公开(公告)号：US20200176281A1

公开(公告)日：2020-06-04

申请号：US16780049

申请日：2020-02-03

Applicant: EBARA CORPORATION

Inventor： Koji MAEDA ,  Hiroshi SHIMOMOTO ,  Hisajiro NAKANO ,  Masayoshi IMAI ,  Yoichi SHIOKAWA

IPC: H01L21/67 ,  B24B37/04 ,  B24B37/34

Abstract: Various methods of cleaning a substrate are provided. In one aspect, method of cleaning a substrate, comprising: holding and rotating a substrate by a substrate holder; and supplying a chemical liquid to a chemical liquid nozzle and supplying two fluids to a two-fluid nozzle while moving the chemical-liquid nozzle and the two-fluid nozzle radially outwardly from the center to the periphery of the substrate, wherein the distance of the chemical-liquid nozzle from a rotating axis of the substrate holder is longer than the distance of the two-fluid nozzle from the rotating axis of the substrate holder while the chemical-liquid nozzle and the two-fluid nozzle are moved radially outwardly from the rotating axis of the substrate holder.

公开(公告)号：US20180001440A1

公开(公告)日：2018-01-04

申请号：US15615375

申请日：2017-06-06

Applicant: Ebara Corporation

Inventor： Hiroshi AONO ,  Kuniaki YAMAGUCHI ,  Hiroshi SHIMOMOTO ,  Koji MAEDA ,  Tetsuya YASHIMA ,  Kenji SHINKAI ,  Koichi HASHIMOTO ,  Mitsuhiko INABA ,  Hidetatsu ISOKAWA ,  Hidetaka NAKAO ,  Soichi ISOBE

IPC: B24B37/34 ,  H01L21/67 ,  B24B37/10 ,  B08B3/12 ,  B08B1/04 ,  H01L21/687 ,  B08B1/00

Abstract: A substrate processing apparatus is provided with a polishing part that polishes a substrate, a transporting part that transports a substrate before polishing to the polishing part, and a cleaning part that cleans the polished substrate. The cleaning part has a first cleaning unit and a second cleaning unit that are vertically arranged in two stages. The first cleaning unit and the second cleaning unit each have a plurality of cleaning modules that are arranged in series. The transporting part has a slide stage that is disposed between the first cleaning unit and the second cleaning unit, and transports a substrate before polishing along an arrangement direction of the plurality of cleaning modules.

公开(公告)号：US20190355594A1

公开(公告)日：2019-11-21

申请号：US16410378

申请日：2019-05-13

Applicant: EBARA CORPORATION

Inventor： Hidetatsu ISOKAWA ,  Koji MAEDA ,  Xu HAIYANG ,  Shun EHARA

IPC: H01L21/67 ,  B24B37/34 ,  B08B3/04 ,  H01L21/677 ,  H01L21/687

Abstract: A mechanism that conveys a substrate is cleaned in a cleaning unit. A substrate processing apparatus that includes a substrate polishing device and a substrate cleaning unit is disclosed. The substrate cleaning unit includes a cleaning module and a cleaning unit conveyance mechanism. The cleaning unit conveyance mechanism includes a hand and a hand open/close mechanism. The substrate processing apparatus further includes a hand cleaning unit. The hand cleaning unit includes a hand cleaning tank and a cleaning liquid injection mechanism.

公开(公告)号：US20170271178A1

公开(公告)日：2017-09-21

申请号：US15616582

申请日：2017-06-07

Applicant: EBARA CORPORATION

Inventor： Koji MAEDA ,  Soichi ISOBE ,  Hiroshi SHIMOMOTO ,  Hideaki TANAKA

IPC: H01L21/67 ,  H01L21/02

CPC classification number: H01L21/02057 ,  H01L21/67046

Abstract: A substrate cleaning apparatus performs scrub cleaning of a surface of a substrate with an elongated cylindrical roll cleaning member. The substrate cleaning apparatus includes a roll holder for supporting the cleaning member and rotate the roll cleaning member, a vertical movement mechanism for vertically moving the roll holder so that the roll cleaning member applies a roll load to the substrate at the time of cleaning the substrate by actuation of an actuator having a regulating device, a load cell for measuring the roll load, and a controller for performing feedback control of the roll load through the regulating device based on the measured value of the load cell. The substrate cleaning apparatus further includes a monitor unit for monitoring whether an operation amount of the regulating device falls outside an allowable range of a preset reference value of an operation amount corresponding to a preset roll load.

公开(公告)号：US20210394332A1

公开(公告)日：2021-12-23

申请号：US17041734

申请日：2020-03-04

Applicant: EBARA CORPORATION

Inventor： Kuniaki YAMAGUCHI ,  Hiroshi SHIMOMOTO ,  Soichi ISOBE ,  Koji MAEDA ,  Kenji SHINKAI ,  Hidetatsu ISOKAWA ,  Dai YOSHINARI ,  Masayuki TAMURA ,  Haiyang XU ,  Shun EHARA ,  Kentaro ASANO

IPC: B24B37/015 ,  B24B57/02 ,  B24B53/00

Abstract: A substrate processing apparatus includes a polishing section and a transport section. The polishing section has a first polishing unit, a second polishing unit, and a transport mechanism. The first polishing unit has a first polishing apparatus and a second polishing apparatus. The second polishing unit has a third polishing apparatus and a fourth polishing apparatus. Each of the first to fourth polishing apparatuses has a polishing table to which a polishing pad is mounted, a top ring, and auxiliary units that perform a process on the polishing pad during polishing. Around the polishing table, a pair of auxiliary unit mounting units for mounting the respective auxiliary units in a left-right switchable manner with respect to a straight line connecting a swing center of the top ring and a center of rotation of the polishing table is provided at respective positions symmetrical with respect to the straight line.

公开(公告)号：US20190164796A1

公开(公告)日：2019-05-30

申请号：US16204979

申请日：2018-11-29

Applicant: EBARA CORPORATION

Inventor： Kuniaki YAMAGUCHI ,  Haiyang XU ,  Koji MAEDA ,  Mitsuhiko INABA

IPC: H01L21/677 ,  H01L21/68 ,  H01L21/687 ,  B25J9/16 ,  B65G47/90

Abstract: A substrate transport system includes a hand, a main positioning member permanently mounted on a base, where the main positioning member is engageable with the hand at a position offset by a first distance in the first axis direction and offset by a second distance in the second axis direction from a substrate transfer position, and a control unit that stores a position coordinate in the first axis direction and a position coordinate in the second axis direction of the hand in a state where the hand is positioned by being engaged with the main positioning member.

公开(公告)号：US20190057894A1

公开(公告)日：2019-02-21

申请号：US16103765

申请日：2018-08-14

Applicant: EBARA CORPORATION

Inventor： Haiyang XU ,  Koji MAEDA ,  Mitsuhiko INABA

IPC: H01L21/687 ,  H01L21/67 ,  H01L21/683 ,  B24B41/06 ,  B08B3/08

Abstract: To detach a substrate from a table without damaging the substrate. According to Embodiment 1, provided is a substrate processing apparatus including a table to hold a substrate, a plurality of lift pins that are arranged at periphery of the table and configured to arrange or separate the substrate on or from the table and to be movable in a direction perpendicular to a surface of the table, a drive mechanism that includes a motor to move the lift pins in the direction perpendicular to the surface of the table, and a control device that is configured to control the drive mechanism. The control device is configured to be capable of moving the lift pins at a first speed and at a second speed different from the first speed.

公开(公告)号：US20170117165A1

公开(公告)日：2017-04-27

申请号：US15128309

申请日：2015-03-17

Applicant: EBARA CORPORATION

Inventor： Junji KUNISAWA ,  Toru MARUYAMA ,  Masayoshi IMAI ,  Koji MAEDA ,  Mitsuru MIYAZAKI ,  Teruaki HOMBO ,  Fujihiko TOYOMASU

IPC: H01L21/67 ,  B08B9/027 ,  B08B3/08 ,  H01L21/02

CPC classification number: H01L21/67051 ,  B08B3/08 ,  B08B9/027 ,  H01L21/02052 ,  H01L21/67046 ,  H01L21/68728

Abstract: The present invention relates to a substrate processing apparatus for processing a substrate, such as a wafer, while supplying a cleaning liquid (e.g. pure water and a liquid chemical) to the substrate, and also relates to a pipe cleaning method for the substrate processing apparatus. The substrate processing apparatus includes: a first cleaning lane including first cleaning units (52), (54) each for cleaning a substrate while supplying pure water to the substrate; a second cleaning lane including second cleaning units (60), (62) each for cleaning a substrate while supplying pure water to the substrate; a first pure-water supply pipe (120) for supplying the pure water to the first cleaning lane; and a second pure-water supply pipe (180) for supplying the pure water to the second cleaning lane.