公开(公告)号：US20170200866A1

公开(公告)日：2017-07-13

申请号：US15405548

申请日：2017-01-13

Applicant: EPISTAR CORPORATION

Inventor： Jar-Yu WU ,  Chun-Lung TSENG ,  Ching-Hsing SHEN ,  Wei-Ting CHENG ,  Jui-Fen CHIEN ,  Yu-Ming KUNG ,  Chiao-Yao CHENG

IPC: H01L33/46 ,  H01L33/58 ,  H01L33/40 ,  H01L33/00 ,  H01L33/42

CPC classification number: H01L33/46 ,  H01L27/156 ,  H01L33/0095 ,  H01L33/20 ,  H01L33/405 ,  H01L33/42 ,  H01L33/58 ,  H01L2933/0016 ,  H01L2933/0025

Abstract: A manufacturing method of a light-emitting device is disclosed. The method includes: providing a semiconductor wafer, including a substrate having a first surface and a second surface opposite to the first surface; and a semiconductor stack on the first surface; removing a portion of the semiconductor stack to form an exposed region; forming a first reflective structure on the exposed region; and providing a radiation on the second surface corresponding to a position of the first reflective structure.