1.
    发明专利
    未知

    公开(公告)号:SE0001900D0

    公开(公告)日:2000-05-22

    申请号:SE0001900

    申请日:2000-05-22

    Abstract: The invention relates to a cover ( 200,300,400,500,600 ) for an electronic device ( 100 ), which electronic device comprises a substrate ( 110 ) and at least two electronic components ( 120,130 ), one of which generates an electromagnetic field around itself, where the cover has a first main surface ( 210 ) that faces towards the electronic device, comprises a material that conducts current, and is designed and arranged in such a way in relation to the electronic components that a cooling medium can pass from the first ( 120 ) to the second ( 130 ) electronic component. The invention is characterized in that, by virtue of its shape and its material content, the cover has been given an increased ability to absorb at least part of the electromagnetic field that is generated by at least one of the electronic components. Part of the increased absorbing ability has been achieved by the first main surface of the cover having a shape that minimizes the number of parallel surfaces between the electronic device and the first main surface. The cover can suitably have a number of conical protrusions protruding in the direction towards the electronic components ( 120,130 ).

    2.
    发明专利
    未知

    公开(公告)号:SE0101158D0

    公开(公告)日:2001-03-30

    申请号:SE0101158

    申请日:2001-03-30

    Abstract: The present invention use the properties of a TDD-transmission on a general mixer in such a manner that in the transmit mode a first RF signal is amplified in the mixer with an amplification factor greater than, or equal to, or less than one, and in the receive mode the received RF signal is mixed with a second RF signal.

    3.
    发明专利
    未知

    公开(公告)号:SE520785C2

    公开(公告)日:2003-08-26

    申请号:SE0001900

    申请日:2000-05-22

    Abstract: The invention relates to a cover ( 200,300,400,500,600 ) for an electronic device ( 100 ), which electronic device comprises a substrate ( 110 ) and at least two electronic components ( 120,130 ), one of which generates an electromagnetic field around itself, where the cover has a first main surface ( 210 ) that faces towards the electronic device, comprises a material that conducts current, and is designed and arranged in such a way in relation to the electronic components that a cooling medium can pass from the first ( 120 ) to the second ( 130 ) electronic component. The invention is characterized in that, by virtue of its shape and its material content, the cover has been given an increased ability to absorb at least part of the electromagnetic field that is generated by at least one of the electronic components. Part of the increased absorbing ability has been achieved by the first main surface of the cover having a shape that minimizes the number of parallel surfaces between the electronic device and the first main surface. The cover can suitably have a number of conical protrusions protruding in the direction towards the electronic components ( 120,130 ).

    4.
    发明专利
    未知

    公开(公告)号:SE0001900L

    公开(公告)日:2001-11-23

    申请号:SE0001900

    申请日:2000-05-22

    Abstract: The invention relates to a cover ( 200,300,400,500,600 ) for an electronic device ( 100 ), which electronic device comprises a substrate ( 110 ) and at least two electronic components ( 120,130 ), one of which generates an electromagnetic field around itself, where the cover has a first main surface ( 210 ) that faces towards the electronic device, comprises a material that conducts current, and is designed and arranged in such a way in relation to the electronic components that a cooling medium can pass from the first ( 120 ) to the second ( 130 ) electronic component. The invention is characterized in that, by virtue of its shape and its material content, the cover has been given an increased ability to absorb at least part of the electromagnetic field that is generated by at least one of the electronic components. Part of the increased absorbing ability has been achieved by the first main surface of the cover having a shape that minimizes the number of parallel surfaces between the electronic device and the first main surface. The cover can suitably have a number of conical protrusions protruding in the direction towards the electronic components ( 120,130 ).

    Electromagnetic shield for an electronic device

    公开(公告)号:AU6092001A

    公开(公告)日:2001-12-03

    申请号:AU6092001

    申请日:2001-05-22

    Abstract: The invention relates to a cover ( 200,300,400,500,600 ) for an electronic device ( 100 ), which electronic device comprises a substrate ( 110 ) and at least two electronic components ( 120,130 ), one of which generates an electromagnetic field around itself, where the cover has a first main surface ( 210 ) that faces towards the electronic device, comprises a material that conducts current, and is designed and arranged in such a way in relation to the electronic components that a cooling medium can pass from the first ( 120 ) to the second ( 130 ) electronic component. The invention is characterized in that, by virtue of its shape and its material content, the cover has been given an increased ability to absorb at least part of the electromagnetic field that is generated by at least one of the electronic components. Part of the increased absorbing ability has been achieved by the first main surface of the cover having a shape that minimizes the number of parallel surfaces between the electronic device and the first main surface. The cover can suitably have a number of conical protrusions protruding in the direction towards the electronic components ( 120,130 ).

    6.
    发明专利
    未知

    公开(公告)号:SE0101159D0

    公开(公告)日:2001-03-30

    申请号:SE0101159

    申请日:2001-03-30

    Abstract: The present invention use the properties of a TDD-transmission on a specific mixer in such a manner that in the transmit mode a first RF signal is amplified in the mixer with an amplification factor greater than, or equal to, or less than one, and in the receive mode the received RF signal is mixed with a second RF signal.

Patent Agency Ranking