公开(公告)号：US10670244B2

公开(公告)日：2020-06-02

申请号：US16365115

申请日：2019-03-26

Applicant: EPISTAR CORPORATION

Inventor： Chi-Chih Pu ,  Chen-Hong Lee ,  Shih-Yu Yeh ,  Wei-Kang Cheng ,  Shyi-Ming Pan ,  Siang-Fu Hong ,  Chih-Shu Huang ,  Tzu-Hsiang Wang ,  Shih-Chieh Tang ,  Cheng-Kuang Yang

IPC: F21V21/14 ,  H01L33/50 ,  H01L33/48 ,  H01L33/44 ,  F21V21/00 ,  H01L25/075 ,  F21V29/85 ,  F21V3/02 ,  F21V17/10 ,  F21V23/06 ,  H01L23/00 ,  H01L33/00 ,  F21Y107/00 ,  F21Y115/10

Abstract: The present invention relates to a light emitting device comprising a transparent substrate which light can pass through and at least one LED chip emitting light omni-directionally. Wherein the LED chip is disposed on one surface of the substrate and the light emitting angle of the LED chip is wider than 180°, and the light emitted by the LED chip will penetrate into the substrate and at least partially emerge from another surface of the substrate. According to the present invention, the light emitting device using LED chips can provide sufficient lighting intensity and uniform lighting performance.

公开(公告)号：US10596388B2

公开(公告)日：2020-03-24

申请号：US15709118

申请日：2017-09-19

Applicant: EPISTAR CORPORATION

Inventor： Min-Hsun Hsieh ,  Jai-Tai Kuo ,  Chang-Hseih Wu ,  Tzu-Hsiang Wang ,  Chi-Chih Pu

IPC: A61N5/06 ,  A61B5/00 ,  H01L25/075 ,  H01L27/15 ,  A61B17/00

Abstract: A light-emitting module includes a carrier, a plurality of light-emitting units, and a protection layer. The carrier has a lighting portion and an extending portion. The plurality of light-emitting units is disposed on the lighting portion. The protection layer covers the plurality of light-emitting units and the lighting portion, and exposes the extending portion.

公开(公告)号：US10340431B2

公开(公告)日：2019-07-02

申请号：US15867218

申请日：2018-01-10

Applicant: EPISTAR CORPORATION

Inventor： Jai-Tai Kuo ,  Min-Hsun Hsieh ,  Lung-Kuan Lai ,  Wei-Kang Cheng ,  Chien-Liang Liu ,  Yih-Hua Renn ,  Shou-Lung Chen ,  Tsun-Kai Ko ,  Chi-Chih Pu

IPC: H01L33/46 ,  H01L33/48 ,  H01L33/50 ,  H01L33/54 ,  H01L33/56 ,  H01L33/60 ,  H01L33/62

Abstract: This disclosure discloses a light-emitting device. The light-emitting device includes a light-emitting diode, a pad electrically connected to the active layer, a metal bump formed on the pad, and a reflective insulation layer. The metal bump has a first side surface and a first bottom surface, wherein the first bottom surface comprises a curved boundary, a longer axis, and a shorter axis. The reflective insulation layer is directly contacting the first side surface, and exposing the first bottom surface.

公开(公告)号：US11728310B2

公开(公告)日：2023-08-15

申请号：US17838307

申请日：2022-06-13

Applicant: EPISTAR CORPORATION

Inventor： Min-Hsun Hsieh ,  Shih-An Liao ,  Ying-Yang Su ,  Hsin-Mao Liu ,  Tzu-Hsiang Wang ,  Chi-Chih Pu

IPC: H01L23/00 ,  H01L25/16 ,  H01L25/075 ,  H01L23/498 ,  B23K26/22 ,  B23K101/40

CPC classification number: H01L24/81 ,  B23K26/22 ,  H01L23/49866 ,  H01L24/83 ,  H01L25/0753 ,  H01L25/167 ,  B23K2101/40 ,  H01L2224/81005 ,  H01L2224/81224 ,  H01L2224/83005 ,  H01L2224/83224 ,  H01L2924/12041

Abstract: Disclosed is a die-bonding method which provides a target substrate having a circuit structure with multiple electrical contacts and multiple semiconductor elements each semiconductor element having a pair of electrodes, arranges the multiple semiconductor elements on the target substrate with the pair of electrodes of each semiconductor element aligned with two corresponding electrical contacts of the target substrate, and applies at least one energy beam to join and electrically connect the at least one pair of electrodes of every at least one of the multiple semiconductor elements and the corresponding electrical contacts aligned therewith in a heating cycle by heat carried by the at least one energy beam in the heating cycle. The die-bonding method delivers scattering heated dots over the target substrate to avoid warpage of PCB and ensures high bonding strength between the semiconductor elements and the circuit structure of the target substrate.

公开(公告)号：US11362060B2

公开(公告)日：2022-06-14

申请号：US16551764

申请日：2019-08-27

Applicant: EPISTAR CORPORATION

Inventor： Min-Hsun Hsieh ,  Shih-An Liao ,  Ying-Yang Su ,  Hsin-Mao Liu ,  Tzu-Hsiang Wang ,  Chi-Chih Pu

IPC: H01L23/00 ,  H01L25/16 ,  H01L25/075 ,  H01L23/498 ,  B23K26/22 ,  B23K101/40

Abstract: Disclosed is a die-bonding method which provides a target substrate having a circuit structure with multiple electrical contacts and multiple semiconductor elements each semiconductor element having a pair of electrodes, arranges the multiple semiconductor elements on the target substrate with the pair of electrodes of each semiconductor element aligned with two corresponding electrical contacts of the target substrate, and applies at least one energy beam to join and electrically connect the at least one pair of electrodes of every at least one of the multiple semiconductor elements and the corresponding electrical contacts aligned therewith in a heating cycle by heat carried by the at least one energy beam in the heating cycle. The die-bonding method delivers scattering heated dots over the target substrate to avoid warpage of PCB and ensures high bonding strength between the semiconductor elements and the circuit structure of the target substrate.

公开(公告)号：US11255524B2

公开(公告)日：2022-02-22

申请号：US16887948

申请日：2020-05-29

Applicant: EPISTAR CORPORATION

Inventor： Chi-Chih Pu ,  Chen-Hong Lee ,  Shih-Yu Yeh ,  Wei-Kang Cheng ,  Shyi-Ming Pan ,  Siang-Fu Hong ,  Chih-Shu Huang ,  Tzu-Hsiang Wang ,  Shih-Chieh Tang ,  Cheng-Kuang Yang

IPC: F21V21/14 ,  H01L33/50 ,  H01L33/48 ,  H01L33/44 ,  F21K9/232 ,  F21V21/00 ,  H01L25/075 ,  F21V29/85 ,  F21V3/02 ,  F21V17/10 ,  F21V23/06 ,  H01L23/00 ,  H01L33/00 ,  F21Y107/00 ,  F21Y115/10

Abstract: A light-emitting device including a substrate with a top surface and a bottom surface opposite to the top surface and a plurality of LED chips disposed on the top surface and configured to generate a top light visible above the top surface and a bottom light visible beneath the bottom surface, each LED chip comprising a plurality of light-emitting surfaces. The substrate has a thickness greater than 200 μm and comprises aluminum oxide, sapphire, glass, plastic, or rubber. The plurality of LED chips has an incident light with a wavelength of 420-470 nm. The top light and the bottom light have a color temperature difference of not greater than 1500K.

公开(公告)号：US10553563B2

公开(公告)日：2020-02-04

申请号：US15993102

申请日：2018-05-30

Applicant: EPISTAR CORPORATION

Inventor： Min-Hsun Hsieh ,  Jai-Tai Kuo ,  Chang-Hsieh Wu ,  Tzu-Hsiang Wang ,  Chi-Chih Pu ,  Ya-Wen Lin ,  Pei-Yu Li

IPC: H01L23/52 ,  H01L25/065

Abstract: An electronic device includes a top carrier having a first top surface and a first bottom surface, a first electronic element formed on the first top surface, a second electronic element formed on the first bottom surface, a bottom carrier below the top carrier and having a second top surface near the top carrier, and a controller formed on the second top surface.

公开(公告)号：US12243967B2

公开(公告)日：2025-03-04

申请号：US17565158

申请日：2021-12-29

Applicant: EPISTAR CORPORATION ,  Yenrich Technology Corporation

Inventor： Chi-Chih Pu ,  Li-Yuan Huang ,  Tzu-Hsiang Wang ,  Ya-Wen Lin

IPC: H01L33/48 ,  H01L25/075 ,  H01L33/38 ,  H01L33/62

Abstract: A pixel package includes an electrode structure, a plurality of light-emitting units arranged on the electrode structure, and a light transmitting layer. The electrode structure has an upper layer with a first upper sheet, a lower layer with a first lower sheet, and a supporting layer arranged between the upper layer and the lower layer. The electrode structure and the plurality of light-emitting units are fully embedded in the light transmitting layer. In a top view of the pixel package, the first upper sheet is overlapped with and larger than the first lower sheet.

公开(公告)号：US12154885B2

公开(公告)日：2024-11-26

申请号：US18450373

申请日：2023-08-15

Applicant: EPISTAR CORPORATION

Inventor： Min-Hsun Hsieh ,  Shih-An Liao ,  Ying-Yang Su ,  Hsin-Mao Liu ,  Tzu-Hsiang Wang ,  Chi-Chih Pu

IPC: H01L23/00 ,  B23K26/22 ,  B23K101/40 ,  H01L23/498 ,  H01L25/075 ,  H01L25/16

Abstract: Disclosed is a die-bonding method which provides a target substrate having a circuit structure with multiple electrical contacts and multiple semiconductor elements each semiconductor element having a pair of electrodes, arranges the multiple semiconductor elements on the target substrate with the pair of electrodes of each semiconductor element aligned with two corresponding electrical contacts of the target substrate, and applies at least one energy beam to join and electrically connect the at least one pair of electrodes of every at least one of the multiple semiconductor elements and the corresponding electrical contacts aligned therewith in a heating cycle by heat carried by the at least one energy beam in the heating cycle. The die-bonding method delivers scattering heated dots over the target substrate to avoid warpage of PCB and ensures high bonding strength between the semiconductor elements and the circuit structure of the target substrate.

公开(公告)号：US11530804B2

公开(公告)日：2022-12-20

申请号：US17153050

申请日：2021-01-20

Applicant: EPISTAR CORPORATION

Inventor： Min-Hsun Hsieh ,  Ying-Yang Su ,  Shih-An Liao ,  Hsin-Mao Liu ,  Tzu-Hsiang Wang ,  Chi-Chih Pu

IPC: F21V23/00 ,  H01L25/075 ,  H01L33/62 ,  H01L25/16 ,  F21Y115/10

Abstract: A light-emitting device includes a first light-emitting module, a second light-emitting module, a conductive layer and an insulation layer. The first light-emitting module includes a first substrate having a first cavity, a first sidewall, and a light-emitting component disposed on the first substrate. The second module includes a second substrate having a second cavity corresponding to the first cavity and a second sidewall corresponding to the first sidewall. The conductive layer is directly connected to the first cavity and the second cavity and electrically connect the first light-emitting module and the second light-emitting module. The insulation layer is directly connected to the first sidewall and the second sidewall.