公开(公告)号：US20190051791A1

公开(公告)日：2019-02-14

申请号：US16159251

申请日：2018-10-12

Applicant: EPISTAR CORPORATION

Inventor： Po-Shun CHIU ,  De-Shan KUO ,  Jhih-Jheng YANG ,  Jiun-Ru HUANG ,  Jian-Huei LI ,  Ying-Chieh CHEN ,  Zi-Jin LIN

IPC: H01L33/00 ,  H01L33/22 ,  H01L33/10

CPC classification number: H01L33/0095 ,  H01L33/10 ,  H01L33/22

Abstract: A method of manufacturing a light-emitting device is disclosed. The method includes providing a light-emitting diode wafer, including a substrate and a semiconductor stack on the substrate, wherein the semiconductor stack has a lower surface facing the substrate and an upper surface opposite to the lower surface; providing a first laser on the light-emitting diode wafer and irradiating the light-emitting diode wafer from the upper surface to form a plurality of scribing lines on the upper surface; providing an etching process; providing and focusing a second laser on an interior of the substrate to form one or a plurality of textured areas in the substrate; and providing force on the light-emitting diode wafer to separate the light-emitting diode wafer into a plurality of light-emitting diode chips along the plurality of scribing lines.

公开(公告)号：US20170294553A1

公开(公告)日：2017-10-12

申请号：US15626993

申请日：2017-06-19

Applicant: EPISTAR CORPORATION

Inventor： Po-Shun CHIU ,  De-Shan KUO ,  Jhih-Jheng YANG ,  Jiun-Ru HUANG ,  Jian-Huei LI ,  Ying-Chieh CHEN ,  Zi-Jin LIN

IPC: H01L33/00 ,  H01L33/22

CPC classification number: H01L33/0095 ,  H01L33/10 ,  H01L33/22

Abstract: A manufacturing method of light-emitting device is disclosed. The method includes providing an LED wafer comprising a substrate and a semiconductor stack formed on the substrate, wherein the semiconductor stack has a lower surface facing the substrate and an upper surface opposite to the lower surface; providing a first laser to the LED wafer and irradiating the LED wafer from the upper surface to form a plurality of scribing lines on the upper surface; providing and focusing a second laser on an interior of the substrate to form a plurality of textured areas in the substrate; and providing force on the LED wafer to separate the LED wafer into a plurality of LED chips.