20190351526A1

公开(公告)日：2019-11-21

申请号：US16408960

申请日：2019-05-10

Applicant: Ebara Corporation

Inventor： Masao UMEMOTO ,  Ryuichi KOSUGE ,  Shuichi KAMATA ,  Kento YOSHIDA

IPC: B24B49/16 ,  B24B37/27 ,  B24B37/005

Abstract: A method capable of accurately detecting a polishing surface of a polishing pad using a polishing head without being influenced by passage of time is disclosed. The includes: moving a polishing head in a direction perpendicular to a polishing surface of a polishing pad while applying thrust from the polishing head to the polishing pad; during the movement of the polishing head, detecting deflection of a head arm with a strain sensor, the head arm supporting the polishing head; and determining a position of the polishing head corresponding to a point in time at which an output signal from the strain sensor reaches a preset threshold value.