公开(公告)号：WO2009092361A2

公开(公告)日：2009-07-30

申请号：PCT/DE2009000073

申请日：2009-01-21

Applicant: EPCOS AG ,  PAHL WOLFGANG ,  FEIERTAG GREGOR ,  LEIDL ANTON

Inventor： PAHL WOLFGANG ,  FEIERTAG GREGOR ,  LEIDL ANTON

IPC: B81B7/00

CPC classification number: B81C1/00896 ,  B81B7/0061 ,  B81B2201/0257 ,  B81C2201/053 ,  H04R2201/003

Abstract: The invention relates to a MEMS component comprising a substrate (1) in which at least one cavity (2) is present. The cavity (2) is closed toward an active side of the substrate (1). An inactive side is disposed opposite the active side of the substrate (1), and the substrate (1) is covered by a covering film (3) on the inactive side. The invention further relates to a method for producing a MEMS component comprising the following steps. In the first step, cavities (2) are produced on a substrate wafer (1), wherein the cavities (2) are closed toward an active side and comprise an opening toward an inactive side. In a second step, a covering film (3) is applied to the inactive side of the substrate wafer (1), wherein the covering film (3) is glued to the substrate wafer (1) at least in the area of the substrate wafer (1) between the cavities (2).

Abstract translation: 本发明提供一种MEMS器件，包括衬底（1），其中，至少一个空腔（2）的存在。 到衬底（1）朝向所述空腔（2）的有源侧是封闭的。 非活动侧被相对地设置在基板（1）和所述衬底的所述有源侧（1）覆盖在非活动侧与盖（3）。 此外，提供了一种制造MEMS器件，其包括以下步骤的方法。 在第一步骤中空腔的基板晶片（1），其中所述空腔（2）被关闭以有源侧并且具有开口到非活动侧上产生（2）。 在第二个步骤中，覆盖箔（3）在所述衬底晶片（1）的非活动侧被施加，其中，所述覆盖膜（3）至少在腔（2）之间的基底晶片（1）的区域到所述衬底晶片 （1）粘接。

公开(公告)号：WO2013124170A2

公开(公告)日：2013-08-29

申请号：PCT/EP2013052553

申请日：2013-02-08

Applicant: EPCOS AG

Inventor： PAHL WOLFGANG ,  LEIDL ANTON ,  PORTMANN JUERGEN ,  EICHINGER ROBERT ,  SIEGEL CHRISTIAN ,  NICOLAUS KARL ,  WASSNER THOMAS ,  SEDLMEIER THOMAS

IPC: B81C1/00

CPC classification number: B81C1/00333 ,  B81C99/0045 ,  H01L22/12 ,  H01L2224/16225 ,  H01L2924/1461 ,  H04R31/006 ,  H01L2924/00

Abstract: The invention relates to a method for producing a sensor (SEN), comprising the steps of arranging a sensor element (SE) on a carrier (TR), arranging a cover (AF) on the sensor element (SE), wherein the sensor element (SE) is enclosed between the cover (AF) and the carrier (TR), adhering a carrier film (TF) to the cover (AF), and producing an opening (SO) in the carrier film (TF) and the cover (AF), wherein the openings (SO) in the carrier film (TF) and the cover (AF) at least partially overlap.

Abstract translation: 本发明涉及一种方法，用于制造传感器（SEN），其包含载体（TR）上定位的传感器元件（SE），所述传感器元件（SE）上配置覆盖物（AF），的步骤，其中的传感器元件（SE） 将背衬片（TF）粘附到盖（AF），并且在背衬片（TF）和盖（AF）中形成开口（SO），开口 （SO）在载体膜（TF）和盖（AF）中至少部分重叠。

公开(公告)号：WO2009150087A2

公开(公告)日：2009-12-17

申请号：PCT/EP2009056832

申请日：2009-06-03

Applicant: EPCOS AG ,  PAHL WOLFGANG ,  WEIDNER KARL

Inventor： PAHL WOLFGANG ,  WEIDNER KARL

IPC: B81B7/00

CPC classification number: H01L23/4985 ,  B81B7/0048 ,  B81B2207/07 ,  H01L23/498 ,  H01L23/5387 ,  H01L24/24 ,  H01L24/80 ,  H01L24/82 ,  H01L2224/24051 ,  H01L2224/24226 ,  H01L2224/24998 ,  H01L2224/76155 ,  H01L2224/82007 ,  H01L2224/82102 ,  H01L2924/01005 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01068 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/1461 ,  H01L2924/181 ,  H01L2924/3025 ,  H01L2924/00

Abstract: A chip (2, 3) is arranged on an upper side of a flexible support (1) and mechanically separate from the support. Electrical connections (8, 11) for the chip are executed with a planar connection technique. The chip can be separated from the support by means of an air gap or a base layer (7) made of a soft or compressible material.

Abstract translation: 一种芯片（2,3）被布置成从上方的承载件分离的柔性支撑件（1）和机械的上表面上。 芯片的电连接（8,11）在一个平面连接技术进行。 该芯片可从支撑通过气隙或软的或可压缩的材料制成的基体层（7）分离。

公开(公告)号：WO2014202283A3

公开(公告)日：2015-02-26

申请号：PCT/EP2014059633

申请日：2014-05-12

Applicant: EPCOS AG

Inventor： PAHL WOLFGANG

IPC: B81C1/00

CPC classification number: B81C1/00825 ,  B81B7/0058 ,  B81B2201/0257 ,  B81B2203/0127 ,  B81B2207/012 ,  B81B2207/115 ,  B81C2201/053 ,  B81C2203/0785 ,  H01L2224/16225 ,  H01L2224/48137 ,  H01L2224/73257 ,  H01L2924/16151 ,  H01L2924/16152

Abstract: For producing a structured coating, or for removing a coating from a sensitive region in a gentle manner, a release film is applied under the coating in the region not to be coated and is structured. In a release step, the adhesion force acting upon the release film is reduced and the release film is lifted off together with the coating applied on top.

Abstract translation: 为了产生图案化的涂层，或用于轻轻提起之上的涂层的感光区域，它在被提出的非施加涂层和结构下被涂覆在剥离膜。 在释放步骤中，将剥离薄膜没有在区域减小到被涂覆在粘合并随后与上述施加的涂层一起剥离。

公开(公告)号：WO2009019308A3

公开(公告)日：2009-05-28

申请号：PCT/EP2008060417

申请日：2008-08-07

Applicant: EPCOS AG ,  PAHL WOLFGANG ,  KRUEGER HANS ,  RUILE WERNER

Inventor： PAHL WOLFGANG ,  KRUEGER HANS ,  RUILE WERNER

IPC: H03H9/02

CPC classification number: H03H9/02834 ,  H03H9/02574 ,  Y10T29/42

Abstract: The invention relates to a component combining various measures for reducing the temperature gradient. The component can have a piezoelectric substrate and electrically conductive component structures can be located on the top side of the substrate. The underside of the substrate is mechanically fixed to a compensation layer, so that mechanical restraint takes place. The underside of the substrate and the top side of the compensation layer have one topography.

Abstract translation: 公开是结合各种措施以降低温度响应的装置。 该设备可以包括一个压电基片，并且从基板的导电部件的结构可以位于的顶部。 在基板的下侧与从而形成一机械张力的补偿层机械地连接牢固。 所述基板的与下侧上的补偿层的顶部有一个形貌。

公开(公告)号：WO0159853A3

公开(公告)日：2002-02-21

申请号：PCT/DE0100405

申请日：2001-02-02

Applicant: EPCOS AG ,  PAHL WOLFGANG ,  TRAUSCH GUENTER

Inventor： PAHL WOLFGANG ,  TRAUSCH GUENTER

IPC: H01L41/09 ,  H01L41/04 ,  H01L41/18 ,  H01L41/22 ,  H03H3/08 ,  H03H9/02 ,  H03H9/25 ,  H01L41/08 ,  G03F7/09

CPC classification number: H01L41/04 ,  H03H3/08 ,  H03H9/02622

Abstract: The aim of the invention is to increase resistance to breaking and to prevent optical reflections during structuring for producing components on piezoelectric substrates. To this end, an absorber layer (2) which has high optical absorption, binds particles and seals cracks is provided on the rear side of the substrate (1). The absorber layer (2) is advantageously also electroconductive in order to be able to divert pyroelectric charges.

Abstract translation: 为了提高对压电基片部件的制造图案化期间的断裂强度和光学反射varhinderung吸收层（2）在衬底的背面提出提供（1），其具有高的光吸收，是粒子 - 结合和anrissversiegelnd。 有利的是，吸收体层（2）还用于排出电荷电Laitfähig热电。

公开(公告)号：WO2011092137A3

公开(公告)日：2011-12-22

申请号：PCT/EP2011050902

申请日：2011-01-24

Applicant: EPCOS AG ,  FEIERTAG GREGOR ,  KRUEGER HANS ,  PAHL WOLFGANG ,  LEIDL ANTON

Inventor： FEIERTAG GREGOR ,  KRUEGER HANS ,  PAHL WOLFGANG ,  LEIDL ANTON

IPC: B81C1/00

CPC classification number: B81B7/0061 ,  B81B2201/0257 ,  B81B2207/012 ,  B81C1/00238 ,  B81C1/00309 ,  G01L9/0073 ,  H01L23/10 ,  H01L23/552 ,  H01L24/13 ,  H01L24/16 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/73 ,  H01L24/81 ,  H01L24/83 ,  H01L24/94 ,  H01L25/0657 ,  H01L2224/131 ,  H01L2224/1329 ,  H01L2224/133 ,  H01L2224/16145 ,  H01L2224/16146 ,  H01L2224/27438 ,  H01L2224/29011 ,  H01L2224/29013 ,  H01L2224/291 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/32145 ,  H01L2224/73203 ,  H01L2224/81801 ,  H01L2224/8185 ,  H01L2224/83825 ,  H01L2224/8385 ,  H01L2224/83851 ,  H01L2224/94 ,  H01L2225/06513 ,  H01L2225/06541 ,  H01L2924/01029 ,  H01L2924/07811 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/1461 ,  H01L2924/163 ,  H01L2924/181 ,  H04R19/04 ,  H01L2224/81 ,  H01L2224/83 ,  H01L2924/014 ,  H01L2924/00

Abstract: The invention relates to a miniaturized electrical component comprising an MEMS chip and an ASIC chip. The MEMS chip and the ASIC chip are disposed on top of each other; an internal mounting of MEMS chip and ASIC chip is connected to external electrical terminals of the electrical component by means of vias through the MEMS chip or the ASIC chip.

Abstract translation: 指定具有MEMS芯片和ASIC芯片的小型化电气部件。 MEMS芯片和ASIC芯片一个在另一个之上布置; MEMS芯片和ASIC芯片的内部互连经由通过MEMS芯片的通孔接触或通过ASIC芯片与电气部件的外部电连接互连。

公开(公告)号：WO2006089640A2

公开(公告)日：2006-08-31

申请号：PCT/EP2006001120

申请日：2006-02-08

Applicant: EPCOS AG ,  LEIDL ANTON ,  PAHL WOLFGANG ,  WOLFF ULRICH

Inventor： LEIDL ANTON ,  PAHL WOLFGANG ,  WOLFF ULRICH

IPC: H04R17/02

CPC classification number: H04R17/02

Abstract: The invention relates to a microphone membrane (M1) comprising two piezoelectric layers (PS1, PS2) with c-axes oriented in the same direction. A first electroconductive surface (E11) is formed in the central metal layer and subjected to a first electrical potential. The piezoelectric layers (PS1, PS2) are respectively arranged between the central metal layer (ML2) and an outer metal layer (ML1, ML3). In a preferred embodiment, the membrane (M1) has a largely symmetrical structure in terms of the layer sequence and the layer thickness thereof.

Abstract translation: 本发明涉及一种麦克风膜（M1），其包括具有同向c轴两个压电体层（PS1，PS2）。 在中间金属层包括第一导电表面（E11）形成，这是在通过一个第一电势作用。 中心金属层（ML2）和布置在外部金属层（ML1，ML3）之间设置的压电体层（PS1，PS2）。 在一个优选的变型中，膜（M1）相对于层的顺序和层的厚度，以大致对称的结构。

公开(公告)号：WO2004044980A3

公开(公告)日：2004-07-29

申请号：PCT/EP0311448

申请日：2003-10-15

Applicant: EPCOS AG ,  PAHL WOLFGANG

Inventor： PAHL WOLFGANG

IPC: H01L21/50 ,  H01L23/10 ,  H01L29/06 ,  H01L23/48 ,  H03H9/05

CPC classification number: H03H9/1078 ,  B81B7/007 ,  B81C2203/0118 ,  H01L21/50 ,  H01L23/10 ,  H01L29/0657 ,  H01L2924/0002 ,  H01L2924/01079 ,  H01L2924/09701 ,  H03H9/059 ,  H01L2924/00

Abstract: Disclosed is a component which has a sandwich-type structure and in which the chip that supports component structures is glued to a frame structure and a diffusion-proof cover such that the component structures are disposed inside the structure and preferably within a hollow space. The lateral edges of the transitions between the layers of the structure are protected by means of a metal coating. Feedthrough connections that penetrate the cover connect contacts located on the bottom side of the cover to the connecting metal coatings of the component structures on the chip. The feedthrough connections are sealed by means of a metal coating that is disposed on the bottom side thereof.

Abstract translation: 它将与一个夹层结构，其中，所述部件的结构被接合芯片承载有一个帧结构和一个扩散防止盖，使得在该结构的内部的部件的结构和优选地被布置在腔体中的成分进行说明。 该结构的层转换是在有金属化的侧边缘的保护。 穿过盖的通孔连接在与芯片上的部件结构的连接金属盖的下侧接触。 通孔被密封与下金属化。

公开(公告)号：WO0152410A3

公开(公告)日：2001-12-06

申请号：PCT/DE0004562

申请日：2000-12-20

Applicant: EPCOS AG ,  PAHL WOLFGANG ,  BAYER HEINER

Inventor： PAHL WOLFGANG ,  BAYER HEINER

IPC: H01L41/09 ,  H01L23/62 ,  H01L41/18 ,  H01L41/22 ,  H03H3/08 ,  H03H9/02 ,  H03H9/145

CPC classification number: H01L23/62 ,  H01L2924/0002 ,  H01L2924/3011 ,  H03H9/02921 ,  Y10T29/42 ,  Y10T29/49005 ,  Y10T29/49155 ,  H01L2924/00

Abstract: A high-resistance layer arranged on a pyroelectric substrate, for the harmless draining of pyroelectric voltages, is disclosed. Said layer can be applied to the whole surface in a thin layer process and then formed, such that electrically conducting component structures remain uncovered.

Abstract translation: 在基片上热电装置Pyrospannungen破坏衍生物提出提供在基板上的高电阻层。 这在沉积薄膜工艺，然后构图，导电部件的结构可以是毛毯保持不被覆盖。