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公开(公告)号：CA2321473A1
公开(公告)日：1999-08-26
申请号：CA2321473
申请日：1999-02-05
Applicant: EPCOS AG
Inventor： KRUGER HANS , STELZL ALOIS , DEMMER PETER
Abstract: In a process for manufacturing a surface-wave filter, a carrier plate 10 which can be subdivided into base plates 2 is provided with printed circuits in each base plate zone A and these are contacted with the active structures of surface-wave chips 1 by a flip-chip technique. A metal or plastic foil 3 or 4 is then laid on the carrier plate 10 fitted with chips and then processed under heat and pressure, for example, so that each chip 1 - except for the chip surface facing the carrier plate 10 - is enveloped and hermetically sealed on the carrier plate surface in the zones between the chips.
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公开(公告)号：DE59903019D1
公开(公告)日：2002-11-14
申请号：DE59903019
申请日：1999-02-05
Applicant: EPCOS AG
Inventor： STELZL ALOIS , KRUEGER HANS , DEMMER PETER
Abstract: A method is provided for manufacturing a saw filter in which a carrier plate 10 that can be separated into base plates 2 is respectively provided with interconnects in the base plate regions A and these are contacted to the active structures of SAW chips 1 in flip-chip technique. A metal foil 3 or plastic film 4 is placed onto the chip-equipped carrier plate 10 and, for example, is pressure and heat treated such that it envelopes each chip 1 (except for the chip surface facing toward the carrier plate 10) and lies hermetically tight on the carrier plate surface in regions between the chips.
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公开(公告)号：DE102008028300A1
公开(公告)日：2009-12-24
申请号：DE102008028300
申请日：2008-06-13
Applicant: EPCOS AG
Inventor： PAHL WOLFGANG , KRUEGER HANS , DEMMER PETER
Abstract: A circuit board comprising a circuit carrier, a cover layer composed of a nonconductive material, comprising an organic substance, arranged on the circuit carrier, a first metallization layer at least partly arranged on the cover layer, wherein the first metallization layer has a flexible region.
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