公开(公告)号：US20160088729A1

公开(公告)日：2016-03-24

申请号：US14889385

申请日：2014-05-27

Applicant: EPCOS AG

Inventor： Hisashi KOBUKE ,  Yousuke FUTAMATA ,  Emi NINOMIYA

IPC: H05K1/03 ,  H05K1/09 ,  H05K1/11 ,  H05K1/02

CPC classification number: H05K1/0306 ,  C03C12/00 ,  H05K1/0298 ,  H05K1/09 ,  H05K1/115 ,  H05K3/4617 ,  H05K3/4629 ,  H05K2201/0209 ,  H05K2201/0266

Abstract: A multilayer wiring substrate includes a number of insulating layers, each insulating layer including a glass ceramic. A number of internal conductor layers are formed between the insulating layers. Via conductors penetrate through the insulating layers and mutually connect the internal conductor layers in different layer locations. Surface conductor layers are formed on an outer surfaces in a lamination direction of the insulating layers. The insulating layers include outside insulating layers and inside insulating layers. A first aspect ratio representing an oblateness and sphericity of an external filler contained in the outside insulating layers is larger than a second aspect ratio representing an oblateness and sphericity of an internal filler contained in the inside insulating layers. A thermal expansion coefficient of the outside insulating layers is smaller than a thermal expansion coefficient of the inside insulating layers.

Abstract translation: 多层布线基板包括多个绝缘层，每个绝缘层包括玻璃陶瓷。 在绝缘层之间形成多个内部导体层。 通孔导体穿过绝缘层并将内部导体层互相连接在不同的层位置。 在绝缘层的层叠方向的外表面上形成表面导体层。 绝缘层包括外部绝缘层和内部绝缘层。 表示包含在外侧绝缘层中的外部填料的扁平度和球形度的第一长宽比大于表示内侧绝缘层中包含的内部填料的扁平度和球形度的第二纵横比。 外部绝缘层的热膨胀系数小于内部绝缘层的热膨胀系数。