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1.发明申请
公开(公告)号：WO2007043639A9
公开(公告)日：2007-05-31
申请号：PCT/JP2006320437
申请日：2006-10-13
Applicant: FUJIKURA LTD , OKAMOTO MASAHIRO , ITOU SHOUJI , NAKAO OSAMU , SUZUKI TAKANAO , OKUDE SATOSHI
Inventor： OKAMOTO MASAHIRO , ITOU SHOUJI , NAKAO OSAMU , SUZUKI TAKANAO , OKUDE SATOSHI
CPC classification number: H05K1/186 , H01L23/49816 , H01L23/5389 , H01L24/19 , H01L24/24 , H01L24/45 , H01L24/48 , H01L24/73 , H01L25/03 , H01L25/0652 , H01L25/0657 , H01L25/105 , H01L2224/0401 , H01L2224/04105 , H01L2224/12105 , H01L2224/16225 , H01L2224/20 , H01L2224/24227 , H01L2224/32225 , H01L2224/32245 , H01L2224/45015 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/73204 , H01L2224/73265 , H01L2224/73267 , H01L2225/0651 , H01L2225/06513 , H01L2225/06541 , H01L2225/1035 , H01L2225/1058 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01018 , H01L2924/01019 , H01L2924/01029 , H01L2924/01033 , H01L2924/01041 , H01L2924/01042 , H01L2924/01047 , H01L2924/01049 , H01L2924/01074 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/07811 , H01L2924/10253 , H01L2924/12041 , H01L2924/12042 , H01L2924/14 , H01L2924/15153 , H01L2924/1517 , H01L2924/15311 , H01L2924/181 , H01L2924/19041 , H01L2924/30105 , H01L2924/30107 , H01L2924/3511 , H05K3/0058 , H05K3/4069 , H05K3/4614 , H05K3/4617 , H05K2201/10674 , H05K2203/063 , Y10T29/49126 , Y10T29/49128 , Y10T29/4913 , Y10T29/49155 , Y10T29/49165 , H01L2924/00014 , H01L2924/00 , H01L2924/00012 , H01L2924/00015
Abstract: A printed wiring board is provided with a base material, which has at least one wiring and is composed of an adhesive insulating base material and a conductive layer formed on one plane of the insulating base material; a penetrating electrode which is connected to the conductive layer, penetrates the insulating base material and is composed of a conductive paste; and an IC chip having a rewiring section. An IC chip is embedded in an interlayer adhesive material of the base material having the wiring, by connecting the rewiring section with the penetrating electrode. A supporting substrate is arranged on a plane opposite to the rewiring section of the IC chip through the adhesive layer, and the rewiring section and the base material having the wiring constitute a rewiring layer. Therefore, the multilayer printed wiring board having fine components mounted thereon is provided by simple process without increasing the cost and deteriorating the yield.
Abstract translation: 印刷电路板设置有基材，该基材具有至少一个布线，并且由粘合绝缘基材和形成在绝缘基材的一个平面上的导电层构成; 连接到导电层的穿透电极穿透绝缘基材并由导电膏组成; 以及具有重新布线部分的IC芯片。 通过将再布线部与贯通电极连接，将IC芯片嵌入到具有布线的基材的层间粘合材料中。 支撑基板通过粘合剂层布置在与IC芯片的重新布线部分相对的平面上，并且具有布线的重新布线部分和基材构成重新布线层。 因此，通过简单的工艺提供具有安装在其上的精细部件的多层印刷线路板，而不会增加成本并降低成品率。
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公开(公告)号：DK2592915T3
公开(公告)日：2022-04-19
申请号：DK11803570
申请日：2011-07-05
Applicant: FUJIKURA LTD
Inventor： OKAMOTO MASAHIRO
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公开(公告)号：FI126775B
公开(公告)日：2017-05-15
申请号：FI20115084
申请日：2011-01-27
Applicant: FUJIKURA LTD
Inventor： NAKANO OSAMU , HIGUCHI REIJI , ITO SYOUJI , OKAMOTO MASAHIRO
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公开(公告)号：FI20050767A
公开(公告)日：2005-09-16
申请号：FI20050767
申请日：2005-07-19
Applicant: FUJIKURA LTD
Inventor： ITO SHOJI , KISHIHARA RYOICHI , NAKAO OSAMU , HASHIBA HIROKI , OKAMOTO MASAHIRO
IPC: H01L23/538 , H05K3/46 , H05K
Abstract: At least one base material having a wiring circuit that has been formed into a predetermined outer shape is bonded to a motherboard. The motherboard wiring board and the base material having a wiring circuit are electrically connected to each other at least one portion through an inner via hole. The outer shape of the base material having a wiring circuit is smaller than the outer shape of the motherboard, with the base material having a wiring circuit having an island shape on the motherboard.
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公开(公告)号：DK2787799T3
公开(公告)日：2020-05-11
申请号：DK12854222
申请日：2012-11-14
Applicant: FUJIKURA LTD
Inventor： ITOI KAZUHISA , OKAMOTO MASAHIRO
IPC: H05K3/46 , H01L23/367
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Patent Agency Ranking
公开(公告)号：FI122414B
公开(公告)日：2012-01-13
申请号：FI20050767
申请日：2005-07-19
Applicant: FUJIKURA LTD
Inventor： ITO SHOJI , KISHIHARA RYOICHI , NAKAO OSAMU , HASHIBA HIROKI , OKAMOTO MASAHIRO
IPC: H05K3/46 , H01L23/538 , H05K1/02
Abstract: At least one base material having a wiring circuit that has been formed into a predetermined outer shape is bonded to a motherboard. The motherboard wiring board and the base material having a wiring circuit are electrically connected to each other at least one portion through an inner via hole. The outer shape of the base material having a wiring circuit is smaller than the outer shape of the motherboard, with the base material having a wiring circuit having an island shape on the motherboard.
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公开(公告)号：DE112013006630T5
公开(公告)日：2015-10-22
申请号：DE112013006630
申请日：2013-02-08
Applicant: FUJIKURA LTD
Inventor： SANO YOSHINORI , OKAMOTO MASAHIRO
Abstract: Eine Platte mit eingebetteter Komponente, umfassend: eine erste Platte, die eine erste Isolierschicht mit einer ersten und einer zweiten Seite, eine auf der zweiten Seite der ersten Isolierschicht ausgebildete erste leitfähige Schicht und einen leitfähigen Zwischenschichtabschnitt, der die erste Isolierschicht durchstößt, um mit der ersten leitfähigen Schicht verbunden zu sein, und aus der ersten Seite der ersten Isolierschicht hervorragt, einschließt; eine mit dem leitfähigen Zwischenschichtabschnitt verbundene elektrische Komponente; und eine zweite Platte, die eine zweite Isolierschicht mit einer ersten Seite, einer zweiten Seite und einem die elektrische Komponente enthaltenden Öffnungsabschnitt und eine auf mindestens einer der ersten Seite und der zweiten Seite der zweiten Isolierschicht ausgebildete zweite leitfähige Schicht einschließt, wobei die zweite leitfähige Schicht einen Rahmenabschnitt mit einer Rahmenform in einer Draufsicht einschließt, und wobei der Öffnungsabschnitt so ausgebildet ist, dass er die zweite Isolierschicht in Richtung der Dicke über die Gesamtheit der inneren Region des Rahmenabschnitts durchstößt.
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公开(公告)号：FI121774B
公开(公告)日：2011-03-31
申请号：FI20050815
申请日：2005-08-12
Applicant: FUJIKURA LTD
Inventor： NAKANO OSAMU , HIGUCHI REIJI , ITO SYOUJI , OKAMOTO MASAHIRO
Abstract: A base material (20) is arranged on top of at least one first internal layer base material (10), and a second internal base material (30) is arranged underneath the base material (10). And thereafter a surface layer circuitry conductive foil (40) is arranged underneath the base material (30), and subsequently these materials are colaminated for forming a colaminated body (80). While this colaminating operation, conductive portions being formed in the base materials 10, 30 are aligned to electrically connect one another for forming an internal circuitry. And thereafter, an interlayer conductive portion (51) being electrically connected to the internal circuitry is formed, and a minute circuitry is formed on the top of the base material (20) and the conductive foil (40) accordingly.
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公开(公告)号：FI20050815A
公开(公告)日：2005-08-12
申请号：FI20050815
申请日：2005-08-12
Applicant: FUJIKURA LTD
Inventor： NAKANO OSAMU , HIGUCHI REIJI , ITO SYOUJI , OKAMOTO MASAHIRO
Abstract: A base material (20) is arranged on top of at least one first internal layer base material (10), and a second internal base material (30) is arranged underneath the base material (10). And thereafter a surface layer circuitry conductive foil (40) is arranged underneath the base material (30), and subsequently these materials are colaminated for forming a colaminated body (80). While this colaminating operation, conductive portions being formed in the base materials 10, 30 are aligned to electrically connect one another for forming an internal circuitry. And thereafter, an interlayer conductive portion (51) being electrically connected to the internal circuitry is formed, and a minute circuitry is formed on the top of the base material (20) and the conductive foil (40) accordingly.
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公开(公告)号：FI20115084A
公开(公告)日：2011-01-27
申请号：FI20115084
申请日：2011-01-27
Applicant: FUJIKURA LTD
Inventor： NAKANO OSAMU , HIGUCHI REIJI , ITO SYOUJI , OKAMOTO MASAHIRO
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