公开(公告)号：US20160322538A1

公开(公告)日：2016-11-03

申请号：US15105541

申请日：2014-12-17

Applicant: FORSCHUNGSVERBUND BERLIN E.V.

Inventor： Sven EINFELDT ,  Luca REDAELLI ,  Michael KNEISSL

IPC: H01L33/40 ,  H01S5/323 ,  H01L33/58 ,  H01S5/22 ,  H01L33/32 ,  H01L33/38

CPC classification number: H01L33/40 ,  H01L21/28575 ,  H01L29/2003 ,  H01L29/452 ,  H01L33/0075 ,  H01L33/32 ,  H01L33/36 ,  H01L33/38 ,  H01L33/58 ,  H01L2933/0016 ,  H01S5/0425 ,  H01S5/22 ,  H01S5/32341

Abstract: The invention relates to a method for forming at least one metal contact on a surface of a semiconductor and a device with at least one metal contact.The method is used for forming at least one metal contact (60) on a surface (11) of a semiconductor (10) and comprises the steps of: applying a metal layer (20) onto the semiconductor surface (11), applying a mask (40, 50) onto the metal layer (20), and structuring at least the metal layer (20) using the mask (40, 50), wherein lateral deposits (21) of the metal are produced on the mask by the structuring so that the mask is embedded between the deposits (21) and the structured metal layer (20′) after the structuring. The method is characterized by a conductive hard mask.Since the mask is conductive, it can remain embedded in the metal. It is not necessary to remove the deposits. The deposits and the mask form a part of the contact.

Abstract translation: 由于掩模是导电的，它可以保持嵌入在金属中。 没有必要去除沉积物。 沉积物和掩模形成接触的一部分。

公开(公告)号：US20140367734A1

公开(公告)日：2014-12-18

申请号：US14475597

申请日：2014-09-03

Applicant: Forschungsverbund Berlin E.V.

Inventor： Michael KNEISSL ,  Neysha LOBO

IPC: H01L33/56 ,  H01L33/48 ,  H01L33/32 ,  H01L33/38

CPC classification number: H01L33/56 ,  H01L33/32 ,  H01L33/38 ,  H01L33/483 ,  H01L33/54 ,  H01L2224/13 ,  H01L2224/48091 ,  H01L2924/00014

Abstract: The present invention relates to an encapsulant for ultraviolet light emitting diodes. It is an object of the present invention to provide an encapsulant for UV LEDs emitting below 350 nm resulting in an increased extraction efficiency of the LED. According to the invention, a light emitting diode is disclosed comprising a radiation zone (12) which is electrically connected to a first contact (14) and to a second contact (16), and an encapsulant (18) encapsulating at least part of the radiation zone (12), the first contact (14) and the second contact (16), wherein the encapsulant (18) comprises polydimethylsiloxane.

Abstract translation: 本发明涉及紫外线发光二极管的密封剂。 本发明的目的是提供一种用于发射低于350nm的UV LED的密封剂，从而提高LED的提取效率。 根据本发明，公开了一种发光二极管，其包括电连接到第一触点（14）和第二触点（16）的辐射区（12），以及密封剂（18），其封装至少一部分 辐射区（12），第一接触（14）和第二接触（16），其中密封剂（18）包含聚二甲基硅氧烷。