Abstract:
PROBLEM TO BE SOLVED: To provide a negative resist composition which exhibits good sensitivity and good pattern shape and ensures little residue and little residual film in an unexposed portion, and a pattern forming method using the same. SOLUTION: The negative resist composition contains (A) an alkali-soluble resin, (B) a compound having a radical-polymerizable group and an alkali-soluble group, and (C) a photoradical generator. The pattern forming method using the same is also provided. COPYRIGHT: (C)2010,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide a negative resist composition less liable to cause a film thickness loss and pattern collapse and a pattern forming method. SOLUTION: The negative resist composition comprises: (A) an alkali-soluble resin; (B) a crosslinking agent which crosslinks an alkali-soluble resin under the action of an acid; (C1) a compound which allows a crosslinking reaction to proceed upon irradiation with actinic rays or radiation; (C2) a photoradical generator; and (D) a compound having a radical polymerizable group. The pattern forming method is also provided. COPYRIGHT: (C)2010,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To solve the problems of the performance improving technique of microphotofabrication using far-ultraviolet light, particularly ArF excimer laser light of 193 nm wavelength, specifically to provide a negative resist composition which, even in fine pattern formation, avoids pattern collapse and exhibits good resolution, and to provide a pattern forming method using the composition. SOLUTION: The negative resist composition includes (A) an alkali-soluble resin, (B) a compound having a radical polymerizable group, and (C) a photoradical generator. The pattern forming method using the composition is also provided. COPYRIGHT: (C)2009,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide a method for stably forming a high-accuracy fine pattern to be used in the production process of a semiconductor such as IC, in the production of a circuit substrate of liquid crystal, thermal head and the like or in other photofabrication processes, a resin composition to be used in the method and a developing solution to be used in the method. SOLUTION: The pattern forming method includes: (1) coating a resist composition that decreases the solubility in a negative developing solution upon irradiation with actinic rays or radiation; (2) exposing; and (3) developing with a negative developing solution. There are also provided the resist composition to be used in the method and the developing solution and a rinsing solution to be used in the method. COPYRIGHT: (C)2009,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide an alignment layer having reduced irregularity like interference fringes.SOLUTION: The alignment layer comprises a composition containing: a first polymer having a repeating unit having at least one hydrophilic group selected from a carboxyl group and its salt, sulfonic acid group and its salt, amino group and its salt, phosphoric acid group and its salt, phosphonic acid group and its salt, phosphinic acid group and its salt, hydroxyl group, amide group and sulfonamide group; and a second polymer having a repeating unit having an aromatic group. The mass proportion (r1) of the first polymer is higher than the mass proportion (r2) of the second polymer.
Abstract:
PROBLEM TO BE SOLVED: To provide a negative resist composition which ensures an adequate bridge margin (that is, substantially avoids the occurrence of the defect that patterns connect with each other). SOLUTION: The negative resist composition contains (A) a resin whose solubility in an alkali developer decreases by the action of an acid, (B) a cationic polymerizable compound, (C) a cationic photopolymerization initiator, and (D) a compound which generates an acid upon irradiation with actinic rays or radiation. A pattern-forming method using the composition is also provided. COPYRIGHT: (C)2010,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide a negative resist composition exhibiting excellent sensitivity, pattern profile and defocus latitude, and to provide a method for forming a pattern. SOLUTION: The negative resist composition contains (A) an alkali-soluble resin having a repeating unit (a1), containing an alkali-soluble group in organic groups having a sulfonamide structure, organic groups having sulfonimide structure, organic groups having a dicarbonylmethylene structure and organic groups having a naphthol structure, and (a2) a repeating unit having an epoxy structure; (B) a compound having two or more epoxy structures in the molecule; and (C) a photo-acid generator. COPYRIGHT: (C)2010,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To solve the problems of the performance improving technique of microphotofabrication using far-ultraviolet light, particularly ArF excimer laser light of 193 nm wavelength, specifically to provide a negative resist composition which, even in fine pattern formation, avoids pattern collapse and exhibits good resolution. SOLUTION: The negative resist composition includes (A) an alkali-soluble resin, (B) a compound having a conjugated diene structure, and (C) a photo-cationic polymerization initiator. COPYRIGHT: (C)2009,JPO&INPIT