METHOD OF FORMING LIGHT-EMITTING DIODE
    1.
    发明申请
    METHOD OF FORMING LIGHT-EMITTING DIODE 有权
    形成发光二极管的方法

    公开(公告)号:US20140295588A1

    公开(公告)日:2014-10-02

    申请号:US14196708

    申请日:2014-03-04

    CPC classification number: H01L33/005 H01L21/02436 H01L21/02664 H01L33/0079

    Abstract: A method of forming a light-emitting diode includes: providing a substrate having one or more first openings passing through the substrate; forming a sacrificial layer on the substrate; forming an epitaxial layer on the sacrificial layer; connecting a supporting substrate with the epitaxial layer; and separating the substrate from the epitaxial layer by selectively etching the sacrificial layer.

    Abstract translation: 形成发光二极管的方法包括:提供具有穿过基板的一个或多个第一开口的基板; 在所述基板上形成牺牲层; 在牺牲层上形成外延层; 将支撑衬底与所述外延层连接; 以及通过选择性蚀刻牺牲层将衬底与外延层分离。

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