公开(公告)号：WO2007029359A1

公开(公告)日：2007-03-15

申请号：PCT/JP2006/301925

申请日：2006-01-31

Applicant: FUCHIGAMI MICRO CO., LTD. ,  OHSAWA, Kenji ,  TSURUTA, Katsuya

Inventor： OHSAWA, Kenji ,  TSURUTA, Katsuya

IPC: F28D15/02

CPC classification number: F28D15/0233 ,  B23P15/26 ,  B23P2700/09 ,  F28D15/046 ,  F28F3/048 ,  H01L23/427 ,  H01L2924/0002 ,  Y10T29/49353 ,  Y10T29/49366 ,  H01L2924/00

Abstract: A thin and flat type heat pipe with enhanced heat conductivity. Between an upper member 22 having a rectangular area 24b on a lower surface and a lower member 20 having a rectangular area 24a on an upper area are provided intermediate plate members 32, 30. The members 32, 30 are each formed with slits 8, constructing a vapor path extending in a planar direction, communicating with the rectangular areas 24a, 24b of the members 22, 20, respectively. Thus, a sealed space is defined by the slits 8 and the rectangular areas 24a, 24b so that a refrigerant is enclosed in the sealed space. Capillary holes 10 are formed through non-slitted portions of the intermediate plate members 32, 30 so that each capillary hole 10 serves as a capillary path of flow extending vertically to communicate with the rectangular areas 24a, 24b of the members 22, 20.

Abstract translation: 具有增强导热性的薄型扁平型热管。 在下表面具有矩形区域24b的上部构件22和在上部区域具有矩形区域24a的下部构件20之间设置有中间板构件32,30。构件32,30各自形成有狭缝8，构造 蒸汽通道，其在平面方向上延伸，分别与构件22,20的矩形区域24a，24b连通。 因此，由狭缝8和矩形区域24a，24b限定密封空间，使得制冷剂被封闭在密封空间中。 毛细孔10通过中间板构件32,30的非切口部分形成，使得每个毛细孔10用作垂直延伸的流动通道，以与构件22,20的矩形区域24a，24b连通。

公开(公告)号：EP1930682A1

公开(公告)日：2008-06-11

申请号：EP06797209.1

申请日：2006-08-31

Applicant: Fuchigami Micro Co.,Ltd.

Inventor： OHSAWA, Kenji ,  TSURUTA, Katsuya

IPC: F28D15/02 ,  H01L23/427

CPC classification number: F28D15/0233 ,  F28D15/046 ,  F28F3/048 ,  H01L23/427 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A small and thin heat pipe 1 with enhanced heat conductivity. Between an upper member 2 having a grid-like upper concave portion 21 on an inside lower surface and a lower member 3 having a grid-like lower concave portion 17 on an inside upper surface are provided intermediate plate members 7 and 8. The members 7, 8 are each formed with multiple vapor diffusion flow paths 10 extending in a planar direction, communicating with the concave portions 21, 17 of the members 2, 3, respectively. Thus, a sealed space is defined therebetween so that a refrigerant is enclosed therein. Capillary flow paths 11 are formed through a portion of the members 7, 8 except where the vapor diffusion flow paths 10 are formed such that the capillary flow paths 11 extend vertically or both vertically and horizontally, communicating with the concave portions 21,17 of the members 2,3.

Abstract translation: 一个小而薄的热管1，具有增强的导热性。 在中间板构件7和8之间设置有在内侧下表面上具有格子状的上凹部21的上部构件2和内侧上表面具有格子状的下部凹部17的下部构件3。 8分别形成有沿平面方向延伸的多个蒸气扩散流路10，分别与构件2,3的凹部21,17连通。 因此，在其间限定密封空间，从而将制冷剂封闭在其中。 除了形成蒸气扩散流路10之外，毛细管流动路径11通过部件7,8的一部分形成，使得毛细管流动路径11垂直或垂直和水平地延伸，与凹部21,17的连通 成员2,3。

公开(公告)号：EP2003703A9

公开(公告)日：2009-04-15

申请号：EP07708068.7

申请日：2007-02-05

Applicant: Fuchigami Micro Co.,Ltd.

Inventor： UEDA, Susumu ,  OHSAWA, Kenji ,  TSURUTA, Katsuya ,  KOTANI, Toshiaki

IPC: H01L33/00 ,  H01S5/024

CPC classification number: H01L33/64 ,  F28D15/0233 ,  F28D15/04 ,  F28D15/046 ,  F28F3/086 ,  H01L24/73 ,  H01L33/648 ,  H01L2224/32245 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/00011 ,  H01L2924/01047 ,  H01L2924/14 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2924/01005 ,  H01L2924/01031 ,  H01L2924/01004 ,  H01L2924/01033

Abstract: A cooling unit main body 25 having vapor diffusion flow paths 42 which extend to the peripheral portion and capillary flow paths 41 formed between the vapor diffusion flow paths 42 and in a concave portion opposite region 47 is provided with a thin concave portion 6 in which an LED chip 2 is mounted. Accordingly, heat from the LED chip 2 can be easily transferred by what corresponds to the thinning of the concave portion 6, and successive circulating phenomenon caused by a refrigerant W is repeated by the heat, and the heat is surely drawn from the LED chip 2 by latent heat at a time when the refrigerant W vaporizes, so that a heat pipe 5 can maintain the light emitting state of the LED chip 2 stably.

Abstract translation: 具有延伸到周边部分的蒸气扩散流路42和形成在蒸气扩散流路42之间的凹部与相对的区域47的毛细流路41的冷却单元主体25设置有薄的凹部6， 安装LED芯片2。 因此，来自LED芯片2的热量能够容易地通过与凹部6的变薄相对应的传递，并且由热量重复由制冷剂W引起的连续的循环现象，并且从LED芯片2可靠地抽出热量 通过在制冷剂W蒸发时的潜热，使得热管5能够稳定地保持LED芯片2的发光状态。

公开(公告)号：EP2003703A2

公开(公告)日：2008-12-17

申请号：EP07708068.7

申请日：2007-02-05

Applicant: Fuchigami Micro Co.,Ltd.

Inventor： UEDA, Susumu ,  OHSAWA, Kenji ,  TSURUTA, Katsuya ,  KOTANI, Toshiaki

IPC: H01L33/00 ,  H01S5/024

CPC classification number: H01L33/64 ,  F28D15/0233 ,  F28D15/04 ,  F28D15/046 ,  F28F3/086 ,  H01L24/73 ,  H01L33/648 ,  H01L2224/32245 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/00011 ,  H01L2924/01047 ,  H01L2924/14 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2924/01005 ,  H01L2924/01031 ,  H01L2924/01004 ,  H01L2924/01033

Abstract: A cooling unit main body 25 having vapor diffusion flow paths 42 which extend to the peripheral portion and capillary flow paths 41 formed between the vapor diffusion flow paths 42 and in a concave portion opposite region 47 is provided with a thin concave portion 6 in which an LED chip 2 is mounted. Accordingly, heat from the LED chip 2 can be easily transferred by what corresponds to the thinning of the concave portion 6, and successive circulating phenomenon caused by a refrigerant W is repeated by the heat, and the heat is surely drawn from the LED chip 2 by latent heat at a time when the refrigerant W vaporizes, so that a heat pipe 5 can maintain the light emitting state of the LED chip 2 stably.