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公开(公告)号：CA3006104C
公开(公告)日：2020-09-22
申请号：CA3006104
申请日：2018-05-24
Applicant: GEN ELECTRIC
Inventor： LEE YONGJAE , IANNOTTI JOSEPH
Abstract: A sensor system includes one or more rotor antennas on a shaft that moves within a stator bracket one or more of around an axis of the sensor system or along the axis of the sensor system, the one or more rotor antennas configured to communicate sensed data with one or more stator antennas on the stator bracket. Each rotor antenna has a rotor signal trace disposed on an outer rotor side of a dielectric substrate of the rotor antenna and a rotor return trace disposed on the outer rotor side of the dielectric substrate, wherein the rotor signal trace and the rotor return trace are not concentric with respect to each other. The one or more rotor antennas are configured to extend one or more of radially around an outer surface of the shaft of a sensor or along the outer surface of the shaft of the sensor.
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公开(公告)号：CA3006104A1
公开(公告)日：2018-12-07
申请号：CA3006104
申请日：2018-05-24
Applicant: GEN ELECTRIC
Inventor： LEE YONGJAE , IANNOTTI JOSEPH
Abstract: A sensor system includes one or more rotor antennas on a shaft that moves within a stator bracket one or more of around an axis of the sensor system or along the axis of the sensor system, the one or more rotor antennas configured to communicate sensed data with one or more stator antennas on the stator bracket. Each rotor antenna has a rotor signal trace disposed on an outer rotor side of a dielectric substrate of the rotor antenna and a rotor return trace disposed on the outer rotor side of the dielectric substrate, wherein the rotor signal trace and the rotor return trace are not concentric with respect to each other. The one or more rotor antennas are configured to extend one or more of radially around an outer surface of the shaft of a sensor or along the outer surface of the shaft of the sensor.
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公开(公告)号：DE60305077T2
公开(公告)日：2006-12-07
申请号：DE60305077
申请日：2003-11-25
Applicant: GEN ELECTRIC
Inventor： KORNRUMPF P , CLAYDON GLENN , DASGUPTA SAMHITA , FILKINS ROBERT , FORMAN GLENN , IANNOTTI JOSEPH , NIELSEN CHRISTIAN
Abstract: The invention comprises a novel combination of microwave and photonic packaging to arrive at compact, self contained MZI modulator. The nature of the NLO polymer, that is, its large electro-optic coefficient reduces the drive requirements for the integrated power amplifier, allowing a small to medium power amplifier to be used. Microwave high density interconnect (HDI) packaging techniques allow the medium power amplifier to be fabricated into a small assembly, which can be mounted directly to the MZI substrate. The integrated amplifier and modulator provides a significant reduced size and lower power, and high bandwidth advantage when compared with existing devices based on inorganic materials.
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公开(公告)号：CA3006096A1
公开(公告)日：2018-12-07
申请号：CA3006096
申请日：2018-05-24
Applicant: GEN ELECTRIC
Inventor： IANNOTTI JOSEPH , KAPUSTA CHRISTOPHER JAMES , ESLER DAVID RICHARD
Abstract: A system includes a structure configured to have a structure bonding layer disposed on a surface of the structure. The structure bonding layer is a metallic alloy. The system includes a sensor configured to have a sensor bonding layer disposed on a surface of the sensor. The sensor bonding layer is a metallic alloy. The sensor bonding layer is configured to be coupled to the structure bonding layer via a metallic joint in order for the sensor to sense data of the structure through the metallic joint, the structure bonding layer, and the sensor bonding layer.
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Patent Agency Ranking
公开(公告)号：CA2510571A1
公开(公告)日：2004-07-22
申请号：CA2510571
申请日：2003-11-25
Applicant: GEN ELECTRIC
Inventor： NIELSEN MATTHEW CHRISTIAN , IANNOTTI JOSEPH , FORMAN GLENN , FILKINS ROBERT , KORNRUMPF WILLIAM P , CLAYDON GLENN , DASGUPTA SAMHITA
Abstract: The invention comprises a novel combination of microwave and photonic packaging to arrive a compact, self contained MZI modulator. The nature of t he NLO polymer, that is, its large electro-optic coefficient reduces the drive requirements for the integrated power amplifier (202), allowing a small to medium power amplifier to be used. Microwave high density interconnect (HDI) pakcaging techniques allow the medium power amplifier to be fabricated into a small assembly, which can be mounted directly to the MZI substrate. The integrated amplifier and modulator provides a significant reduced size and lower power, and high bandwidth advantage when compared with existing device s based on inorganic materials.
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公开(公告)号：CA2510571C
公开(公告)日：2012-06-12
申请号：CA2510571
申请日：2003-11-25
Applicant: GEN ELECTRIC
Inventor： KORNRUMPF WILLIAM P , CLAYDON GLENN , DASGUPTA SAMHITA , FILKINS ROBERT , FORMAN GLENN , IANNOTTI JOSEPH , NIELSEN MATTHEW CHRISTIAN
Abstract: The invention comprises a novel combination of microwave and photonic packaging to arrive a compact, self contained MZI modulator. The nature of the NLO polymer, that is, its large electro-optic coefficient reduces the drive requirements for the integrated power amplifier (202), allowing a small to medium power amplifier to be used. Microwave high density interconnect (HDI) pakcaging techniques allow the medium power amplifier to be fabricated into a small assembly, which can be mounted directly to the MZI substrate. The integrated amplifier and modulator provides a significant reduced size and lower power, and high bandwidth advantage when compared with existing devices based on inorganic materials.
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公开(公告)号：DE60305077D1
公开(公告)日：2006-06-08
申请号：DE60305077
申请日：2003-11-25
Applicant: GEN ELECTRIC
Inventor： KORNRUMPF P , CLAYDON GLENN , DASGUPTA SAMHITA , FILKINS ROBERT , FORMAN GLENN , IANNOTTI JOSEPH , NIELSEN CHRISTIAN
Abstract: The invention comprises a novel combination of microwave and photonic packaging to arrive at compact, self contained MZI modulator. The nature of the NLO polymer, that is, its large electro-optic coefficient reduces the drive requirements for the integrated power amplifier, allowing a small to medium power amplifier to be used. Microwave high density interconnect (HDI) packaging techniques allow the medium power amplifier to be fabricated into a small assembly, which can be mounted directly to the MZI substrate. The integrated amplifier and modulator provides a significant reduced size and lower power, and high bandwidth advantage when compared with existing devices based on inorganic materials.
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公开(公告)号：AT325366T
公开(公告)日：2006-06-15
申请号：AT03796456
申请日：2003-11-25
Applicant: GEN ELECTRIC
Inventor： KORNRUMPF WILLIAM P , CLAYDON GLENN , DASGUPTA SAMHITA , FILKINS ROBERT , FORMAN GLENN , IANNOTTI JOSEPH , NIELSEN MATTHEW CHRISTIAN
Abstract: The invention comprises a novel combination of microwave and photonic packaging to arrive at compact, self contained MZI modulator. The nature of the NLO polymer, that is, its large electro-optic coefficient reduces the drive requirements for the integrated power amplifier, allowing a small to medium power amplifier to be used. Microwave high density interconnect (HDI) packaging techniques allow the medium power amplifier to be fabricated into a small assembly, which can be mounted directly to the MZI substrate. The integrated amplifier and modulator provides a significant reduced size and lower power, and high bandwidth advantage when compared with existing devices based on inorganic materials.
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公开(公告)号：AU2003298701A1
公开(公告)日：2004-07-29
申请号：AU2003298701
申请日：2003-11-25
Applicant: GEN ELECTRIC
Inventor： FILKINS ROBERT , FORMAN GLENN , IANNOTTI JOSEPH , NIELSEN MATTHEW CHRISTIAN , KORNRUMPF WILLIAM P , CLAYDON GLENN , DASGUPTA SAMHITA
Abstract: The invention comprises a novel combination of microwave and photonic packaging to arrive at compact, self contained MZI modulator. The nature of the NLO polymer, that is, its large electro-optic coefficient reduces the drive requirements for the integrated power amplifier, allowing a small to medium power amplifier to be used. Microwave high density interconnect (HDI) packaging techniques allow the medium power amplifier to be fabricated into a small assembly, which can be mounted directly to the MZI substrate. The integrated amplifier and modulator provides a significant reduced size and lower power, and high bandwidth advantage when compared with existing devices based on inorganic materials.
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