公开(公告)号：DE3365365D1

公开(公告)日：1986-09-25

申请号：DE3365365

申请日：1983-01-12

Applicant: ELXSI

Inventor： HOLBERT KENNETH WAYNE ,  MASSEY EDWIN MICHAEL

IPC: H01B7/00 ,  H02G5/00 ,  H05K1/02 ,  H05K3/32 ,  H05K3/42 ,  H05K3/46 ,  H01B7/08 ,  H05K1/11 ,  H05K1/14

公开(公告)号：AT21576T

公开(公告)日：1986-09-15

申请号：AT83900514

申请日：1983-01-12

Applicant: ELXSI

Inventor： HOLBERT KENNETH WAYNE ,  MASSEY EDWIN MICHAEL

IPC: H01B7/08 ,  H05K1/11 ,  H05K1/14

公开(公告)号：EP0098295A4

公开(公告)日：1984-04-24

申请号：EP83900514

申请日：1983-01-12

Applicant: ELXSI

Inventor： HOLBERT KENNETH WAYNE ,  MASSEY EDWIN MICHAEL

IPC: H01B7/00 ,  H02G5/00 ,  H05K1/02 ,  H05K3/32 ,  H05K3/42 ,  H05K3/46 ,  H01B7/08 ,  H05K1/11 ,  H05K1/14

CPC classification number: H02G5/005 ,  H05K1/0263 ,  H05K3/429 ,  H05K3/4641 ,  H05K2201/044 ,  H05K2201/0919 ,  H05K2201/09309 ,  H05K2201/09845 ,  H05K2201/10272

Abstract: A backplane power distribution system for making connections to the power planes of a computer system and having the capability of handling very high levels of current. This is achieved with a stepped backplane construction (17b-e). For example, in a multiple layer system having, in order, a first conductive layer (10a), a first dielectric layer (12a, 12b), a second conductive layer (10b), a second dielectric layer (12bc), and so on, each successive conductive and dielectric layers extend transversely beyond the preceding layers to present a substantial exposed area on all but the first conductive layer (17b-e). Typically, rectangular metal bus bars (not shown) are bolted to the backplane using plated through holes (20b-e) to make contact with the exposed areas (17b-e). Holes through the layers are provided and prepared such that each hole (15, 20 and 22) may make contact with a particular conductive layer as desired or in the case of ground with all ground conductive layers. Conductive layers (10a) and (10i) may be used as signal layers utilizing traces (14) and holes (15) while layers (10b-h) are so-called power planes.

Abstract translation: 背板配电系统，用于连接计算机系统的电源层，并具有处理非常高电流的能力。 这是通过阶梯背板结构（17b-e）实现的。 例如，在依次具有第一导电层（10a），第一电介质层（12a，12b），第二导电层（10b），第二电介质层（12bc）等的多层系统 每个连续的导电层和电介质层横向延伸超过前面的层，以在除了第一导电层（17b-e）之外的所有层上呈现实质的暴露区域。 典型地，使用镀通孔（20b-e）将矩形金属汇流条（未示出）螺栓连接到底板以与暴露区域（17b-e）接触。 提供并制备穿过层的孔，使得每个孔（15,20和22）可以根据需要与特定导电层接触，或者在所有接地导电层接地的情况下。 导电层（10a）和（10i）可以用作迹线（14）和孔（15）的信号层，而层（10b-h）是所谓的电源平面。