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公开(公告)号:US20180001440A1
公开(公告)日:2018-01-04
申请号:US15615375
申请日:2017-06-06
Applicant: Ebara Corporation
Inventor: Hiroshi AONO , Kuniaki YAMAGUCHI , Hiroshi SHIMOMOTO , Koji MAEDA , Tetsuya YASHIMA , Kenji SHINKAI , Koichi HASHIMOTO , Mitsuhiko INABA , Hidetatsu ISOKAWA , Hidetaka NAKAO , Soichi ISOBE
Abstract: A substrate processing apparatus is provided with a polishing part that polishes a substrate, a transporting part that transports a substrate before polishing to the polishing part, and a cleaning part that cleans the polished substrate. The cleaning part has a first cleaning unit and a second cleaning unit that are vertically arranged in two stages. The first cleaning unit and the second cleaning unit each have a plurality of cleaning modules that are arranged in series. The transporting part has a slide stage that is disposed between the first cleaning unit and the second cleaning unit, and transports a substrate before polishing along an arrangement direction of the plurality of cleaning modules.
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2.
公开(公告)号:US20190164796A1
公开(公告)日:2019-05-30
申请号:US16204979
申请日:2018-11-29
Applicant: EBARA CORPORATION
Inventor: Kuniaki YAMAGUCHI , Haiyang XU , Koji MAEDA , Mitsuhiko INABA
IPC: H01L21/677 , H01L21/68 , H01L21/687 , B25J9/16 , B65G47/90
Abstract: A substrate transport system includes a hand, a main positioning member permanently mounted on a base, where the main positioning member is engageable with the hand at a position offset by a first distance in the first axis direction and offset by a second distance in the second axis direction from a substrate transfer position, and a control unit that stores a position coordinate in the first axis direction and a position coordinate in the second axis direction of the hand in a state where the hand is positioned by being engaged with the main positioning member.
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3.
公开(公告)号:US20190057894A1
公开(公告)日:2019-02-21
申请号:US16103765
申请日:2018-08-14
Applicant: EBARA CORPORATION
Inventor: Haiyang XU , Koji MAEDA , Mitsuhiko INABA
IPC: H01L21/687 , H01L21/67 , H01L21/683 , B24B41/06 , B08B3/08
Abstract: To detach a substrate from a table without damaging the substrate. According to Embodiment 1, provided is a substrate processing apparatus including a table to hold a substrate, a plurality of lift pins that are arranged at periphery of the table and configured to arrange or separate the substrate on or from the table and to be movable in a direction perpendicular to a surface of the table, a drive mechanism that includes a motor to move the lift pins in the direction perpendicular to the surface of the table, and a control device that is configured to control the drive mechanism. The control device is configured to be capable of moving the lift pins at a first speed and at a second speed different from the first speed.
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