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    Particle beam processing device
    1.
    发明专利
    Particle beam processing device 有权
    颗粒光束处理装置

    公开(公告)号：JP2010048823A

    公开(公告)日：2010-03-04

    申请号：JP2009272769

    申请日：2009-11-30

    Applicant: Energy Sciences Inc ,  エナジー サイエンシーズ,インコーポレイティド

    Inventor： RANGWALLA IMTIAZ ,  CLOUGH HARVEY ,  HANNAFIN GEORGE

    IPC: G21K5/04 ,  B05D3/06 ,  C08F2/52 ,  G21K5/00 ,  G21K5/10 ,  H01J33/00 ,  H01J37/06

    CPC classification number: H01J33/00 ,  B05D3/068

    Abstract: PROBLEM TO BE SOLVED: To provide a particle beam processing device that is smaller in size and operates at a higher efficiency, concerning a particle beam processing device including a particle beam generating assembly, a foil support assembly having a thin foil, and a processing zone causing a chemical reaction on a substrate or on a coating.
    SOLUTION: The processing device includes a particle beam generating assembly 110, a foil support assembly 140, and a processing assembly 170. In the particle beam generating assembly, a cloud of particles, for example, electrons, are generated by heating at least one tungsten filament. The electrons are then extracted to travel at a high speed to the foil support assembly which is set at a much lower voltage than the particle beam generating assembly. A substrate is fed to a particle beam processing device through a processing zone and is exposed to the electrons exiting from the particle beam generating assembly and entering the processing zone. The electrons penetrate and cure the substrate causing a chemical reaction.
    COPYRIGHT: (C)2010,JPO&INPIT

    Abstract translation: 要解决的问题：提供一种粒子束处理装置，其尺寸更小并且以更高的效率运行，涉及包括粒子束产生组件的粒子束处理装置，具有薄箔的箔支撑组件和 处理区域，在基材或涂层上引起化学反应。 解决方案：处理装置包括粒子束产生组件110，箔支撑组件140和处理组件170.在粒子束产生组件中，通过在 最少一根钨丝。 然后提取电子以高速行进到箔片支撑组件，箔片支撑组件设置在比颗粒束产生组件低得多的电压下。 衬底通过处理区域被馈送到粒子束处理装置，并且暴露于离开粒子束产生组件并进入处理区的电子。 电子穿透和固化基板，导致化学反应。 版权所有（C）2010，JPO＆INPIT

    Method of processing material by particle beam and material processed by the method
    2.
    发明专利
    Method of processing material by particle beam and material processed by the method 审中-公开
    通过粒子加工材料的方法和材料加工方法

    公开(公告)号：JP2010047017A

    公开(公告)日：2010-03-04

    申请号：JP2009265750

    申请日：2009-11-20

    Applicant: Energy Sciences Inc ,  エナジー・サイエンシーズ・インコーポレイテッドEnergy Sciences Incorporated

    Inventor： RANGWALLA IMTIAZ ,  CLOUGH HARVEY ,  HANNAFIN GEORGE

    IPC: B32B37/00

    Abstract: PROBLEM TO BE SOLVED: To provide a suitable method of processing a material using a particle beam processing device, and a material manufactured by the suitable method. SOLUTION: There are provided the method of processing a material using the particle beam processing device, and the material manufactured by the method. One preferable embodiment provides the method of processing a material using the particle beam processing device. The method includes: a process which provides a particle beam generating assembly containing at least one filament which makes two or more particles; a process which applies an operating voltage higher than about 110 kV to a filament and makes the two or more particles; a process which makes the two or more particles penetrate thin foil having a thickness of about 10 micron or smaller; and a process which processes a material using the two or more particles. COPYRIGHT: (C)2010,JPO&INPIT

    Abstract translation: 要解决的问题：提供使用粒子束处理装置处理材料的合适方法，以及通过合适的方法制造的材料。 解决方案：提供了使用粒子束处理装置处理材料的方法以及通过该方法制造的材料。 一个优选实施例提供了使用粒子束处理装置处理材料的方法。 该方法包括：提供粒子束产生组件的方法，该组件包含至少一个制成两个或更多个颗粒的细丝; 将高于约110kV的工作电压施加到灯丝​​并使两个或更多个颗粒的工艺; 使得两个或更多个颗粒穿过厚度为约10微米或更小的薄箔的方法; 以及使用两种或更多种颗粒处理材料的方法。 版权所有（C）2010，JPO＆INPIT

    Method of treating material with corpuscular ray and material treated in this way
    3.
    发明专利
    Method of treating material with corpuscular ray and material treated in this way 审中-公开
    用这种方式处理的材料和材料的处理方法

    公开(公告)号：JP2009143237A

    公开(公告)日：2009-07-02

    申请号：JP2009008247

    申请日：2009-01-16

    Applicant: Energy Sciences Inc ,  エナジー・サイエンシーズ・インコーポレイテッドEnergy Sciences Incorporated

    Inventor： RANGWALLA IMTIAZ ,  CLOUGH HARVEY ,  HANNAFIN GEORGE

    IPC: B32B27/16 ,  G21K5/00 ,  G21K5/04

    Abstract: PROBLEM TO BE SOLVED: To provide a method suitable for treating a material by using a corpuscular ray treating apparatus and a material created by the suitable method. SOLUTION: The method of treating a material by using a corpuscular ray treating apparatus 100 by one desirable example of embodiment includes a process for providing a corpuscular ray generating assembly 110 containing at least a filament 112 which creates a plurality of particles; a process for creating the plurality of particles by impressing an operating voltage of about 110 Kilo volts or higher onto the filament 112; a process for passing the plurality of particles through a thin film 142 having a thickness of about 10 microns or less; and a process for treating a material 10 by using the plurality of the particles. COPYRIGHT: (C)2009,JPO&INPIT

    Abstract translation: 要解决的问题：提供一种适用于通过使用红细胞射线处理装置和通过合适的方法产生的材料来处理材料的方法。 解决方案：通过实施例的一个理想的实施例，通过使用红细胞射线处理装置100处理材料的方法包括提供包含至少形成多个颗粒的细丝112的红细胞生成组件110的方法; 通过将大约110千伏或更高的操作电压施加到灯丝​​112上来产生多个颗粒的工艺; 用于使多个颗粒通过厚度为约10微米或更小的薄膜142的方法; 以及通过使用多个颗粒处理材料10的方法。 版权所有（C）2009，JPO＆INPIT

    PARTICLE BEAM PROCESSING APPARATUS
    4.
    发明申请
    PARTICLE BEAM PROCESSING APPARATUS 审中-公开
    颗粒束加工设备

    公开(公告)号：WO0135438A9

    公开(公告)日：2002-04-11

    申请号：PCT/US0030236

    申请日：2000-11-02

    Applicant: ENERGY SCIENCES INC

    Inventor： RANGWALLA IMTIAZ ,  CLOUGH HARVEY ,  HANNAFIN GEORGE

    IPC: G21K5/04 ,  B05D3/06 ,  C08F2/52 ,  G21K5/00 ,  G21K5/10 ,  H01J33/00 ,  H01J37/06

    CPC classification number: H01J33/00 ,  B05D3/068

    Abstract: The present invention is directed to a particle beam processing apparatus that is smaller in size and operates at a higher efficiency. The processing apparatus includes a particle beam generating assembly, a foil support assembly, and a processing assembly. In the particle beam generating assembly, a cloud of particles, for example, electrons, are generated by heating at least one tungsten filament. The electrons are then extracted to travel at a high speed to the foil support assembly which is set at a much lower voltage than the particle beam generating assembly. A substrate is fed to the processing apparatus through the processing zone and is exposed to the electrons exiting the particle beam generating assembly and entering the processing zone. The electrons penetrate and cure the substrate causing a chemical reaction, such as polymerization, cross-linking, or sterilization.

    Abstract translation: 本发明涉及一种尺寸更小并以更高效率工作的粒子束处理装置。 处理装置包括粒子束产生组件，箔支撑组件和处理组件。 在粒子束产生组件中，通过加热至少一根钨丝来产生颗粒云，例如电子。 然后提取电子以高速行进到箔片支撑组件，箔片支撑组件设置在比颗粒束产生组件低得多的电压下。 衬底通过处理区被馈送到处理装置，并暴露于离开粒子束产生组件并进入处理区的电子。 电子穿透和固化基板，导致化学反应，如聚合，交联或灭菌。

    PARTICLE BEAM PROCESSING APPARATUS AND MATERIALS TREATABLE USING THE APPARATUS
    5.
    发明申请
    PARTICLE BEAM PROCESSING APPARATUS AND MATERIALS TREATABLE USING THE APPARATUS 审中-公开
    颗粒光束处理设备和材料可使用设备进行处理

    公开(公告)号：WO03100814A9

    公开(公告)日：2004-04-01

    申请号：PCT/US0316457

    申请日：2003-05-23

    Applicant: ENERGY SCIENCES INC

    Inventor： RANGWALLA IMTIAZ ,  CLOUGH HARVEY ,  HANNAFIN GEORGE

    IPC: G21K5/04 ,  B05D3/06 ,  B41M7/00 ,  C08F2/52 ,  G21K5/00 ,  G21K5/10 ,  H01J33/00 ,  H01J33/04 ,  H01J37/06

    CPC classification number: B05D3/068 ,  B41M7/0045 ,  B41M7/0081 ,  G21K5/10 ,  H01J33/00 ,  H01J33/04

    Abstract: The present invention is directed to a particle beam processing apparatus that is smaller in size and operates at a higher efficiency, and also directed to an application of such apparatus to treat a coating on a substrate of a treatable material, such as for flexible packaging. The processing apparatus includes a particle beam generating assembly, a foil support assembly, and a processing assembly. In the particle beam generating assembly, electrons are generated and accelerated to pass through the foil support assembly. In the flexible packaging application, the substrate is fed to the processing apparatus operating at a low voltage, such as 110 kVolts or below, and is exposed to the accelerated electrons to treat the coating on the substrate.

    Abstract translation: 本发明涉及一种尺寸较小并以更高效率操作的粒子束加工装置，并且还针对这种装置的应用来处理可处理材料的基底上的涂层，例如用于柔性包装。 处理装置包括粒子束产生组件，箔支撑组件和处理组件。 在粒子束产生组件中，产生并加速电子以通过箔支撑组件。 在柔性封装应用中，将衬底馈送到在低电压（例如110kV或更低）下工作的处理设备，并暴露于加速电子以处理衬底上的涂层。

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