公开(公告)号：US09793451B2

公开(公告)日：2017-10-17

申请号：US14553513

申请日：2014-11-25

Applicant: EPISTAR CORPORATION

Inventor： Chia-Liang Hsu ,  Han-Min Wu ,  Ye-Ming Hsu ,  Chien-Fu Huang ,  Tzu-Chieh Hsu ,  Min-Hsun Hsieh

IPC: H01L33/50 ,  H01L27/15 ,  H01L33/56 ,  H01L33/54 ,  H01L33/60 ,  F21V8/00 ,  H01L33/48

CPC classification number: H01L33/56 ,  G02B6/0025 ,  G02B6/0031 ,  G02B6/0073 ,  H01L33/48 ,  H01L33/486 ,  H01L33/50 ,  H01L33/507 ,  H01L33/54 ,  H01L33/60 ,  H01L2224/48091 ,  H01L2924/00014

Abstract: An encapsulated light-emitting diode device is disclosed. The encapsulated light-emitting diode device includes a circuit carrier including a surface; a light-emitting device including a transparent substrate, the transparent substrate including a first surface and a second surface, and the first surface and the surface of the circuit carrier includes an included angle larger than zero; a light-emitting diode chip located on the first surface of the transparent substrate; and a first transparent glue covering the light-emitting diode chip and formed on the first surface; and a second transparent glue formed on the second surface corresponding to the first transparent glue; wherein the first transparent glue has a circular projection on the first surface and the light-emitting diode chip is substantially located at the center of the circular projection.

公开(公告)号：US10985301B2

公开(公告)日：2021-04-20

申请号：US16001676

申请日：2018-06-06

Applicant: EPISTAR CORPORATION

Inventor： Shih-I Chen ,  Chia-Liang Hsu ,  Tzu-Chieh Hsu ,  Han-Min Wu ,  Ye-Ming Hsu ,  Chien-Fu Huang ,  Chao-Hsing Chen ,  Chiu-Lin Yao ,  Hsin-Mao Liu ,  Chien-Kai Chung

IPC: H01L27/15 ,  H01L33/60 ,  H01L33/62 ,  H01L33/42 ,  H01L33/46 ,  H01L33/08 ,  H01L33/10 ,  H01L33/14 ,  H01L33/44 ,  H01L33/48 ,  H01L25/075 ,  H01L33/38 ,  H01L33/32 ,  H01L33/40

Abstract: A light-emitting device includes a supportive substrate and a first light-emitting element on the supportive substrate. The first light-emitting element includes a first light-emitting stacked layer having a first surface and a second surface opposite to the first surface, and a first transparent layer on the first surface and electrically connected to the first light-emitting stacked layer. A second light-emitting element locates on the supportive substrate and a metal layer electrically connects to the first light-emitting element and the second light-emitting element and physically connects to the first transparent layer. The first light-emitting stacked layer includes a first width and the first transparent layer includes a second width different from the first width from a cross section view of the light-emitting device.

公开(公告)号：US09478698B2

公开(公告)日：2016-10-25

申请号：US14174036

申请日：2014-02-06

Applicant: Epistar Corporation

Inventor： Tsung-Hsien Yang ,  Tzu-Chieh Hsu ,  Yi-Ming Chen ,  Yi-Tang Lai ,  Jhih-Jheng Yang ,  Chih-Wei Wei ,  Ching-Sheng Chen ,  Shih-I Chen ,  Chia-Liang Hsu ,  Ye-Ming Hsu

IPC: H01L33/02 ,  H01L33/00

CPC classification number: H01L33/02 ,  H01L33/0079

Abstract: A light-emitting device is disclosed and comprises: a transparent substrate; a semiconductor light-emitting stack on the transparent substrate, wherein the semiconductor light-emitting stack comprises a first semiconductor layer close to the transparent substrate, a second semiconductor layer away from the transparent substrate, and a light-emitting layer capable of emitting a light disposed between the first semiconductor layer and the second semiconductor layer; and a bonding layer between the transparent substrate and the semiconductor light-emitting stack, wherein the bonding layer has a gradually changed refractive index, and each of critical angles at the bonding layer and the transparent substrate for the light emitted from the light-emitting layer towards the transparent substrate is larger than 35 degrees.

Abstract translation: 公开了一种发光器件，包括：透明衬底; 在所述透明基板上的半导体发光层，其中，所述半导体发光层包括靠近所述透明基板的第一半导体层，远离所述透明基板的第二半导体层，以及能够发光的发光层 设置在第一半导体层和第二半导体层之间; 以及在所述透明基板和所述半导体发光叠层之间的接合层，其中所述接合层具有逐渐变化的折射率，并且所述接合层处的临界角和从所述发光层发射的光的所述透明基板 朝向透明基板大于35度。

公开(公告)号：US09997687B2

公开(公告)日：2018-06-12

申请号：US15401710

申请日：2017-01-09

Applicant: EPISTAR CORPORATION

Inventor： Shih-I Chen ,  Chia-Liang Hsu ,  Tzu-Chieh Hsu ,  Han-Min Wu ,  Ye-Ming Hsu ,  Chien-Fu Huang ,  Chao-Hsing Chen ,  Chiu-Lin Yao ,  Hsin-Mao Liu ,  Chien-Kai Chung

IPC: H01L33/38 ,  H01L33/46 ,  H01L33/60 ,  H01L33/62 ,  H01L27/15 ,  H01L33/42 ,  H01L33/08 ,  H01L33/10 ,  H01L33/14 ,  H01L33/44 ,  H01L33/48 ,  H01L25/075 ,  H01L33/32 ,  H01L33/40

CPC classification number: H01L33/62 ,  H01L25/0753 ,  H01L27/15 ,  H01L33/08 ,  H01L33/10 ,  H01L33/145 ,  H01L33/32 ,  H01L33/382 ,  H01L33/385 ,  H01L33/40 ,  H01L33/42 ,  H01L33/44 ,  H01L33/46 ,  H01L33/483 ,  H01L33/60 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A light-emitting device comprising: a supportive substrate; a transparent layer formed on the supportive substrate, and the transparent layer comprising conductive metal oxide material; a light-emitting stacked layer comprising an active layer formed on the transparent layer; and an etching-stop layer formed between the light-emitting stacked layer and the supportive substrate and contacting the transparent layer, wherein a thickness of the etching-stop layer is thicker than that of the transparent layer.

公开(公告)号：US09577170B2

公开(公告)日：2017-02-21

申请号：US14663544

申请日：2015-03-20

Applicant: Epistar Corporation

Inventor： Shih-I Chen ,  Chia-Liang Hsu ,  Tzu-Chieh Hsu ,  Han-Min Wu ,  Ye-Ming Hsu ,  Chien-Fu Huang ,  Chao-Hsing Chen ,  Chiu-Lin Yao ,  Hsin-Mao Liu ,  Chien-Kai Chung

IPC: H01L33/62 ,  H01L27/15 ,  H01L33/42 ,  H01L33/46 ,  H01L33/08 ,  H01L33/10 ,  H01L33/14 ,  H01L33/44 ,  H01L33/48 ,  H01L33/32 ,  H01L33/38 ,  H01L33/40

CPC classification number: H01L33/62 ,  H01L25/0753 ,  H01L27/15 ,  H01L33/08 ,  H01L33/10 ,  H01L33/145 ,  H01L33/32 ,  H01L33/382 ,  H01L33/385 ,  H01L33/40 ,  H01L33/42 ,  H01L33/44 ,  H01L33/46 ,  H01L33/483 ,  H01L33/60 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A light-emitting device is disclosed. The light-emitting device comprises a supportive substrate; a first light-emitting element and a second light-emitting element on the supportive substrate, wherein the first light-emitting element comprises a transparent layer on the supportive substrate, a first light-emitting stacked layer on the transparent layer, and a plurality of contact parts between the transparent layer and the first light-emitting stacked layer; and the second light-emitting element comprises an electrode and a second light-emitting stacked layer between the electrode and the supportive substrate; and a metal line on the supportive substrate and electrically connecting the electrode and one of the contact parts.

Abstract translation: 公开了一种发光器件。 发光装置包括支撑基板; 第一发光元件和第二发光元件，其中所述第一发光元件包括在所述支撑基板上的透明层，所述透明层上的第一发光层叠层，以及多个 透明层与第一发光层叠层之间的接触部分; 并且所述第二发光元件包括在所述电极和所述支撑衬底之间的电极和第二发光层叠层; 以及在所述支撑基板上的金属线，并且电连接所述电极和所述接触部分之一。

公开(公告)号：US20130200414A1

公开(公告)日：2013-08-08

申请号：US13752423

申请日：2013-01-29

Applicant: Epistar corporation

Inventor： Chia-Liang Hsu ,  Han-Min Wu ,  Ye-Ming Hsu ,  Chien-Fu Huang ,  Tzu-Chieh Hsu ,  Min-Hsun Hsieh

IPC: H01L33/50

CPC classification number: H01L33/56 ,  G02B6/0025 ,  G02B6/0031 ,  G02B6/0073 ,  H01L33/48 ,  H01L33/486 ,  H01L33/50 ,  H01L33/507 ,  H01L33/54 ,  H01L33/60 ,  H01L2224/48091 ,  H01L2924/00014

Abstract: An encapsulated light-emitting diode device is disclosed. The encapsulated light-emitting diode device includes a circuit carrier including a surface; a light-emitting device including a transparent substrate, the transparent substrate including a first surface and a second surface; a light-emitting diode chip located on the first surface of the transparent substrate; and a first transparent glue covering the light-emitting diode chip and formed on the first surface; wherein the first surface and the surface comprise an included angle larger than zero; wherein the first transparent glue has a circular projection on the first surface and the light-emitting diode chip is substantially located at the center of the circular projection.

Abstract translation: 公开了封装的发光二极管装置。 封装的发光二极管装置包括：包括表面的电路载体; 包括透明基板的发光装置，所述透明基板包括第一表面和第二表面; 位于透明基板的第一表面上的发光二极管芯片; 以及覆盖所述发光二极管芯片并形成在所述第一表面上的第一透明胶; 其中所述第一表面和所述表面包括大于零的夹角; 其中所述第一透明胶在所述第一表面上具有圆形突起，并且所述发光二极管芯片基本上位于所述圆形突起的中心。