公开(公告)号：WO2007043639A9

公开(公告)日：2007-05-31

申请号：PCT/JP2006320437

申请日：2006-10-13

Applicant: FUJIKURA LTD ,  OKAMOTO MASAHIRO ,  ITOU SHOUJI ,  NAKAO OSAMU ,  SUZUKI TAKANAO ,  OKUDE SATOSHI

Inventor： OKAMOTO MASAHIRO ,  ITOU SHOUJI ,  NAKAO OSAMU ,  SUZUKI TAKANAO ,  OKUDE SATOSHI

IPC: H05K3/46 ,  H01L23/12

CPC classification number: H05K1/186 ,  H01L23/49816 ,  H01L23/5389 ,  H01L24/19 ,  H01L24/24 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L25/03 ,  H01L25/0652 ,  H01L25/0657 ,  H01L25/105 ,  H01L2224/0401 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/16225 ,  H01L2224/20 ,  H01L2224/24227 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/73267 ,  H01L2225/0651 ,  H01L2225/06513 ,  H01L2225/06541 ,  H01L2225/1035 ,  H01L2225/1058 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01018 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01041 ,  H01L2924/01042 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/07811 ,  H01L2924/10253 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/30105 ,  H01L2924/30107 ,  H01L2924/3511 ,  H05K3/0058 ,  H05K3/4069 ,  H05K3/4614 ,  H05K3/4617 ,  H05K2201/10674 ,  H05K2203/063 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49155 ,  Y10T29/49165 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/00015

Abstract: A printed wiring board is provided with a base material, which has at least one wiring and is composed of an adhesive insulating base material and a conductive layer formed on one plane of the insulating base material; a penetrating electrode which is connected to the conductive layer, penetrates the insulating base material and is composed of a conductive paste; and an IC chip having a rewiring section. An IC chip is embedded in an interlayer adhesive material of the base material having the wiring, by connecting the rewiring section with the penetrating electrode. A supporting substrate is arranged on a plane opposite to the rewiring section of the IC chip through the adhesive layer, and the rewiring section and the base material having the wiring constitute a rewiring layer. Therefore, the multilayer printed wiring board having fine components mounted thereon is provided by simple process without increasing the cost and deteriorating the yield.

Abstract translation: 印刷电路板设置有基材，该基材具有至少一个布线，并且由粘合绝缘基材和形成在绝缘基材的一个平面上的导电层构成; 连接到导电层的穿透电极穿透绝缘基材并由导电膏组成; 以及具有重新布线部分的IC芯片。 通过将再布线部与贯通电极连接，将IC芯片嵌入到具有布线的基材的层间粘合材料中。 支撑基板通过粘合剂层布置在与IC芯片的重新布线部分相对的平面上，并且具有布线的重新布线部分和基材构成重新布线层。 因此，通过简单的工艺提供具有安装在其上的精细部件的多层印刷线路板，而不会增加成本并降低成品率。

公开(公告)号：FI20050767A

公开(公告)日：2005-09-16

申请号：FI20050767

申请日：2005-07-19

Applicant: FUJIKURA LTD

Inventor： ITO SHOJI ,  KISHIHARA RYOICHI ,  NAKAO OSAMU ,  HASHIBA HIROKI ,  OKAMOTO MASAHIRO

IPC: H01L23/538 ,  H05K3/46 ,  H05K

Abstract: At least one base material having a wiring circuit that has been formed into a predetermined outer shape is bonded to a motherboard. The motherboard wiring board and the base material having a wiring circuit are electrically connected to each other at least one portion through an inner via hole. The outer shape of the base material having a wiring circuit is smaller than the outer shape of the motherboard, with the base material having a wiring circuit having an island shape on the motherboard.

公开(公告)号：CA2079936C

公开(公告)日：1998-05-19

申请号：CA2079936

申请日：1992-10-06

Applicant: FUJIKURA LTD

Inventor： TOMINAGA HARUO ,  AJIMURA SHOJI ,  TOMOMATSU KAZUHIKO ,  NAKAO OSAMU ,  KUROSAKA AKIHITO

IPC: C30B15/00 ,  C30B29/32 ,  C30B11/00

Abstract: A mixture of titanium dioxide and an oxide or carbonate of barium includes one or more transition metal elements selected from the group of V, Cr, Mn, Fe, Co, Ni and Cu, in the amount of 2 ppm or more. This mixture is used as a starting material. The mixture is heated to a predetermined temperature to make a melt. Then, a seed crystal of BaTiO3 is brought into contact with the melt under an environment with a low oxygen partial pressure of 0.02 atm. or less. From this state, the above melt is slowly cooled to grow a single crystal on the seed crystal. The thus obtained single crystal is heated in a temperature of 600 .degree.C or more, under an oxidizing environment with its oxygen partial pressure more than 0.1 atm.

公开(公告)号：FI122414B

公开(公告)日：2012-01-13

申请号：FI20050767

申请日：2005-07-19

Applicant: FUJIKURA LTD

Inventor： ITO SHOJI ,  KISHIHARA RYOICHI ,  NAKAO OSAMU ,  HASHIBA HIROKI ,  OKAMOTO MASAHIRO

IPC: H05K3/46 ,  H01L23/538 ,  H05K1/02

Abstract: At least one base material having a wiring circuit that has been formed into a predetermined outer shape is bonded to a motherboard. The motherboard wiring board and the base material having a wiring circuit are electrically connected to each other at least one portion through an inner via hole. The outer shape of the base material having a wiring circuit is smaller than the outer shape of the motherboard, with the base material having a wiring circuit having an island shape on the motherboard.

公开(公告)号：DE69201849D1

公开(公告)日：1995-05-04

申请号：DE69201849

申请日：1992-10-08

Applicant: FUJIKURA LTD

Inventor： KUROSAKA AKIHITO ,  AJIMURA SHOJI ,  NAKAO OSAMU ,  TOMOMATSU KAZUHIKO ,  TOMINAGA HARUO

IPC: C30B15/00 ,  C30B29/32

Abstract: A mixture of titanium dioxide and an oxide or carbonate of barium includes one or more transition metal elements selected from the group of V, Cr, Mn, Fe, Co, Ni and Cu, in the amount of 2 ppm or more. This mixture is used as a starting material. The mixture is heated to a predetermined temperature to make a melt (2). Then, a seed crystal (7) of BaTiO is brought into contact with the melt under an environment with a low oxygen partial pressure of 0.02 atm. or less. From this state, the above melt is slowly cooled to grow a single crystal on the seed crystal. The thus obtained single crystal is heated in a temperature of 600 DEG C or more, under an oxidizing environment with its oxygen partial pressure more than 0.1 atm.

公开(公告)号：CA2079936A1

公开(公告)日：1993-04-09

申请号：CA2079936

申请日：1992-10-06

Applicant: FUJIKURA LTD

Inventor： KUROSAKA AKIHITO ,  AJIMURA SHOJI ,  NAKAO OSAMU ,  TOMOMATSU KAZUHIKO ,  TOMINAGA HARUO

IPC: C30B15/00 ,  C30B29/32

Abstract: A mixture of titanium dioxide and an oxide or carbonate of barium includes one or more transition metal elements selected from the group of V, Cr, Mn, Fe, Co, Ni and Cu, in the amount of 2 ppm or more. This mixture is used as a starting material. The mixture is heated to a predetermined temperature to make a melt (2). Then, a seed crystal (7) of BaTiO is brought into contact with the melt under an environment with a low oxygen partial pressure of 0.02 atm. or less. From this state, the above melt is slowly cooled to grow a single crystal on the seed crystal. The thus obtained single crystal is heated in a temperature of 600 DEG C or more, under an oxidizing environment with its oxygen partial pressure more than 0.1 atm.

公开(公告)号：DE69201849T2

公开(公告)日：1995-10-12

申请号：DE69201849

申请日：1992-10-08

Applicant: FUJIKURA LTD

Inventor： KUROSAKA AKIHITO ,  AJIMURA SHOJI ,  NAKAO OSAMU ,  TOMOMATSU KAZUHIKO ,  TOMINAGA HARUO

IPC: C30B15/00 ,  C30B29/32

Abstract: A mixture of titanium dioxide and an oxide or carbonate of barium includes one or more transition metal elements selected from the group of V, Cr, Mn, Fe, Co, Ni and Cu, in the amount of 2 ppm or more. This mixture is used as a starting material. The mixture is heated to a predetermined temperature to make a melt (2). Then, a seed crystal (7) of BaTiO is brought into contact with the melt under an environment with a low oxygen partial pressure of 0.02 atm. or less. From this state, the above melt is slowly cooled to grow a single crystal on the seed crystal. The thus obtained single crystal is heated in a temperature of 600 DEG C or more, under an oxidizing environment with its oxygen partial pressure more than 0.1 atm.

公开(公告)号：EP1484952A4

公开(公告)日：2008-04-23

申请号：EP03703355

申请日：2003-02-21

Applicant: FUJIKURA LTD

Inventor： ITO SHOUJI ,  NAKAO OSAMU ,  HIGUCHI REIJI ,  OKAMOTO MASAHIRO

IPC: H05K3/38 ,  H05K3/40 ,  H05K3/46 ,  H05K1/11

CPC classification number: H05K3/4617 ,  H05K3/386 ,  H05K3/4069 ,  H05K3/4652 ,  H05K2201/0195 ,  H05K2201/0394 ,  H05K2201/0969 ,  H05K2201/09827 ,  H05K2201/09863 ,  H05K2203/0191 ,  H05K2203/1453 ,  Y10T29/49165 ,  Y10T428/12181 ,  Y10T428/24917

Abstract: A base for multilayer wiring boards in which a conductive layer (112) forming a wiring pattern is provided on one side of an insulating base (insulating resin layer (111)), and an adhesive layer (113) for interlayer adhesion is provided on the other side, and a through hole (114) extending through the conductive layer, the insulating base, and the adhesive layer is filled with a conductive resin composition (115) for interlayer electrical connection. The diameter of the conductive layer portion (114b) of the through hole is smaller than those of the insulating base portion and the adhesive layer portion (114a). The electrical connection between the conductive resin composition and the conductive layer is ensured through the back (112a) of the conductive layer.

公开(公告)号：EP2434305A4

公开(公告)日：2015-02-18

申请号：EP10777584

申请日：2010-05-21

Applicant: FUJIKURA LTD

Inventor： OHMORI KENICHI ,  AIZAWA TAKUYA ,  NAKAO OSAMU

IPC: G01R33/05 ,  G01C17/30 ,  G01R33/02

CPC classification number: G01R33/05 ,  G01C17/30 ,  G01R33/04

公开(公告)号：EP1951015A4

公开(公告)日：2011-03-23

申请号：EP06811725

申请日：2006-10-13

Applicant: FUJIKURA LTD

Inventor： OKAMOTO MASAHIRO ,  ITOU SHOUJI ,  NAKAO OSAMU ,  SUZUKI TAKANAO ,  OKUDE SATOSHI

IPC: H05K3/46 ,  H01L23/12 ,  H05K1/18 ,  H05K3/40

CPC classification number: H05K1/186 ,  H01L23/49816 ,  H01L23/5389 ,  H01L24/19 ,  H01L24/24 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L25/03 ,  H01L25/0652 ,  H01L25/0657 ,  H01L25/105 ,  H01L2224/0401 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/16225 ,  H01L2224/20 ,  H01L2224/24227 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/73267 ,  H01L2225/0651 ,  H01L2225/06513 ,  H01L2225/06541 ,  H01L2225/1035 ,  H01L2225/1058 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01018 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01041 ,  H01L2924/01042 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/07811 ,  H01L2924/10253 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/30105 ,  H01L2924/30107 ,  H01L2924/3511 ,  H05K3/0058 ,  H05K3/4069 ,  H05K3/4614 ,  H05K3/4617 ,  H05K2201/10674 ,  H05K2203/063 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49155 ,  Y10T29/49165 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/00015

Abstract: A configuration according to the invention includes at least one wired base material configured with an insulating base material having an adhesion property, and an electric conductive layer formed on one side of the insulating base material, a plugging electrode made of an electric conductive paste, connected to the electric conductive layer, and penetrating the insulating base material, and an IC chip having a re-wiring portion, the IC chip being buried in an interlayer binding material, with the re-wiring portion connected to the plugging electrode, having a supporting board disposed on an opposite side to the re-wiring portion of the IC chip, with an adhesion layer in between, and having a re-wiring layer configured with the wired base material and the re-wiring portion. According to the invention, therefore, it is allowed to provide a multi-layer printed wiring board with highly defined components implemented, allowing for a fabrication by facile processes, without causing, among others, increased costs or decreased yields.