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公开(公告)号：DE50204149D1
公开(公告)日：2005-10-13
申请号：DE50204149
申请日：2002-05-14
Applicant: FORSCHUNGSVERBUND BERLIN EV
Inventor： BOYLE MARK , ROSENFELD AKARDI , HERTEL INGOLF , STOIAN RAZVAN , KORN GEORG , THOSS ANDREAS
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公开(公告)号：DE102005020072A1
公开(公告)日：2006-11-02
申请号：DE102005020072
申请日：2005-04-22
Applicant: FORSCHUNGSVERBUND BERLIN EV
Inventor： EHRENTRAUT LUTZ , HERTEL INGOLF , ROSENFELD ARKADI
Abstract: The invention relates to a method for finely polishing/structuring thermosensitive dielectric materials, in particular materials exhibiting a low thermal expansion coefficient, by a laser beam consisting in directing an intensive ultrashort laser beam to a processable material surface, in adjusting the action time within a range from 10-13 s to 10-11 s and a laser pulse energy in such a way that it is less than an ablation threshold but sufficient for provoking a Coulomb explosion. The inventive method makes it possible to carry out a material removal within a nanometer range by means of laser ultrashort pulses ranging between picoseconds and subpicoseconds, wherein the material surface is finely polished during a pre-ablation process step (removal less than the ablation range) and the processable surface is low-heated (approximately up to 10 ° C., only) due to the extremely shot laser beam action time.
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公开(公告)号：ES2248488T3
公开(公告)日：2006-03-16
申请号：ES02090174
申请日：2002-05-14
Applicant: FORSCHUNGSVERBUND BERLIN EV
Inventor： BOYLE MARK , ROSENFELD AKARDI , HERTEL INGOLF , STOIAN RAZVAN , KORN GEORG , THOSS ANDREAS
IPC: B23K26/0622 , B23K26/40 , C03C23/00 , C04B41/00 , C04B41/80 , G02B6/12 , B23K26/00 , B23K26/06 , C04B35/52
Abstract: Procedimiento de microestructuración directa de materiales por medio de al menos un impulso individual ultracorto o una secuencia de impulsos con aportación de energía definida al material, ajustándose la energía y la duración del impulso en función del material a mecanizar, caracterizado porque se dirigen sucesivamente al menos dos impulsos de láser o trenes de impulsos conformados en el tiempo hacia la superficie del material a mecanizar y se ajusta la distancia de dos impulsos o trenes de impulsos consecutivos para que sea más pequeña o igual que picosegundos, con lo que el impulso siguiente incide en el material a mecanizar mientras dura todavía la variación producida en el primer impulso.
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公开(公告)号：DE102005020072B4
公开(公告)日：2007-12-06
申请号：DE102005020072
申请日：2005-04-22
Applicant: FORSCHUNGSVERBUND BERLIN EV
Inventor： EHRENTRAUT LUTZ , HERTEL INGOLF , ROSENFELD ARKADI
Abstract: The invention relates to a method for finely polishing/structuring thermosensitive dielectric materials, in particular materials exhibiting a low thermal expansion coefficient, by a laser beam consisting in directing an intensive ultrashort laser beam to a processable material surface, in adjusting the action time within a range from 10-13 s to 10-11 s and a laser pulse energy in such a way that it is less than an ablation threshold but sufficient for provoking a Coulomb explosion. The inventive method makes it possible to carry out a material removal within a nanometer range by means of laser ultrashort pulses ranging between picoseconds and subpicoseconds, wherein the material surface is finely polished during a pre-ablation process step (removal less than the ablation range) and the processable surface is low-heated (approximately up to 10 ° C., only) due to the extremely shot laser beam action time.
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公开(公告)号：AT186334T
公开(公告)日：1999-11-15
申请号：AT97920530
申请日：1997-03-14
Applicant: FORSCHUNGSVERBUND BERLIN EV
Inventor： CAMPBELL ELEANOR , HERTEL INGOLF , TELLGMANN RALF
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Patent Agency Ranking
公开(公告)号：AT527080T
公开(公告)日：2011-10-15
申请号：AT06725207
申请日：2006-03-21
Applicant: FORSCHUNGSVERBUND BERLIN EV
Inventor： EHRENTRAUT LUTZ , HERTEL INGOLF , ROSENFELD ARKADI
Abstract: The invention relates to a method for finely polishing/structuring thermosensitive dielectric materials, in particular materials exhibiting a low thermal expansion coefficient, by a laser beam consisting in directing an intensive ultrashort laser beam to a processable material surface, in adjusting the action time within a range from 10-13 s to 10-11 s and a laser pulse energy in such a way that it is less than an ablation threshold but sufficient for provoking a Coulomb explosion. The inventive method makes it possible to carry out a material removal within a nanometer range by means of laser ultrashort pulses ranging between picoseconds and subpicoseconds, wherein the material surface is finely polished during a pre-ablation process step (removal less than the ablation range) and the processable surface is low-heated (approximately up to 10 ° C., only) due to the extremely shot laser beam action time.
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公开(公告)号：AT304183T
公开(公告)日：2005-09-15
申请号：AT02090174
申请日：2002-05-14
Applicant: FORSCHUNGSVERBUND BERLIN EV
Inventor： BOYLE MARK , ROSENFELD AKARDI , HERTEL INGOLF , STOIAN RAZVAN , KORN GEORG , THOSS ANDREAS
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公开(公告)号：DE10125206B4
公开(公告)日：2005-03-10
申请号：DE10125206
申请日：2001-05-14
Applicant: FORSCHUNGSVERBUND BERLIN EV
Inventor： BOYLE MARK , HERTEL INGOLF , KORN GEORG , ROSENFELD ARKADI , RAZWAN STOIAN , THOS ANDREAS
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公开(公告)号：DE59700665D1
公开(公告)日：1999-12-09
申请号：DE59700665
申请日：1997-03-14
Applicant: FORSCHUNGSVERBUND BERLIN EV
Inventor： CAMPBELL ELEANOR , HERTEL INGOLF , TELLGMANN RALF
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公开(公告)号：AU2690997A
公开(公告)日：1997-10-01
申请号：AU2690997
申请日：1997-03-14
Applicant: FORSCHUNGSVERBUND BERLIN EV
Inventor： CAMPBELL ELEANOR , HERTEL INGOLF , TELLGMANN RALF
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