公开(公告)号：WO2009150133A1

公开(公告)日：2009-12-17

申请号：PCT/EP2009/057051

申请日：2009-06-08

Applicant: EPCOS AG ,  PAHL, Wolfgang ,  KRÜGER, Hans ,  DEMMER, Peter

Inventor： PAHL, Wolfgang ,  KRÜGER, Hans ,  DEMMER, Peter

IPC: H05K3/00 ,  H05K1/18 ,  H05K3/32

CPC classification number: H05K1/189 ,  H01L2224/16225 ,  H05K3/4691 ,  H05K2201/0394 ,  H05K2201/09081 ,  H05K2201/09109 ,  H05K2203/308 ,  Y10T29/49124 ,  Y10T428/24322

Abstract: Leiterplatte umfassend, einen Schaltungsträger (1), eine Deckschicht aus einem nicht leitenden Material (4), welches eine organische Substanz umfasst, angeordnet auf dem Schaltungsträger (1), eine erste Metallisierungsebene (5) zumindest teilweise angeordnet auf der Deckschicht (4), wobei die erste Metallisierungsebene (5) einen flexiblen Bereich (10) aufweist.

Abstract translation: 印刷电路板包括电路载体（1），非导电材料（4），其包括有机物质，布置在电路载体（1），第一金属化层（5）至少部分地设置在所述顶层（4）上的覆盖层， 其中，所述第一金属化（5）包括柔性部分（10）。

公开(公告)号：EP1055285A1

公开(公告)日：2000-11-29

申请号：EP99913068.5

申请日：1999-02-05

Applicant: EPCOS AG

Inventor： STELZL, Alois ,  KRÜGER, Hans ,  DEMMER, Peter

IPC: H03H9/05 ,  H03H9/10 ,  H03H9/25

CPC classification number: H01L24/97 ,  H01L23/552 ,  H01L2224/16225 ,  H01L2224/73253 ,  H01L2224/97 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01019 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01047 ,  H01L2924/01052 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/3025 ,  H03H3/08 ,  Y10T29/4913 ,  Y10T29/49139 ,  Y10T29/49142 ,  Y10T29/49146 ,  Y10T29/49171 ,  Y10T29/49789 ,  H01L2224/81

Abstract: In a process for manufacturing a surface-wave filter, a carrier plate 10 which can be subdivided into base plates 2 is provided with printed circuits in each base plate zone A and these are contacted with the active structures of surface-wave chips 1 by a flip-chip technique. A metal or plastic foil 3 or 4 is then laid on the carrier plate 10 fitted with chips and then processed under heat and pressure, for example, so that each chip 1 - except for the chip surface facing the carrier plate 10 - is enveloped and hermetically sealed on the carrier plate surface in the zones between the chips.

公开(公告)号：EP1055285B1

公开(公告)日：2002-10-09

申请号：EP99913068.5

申请日：1999-02-05

Applicant: EPCOS AG

Inventor： STELZL, Alois ,  KRÜGER, Hans ,  DEMMER, Peter

IPC: H03H9/05 ,  H03H9/10 ,  H03H9/25

CPC classification number: H01L24/97 ,  H01L23/552 ,  H01L2224/16225 ,  H01L2224/73253 ,  H01L2224/97 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01019 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01047 ,  H01L2924/01052 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/3025 ,  H03H3/08 ,  Y10T29/4913 ,  Y10T29/49139 ,  Y10T29/49142 ,  Y10T29/49146 ,  Y10T29/49171 ,  Y10T29/49789 ,  H01L2224/81

Abstract: In a process for manufacturing a surface-wave filter, a carrier plate 10 which can be subdivided into base plates 2 is provided with printed circuits in each base plate zone A and these are contacted with the active structures of surface-wave chips 1 by a flip-chip technique. A metal or plastic foil 3 or 4 is then laid on the carrier plate 10 fitted with chips and then processed under heat and pressure, for example, so that each chip 1 - except for the chip surface facing the carrier plate 10 - is enveloped and hermetically sealed on the carrier plate surface in the zones between the chips.