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公开(公告)号：EP2003703A9
公开(公告)日：2009-04-15
申请号：EP07708068.7
申请日：2007-02-05
Applicant: Fuchigami Micro Co.,Ltd.
Inventor： UEDA, Susumu , OHSAWA, Kenji , TSURUTA, Katsuya , KOTANI, Toshiaki
CPC classification number: H01L33/64 , F28D15/0233 , F28D15/04 , F28D15/046 , F28F3/086 , H01L24/73 , H01L33/648 , H01L2224/32245 , H01L2224/48227 , H01L2224/73265 , H01L2924/00011 , H01L2924/01047 , H01L2924/14 , H01L2924/00012 , H01L2924/00 , H01L2924/01005 , H01L2924/01031 , H01L2924/01004 , H01L2924/01033
Abstract: A cooling unit main body 25 having vapor diffusion flow paths 42 which extend to the peripheral portion and capillary flow paths 41 formed between the vapor diffusion flow paths 42 and in a concave portion opposite region 47 is provided with a thin concave portion 6 in which an LED chip 2 is mounted. Accordingly, heat from the LED chip 2 can be easily transferred by what corresponds to the thinning of the concave portion 6, and successive circulating phenomenon caused by a refrigerant W is repeated by the heat, and the heat is surely drawn from the LED chip 2 by latent heat at a time when the refrigerant W vaporizes, so that a heat pipe 5 can maintain the light emitting state of the LED chip 2 stably.
Abstract translation: 具有延伸到周边部分的蒸气扩散流路42和形成在蒸气扩散流路42之间的凹部与相对的区域47的毛细流路41的冷却单元主体25设置有薄的凹部6， 安装LED芯片2。 因此，来自LED芯片2的热量能够容易地通过与凹部6的变薄相对应的传递，并且由热量重复由制冷剂W引起的连续的循环现象，并且从LED芯片2可靠地抽出热量 通过在制冷剂W蒸发时的潜热，使得热管5能够稳定地保持LED芯片2的发光状态。
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公开(公告)号：EP2003703A2
公开(公告)日：2008-12-17
申请号：EP07708068.7
申请日：2007-02-05
Applicant: Fuchigami Micro Co.,Ltd.
Inventor： UEDA, Susumu , OHSAWA, Kenji , TSURUTA, Katsuya , KOTANI, Toshiaki
CPC classification number: H01L33/64 , F28D15/0233 , F28D15/04 , F28D15/046 , F28F3/086 , H01L24/73 , H01L33/648 , H01L2224/32245 , H01L2224/48227 , H01L2224/73265 , H01L2924/00011 , H01L2924/01047 , H01L2924/14 , H01L2924/00012 , H01L2924/00 , H01L2924/01005 , H01L2924/01031 , H01L2924/01004 , H01L2924/01033
Abstract: A cooling unit main body 25 having vapor diffusion flow paths 42 which extend to the peripheral portion and capillary flow paths 41 formed between the vapor diffusion flow paths 42 and in a concave portion opposite region 47 is provided with a thin concave portion 6 in which an LED chip 2 is mounted. Accordingly, heat from the LED chip 2 can be easily transferred by what corresponds to the thinning of the concave portion 6, and successive circulating phenomenon caused by a refrigerant W is repeated by the heat, and the heat is surely drawn from the LED chip 2 by latent heat at a time when the refrigerant W vaporizes, so that a heat pipe 5 can maintain the light emitting state of the LED chip 2 stably.
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