公开(公告)号：EP2058850B1

公开(公告)日：2010-05-19

申请号：EP09151138.6

申请日：2002-03-21

Applicant: Fujitsu Microelectronics Limited

Inventor： Teshirogi, Kazuo ,  Shimobeppu, Yuzo ,  Yoshimoto, Kazuhiro ,  Watanabe, Mitsuhisa ,  Shinjo, Yoshiaki ,  Yoshida, Eiji ,  Hayasaka, Noboru

IPC: H01L21/68

CPC classification number: H01L21/67092 ,  B24B37/042 ,  B32B37/003 ,  B32B37/1018 ,  B32B38/0012 ,  B32B2310/0831 ,  B32B2457/14 ,  H01L21/304 ,  H01L21/67132 ,  H01L21/6836 ,  H01L21/6838 ,  H01L21/78 ,  H01L24/27 ,  H01L24/29 ,  H01L24/83 ,  H01L2221/68318 ,  H01L2221/68327 ,  H01L2221/6834 ,  H01L2224/83191 ,  H01L2224/8385 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/07802 ,  Y10T29/5313 ,  Y10T29/53191 ,  Y10T428/1452 ,  H01L2924/3512 ,  H01L2924/00

公开(公告)号：EP2058850A3

公开(公告)日：2009-06-03

申请号：EP09151138.6

申请日：2002-03-21

Applicant: Fujitsu Microelectronics Limited

Inventor： Teshirogi, Kazuo ,  Shimobeppu, Yuzo ,  Yoshimoto, Kazuhiro ,  Watanabe, Mitsuhisa ,  Shinjo, Yoshiaki ,  Yoshida, Eiji ,  Hayasaka, Noboru

IPC: H01L21/68

CPC classification number: H01L21/67092 ,  B24B37/042 ,  B32B37/003 ,  B32B37/1018 ,  B32B38/0012 ,  B32B2310/0831 ,  B32B2457/14 ,  H01L21/304 ,  H01L21/67132 ,  H01L21/6836 ,  H01L21/6838 ,  H01L21/78 ,  H01L24/27 ,  H01L24/29 ,  H01L24/83 ,  H01L2221/68318 ,  H01L2221/68327 ,  H01L2221/6834 ,  H01L2224/83191 ,  H01L2224/8385 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/07802 ,  Y10T29/5313 ,  Y10T29/53191 ,  Y10T428/1452 ,  H01L2924/3512 ,  H01L2924/00

Abstract: A semiconductor substrate jig used for arranging a film on a semiconductor substrate, wherein said semiconductor substrate jig comprises a frame with a bottom, a set of plural annular members arranged concentrically within said frame and constructed so as to be individually movable in a direction perpendicular to said semiconductor substrate, wherein heights of said annular members in said direction perpendicular to said semiconductor substrate gradually increase from an outer circumference toward an inner circumference, a biasing member for biasing each of said annular members toward said bottom of said frame, and an operating member contacting said annular members by operating movement in said frame and provided for biasing in a direction separating said annular members from said bottom of said frame, against bias force of said biasing member. Each of said annular members is movable so as to gradually press and move said film arranged between said semiconductor substrate and said set of annular members toward said semiconductor substrate from center outward with said operating movement of said operating member.

公开(公告)号：EP2058853A1

公开(公告)日：2009-05-13

申请号：EP09151140.2

申请日：2002-03-21

Applicant: Fujitsu Microelectronics Limited

Inventor： Teshirogi, Kazuo ,  Shimobeppu, Yuzo ,  Yoshimoto, Kazuhiro ,  Watanabe, Mitsuhisa ,  Shinjo, Yoshiaki ,  Yoshida, Eiji ,  Hayasaka, Noboru

IPC: H01L21/683 ,  H01L21/687 ,  H01L21/68

CPC classification number: H01L21/67092 ,  B24B37/042 ,  B32B37/003 ,  B32B37/1018 ,  B32B38/0012 ,  B32B2310/0831 ,  B32B2457/14 ,  H01L21/304 ,  H01L21/67132 ,  H01L21/6836 ,  H01L21/6838 ,  H01L21/78 ,  H01L24/27 ,  H01L24/29 ,  H01L24/83 ,  H01L2221/68318 ,  H01L2221/68327 ,  H01L2221/6834 ,  H01L2224/83191 ,  H01L2224/8385 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/07802 ,  Y10T29/5313 ,  Y10T29/53191 ,  Y10T428/1452 ,  H01L2924/3512 ,  H01L2924/00

Abstract: A semiconductor substrate jig comprises: a first jig having a first suction mechanism sucking said semiconductor substrate and a second jig having a second suction mechanism sucking said semiconductor substrate, said first and second jigs being removably constructed and independently sucking said semiconductor substrate.

Abstract translation: 半导体衬底夹具包括：第一夹具，其具有吸入所述半导体衬底的第一抽吸机构和具有吸入所述半导体衬底的第二抽吸机构的第二夹具，所述第一和第二夹具可移除地构造并独立地吸取所述半导体衬底。

公开(公告)号：EP1077381B1

公开(公告)日：2009-06-03

申请号：EP00114105.0

申请日：2000-07-10

Applicant: Fujitsu Microelectronics Limited

Inventor： Maruyama, Shigeyuki ,  Koizumi, Daisuke ,  Watanabe, Naoyuki ,  Konno, Yoshito ,  Yoshida, Eiji ,  Honda, Toshiyuki ,  Kawahara, Toshimi ,  Nagashige, Kenichi

IPC: G01R1/073 ,  G01R31/316

CPC classification number: G01R31/2886 ,  H01L2224/05001 ,  H01L2224/05008 ,  H01L2224/05022 ,  H01L2224/05024 ,  H01L2224/05568 ,  H01L2224/05569 ,  H01L2224/05573 ,  H01L2224/11 ,  H05K3/326

公开(公告)号：EP2058850A2

公开(公告)日：2009-05-13

申请号：EP09151138.6

申请日：2002-03-21

Applicant: Fujitsu Microelectronics Limited

Inventor： Teshirogi, Kazuo ,  Shimobeppu, Yuzo ,  Yoshimoto, Kazuhiro ,  Watanabe, Mitsuhisa ,  Shinjo, Yoshiaki ,  Yoshida, Eiji ,  Hayasaka, Noboru

IPC: H01L21/67

CPC classification number: H01L21/67092 ,  B24B37/042 ,  B32B37/003 ,  B32B37/1018 ,  B32B38/0012 ,  B32B2310/0831 ,  B32B2457/14 ,  H01L21/304 ,  H01L21/67132 ,  H01L21/6836 ,  H01L21/6838 ,  H01L21/78 ,  H01L24/27 ,  H01L24/29 ,  H01L24/83 ,  H01L2221/68318 ,  H01L2221/68327 ,  H01L2221/6834 ,  H01L2224/83191 ,  H01L2224/8385 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/07802 ,  Y10T29/5313 ,  Y10T29/53191 ,  Y10T428/1452 ,  H01L2924/3512 ,  H01L2924/00

Abstract: A semiconductor substrate jig used for arranging a film on a semiconductor substrate, wherein said semiconductor substrate jig comprises a frame with a bottom, a set of plural annular members arranged concentrically within said frame and constructed so as to be individually movable in a direction perpendicular to said semiconductor substrate, wherein heights of said annular members in said direction perpendicular to said semiconductor substrate gradually increase from an outer circumference toward an inner circumference, a biasing member for biasing each of said annular members toward said bottom of said frame, and an operating member contacting said annular members by operating movement in said frame and provided for biasing in a direction separating said annular members from said bottom of said frame, against bias force of said biasing member. Each of said annular members is movable so as to gradually press and move said film arranged between said semiconductor substrate and said set of annular members toward said semiconductor substrate from center outward with said operating movement of said operating member.

Abstract translation: 1。一种半导体衬底夹具，用于在半导体衬底上布置膜，其中所述半导体衬底夹具包括具有底部的框架，一组多个环形构件，所述多个环形构件同心地布置在所述框架内并且被构造成可沿垂直于 所述半导体基板的所述环状部件的与所述半导体基板垂直的方向的高度从外周向内周逐渐增大，使所述环状部件向所述框体的底部侧施力的施力部件，以及操作部件 通过在所述框架中的操作运动来接触所述环形部件，并且所述环形部件克服所述偏置部件的偏置力而用于在使所述环形部件与所述框架的所述底部分离的方向上偏置。 所述环形部件中的每一个都是可移动的，以便随着所述操作部件的所述操作移动，从中心向外逐渐地将设置在所述半导体基板和所述一组环形部件之间的所述薄膜压向所述半导体基板。

公开(公告)号：EP2053633A1

公开(公告)日：2009-04-29

申请号：EP09151139.4

申请日：2002-03-21

Applicant: Fujitsu Microelectronics Limited

Inventor： Teshirogi, Kazuo ,  Shimobeppu, Yuzo ,  Yoshimoto, Kazuhiro ,  Watanabe, Mitsuhisa ,  Shinjo, Yoshiaki ,  Yoshida, Eiji ,  Hayasaka, Noboru

IPC: H01L21/00 ,  H01L21/683 ,  H01L21/687 ,  H01L21/68 ,  H01L21/78 ,  B24B7/22 ,  B24B41/00

CPC classification number: H01L21/67092 ,  B24B37/042 ,  B32B37/003 ,  B32B37/1018 ,  B32B38/0012 ,  B32B2310/0831 ,  B32B2457/14 ,  H01L21/304 ,  H01L21/67132 ,  H01L21/6836 ,  H01L21/6838 ,  H01L21/78 ,  H01L24/27 ,  H01L24/29 ,  H01L24/83 ,  H01L2221/68318 ,  H01L2221/68327 ,  H01L2221/6834 ,  H01L2224/83191 ,  H01L2224/8385 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/07802 ,  Y10T29/5313 ,  Y10T29/53191 ,  Y10T428/1452 ,  H01L2924/3512 ,  H01L2924/00

Abstract: A semiconductor substrate jig used in arranging a film to a semiconductor substrate comprises a frame, a porous member arranged within said frame so as to be opposite said film, and a vacuum hole formed in said frame and provided for applying negative pressure to said porous member.

Abstract translation: 一种半导体衬底夹具，用于在半导体衬底上设置一个薄膜，该夹具包括一个框架，一个布置在所述框架内并与所述薄膜相对的多孔部件，以及一个形成在所述框架内用于向所述多孔部件施加负压的真空孔 。