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公开(公告)号：WO2008076985B1
公开(公告)日：2008-08-28
申请号：PCT/US2007087801
申请日：2007-12-17
Applicant: WOJNAROWSKI ROBERT JOHN , GEN ELECTRIC , BERKAN ERTUGRUL , ANDARAWIS EMAD ANADARAWIS , SEALING CHARLES SCOTT , SEELY CHARLES SCOTT , DELGADO ELADIO CLEMENTE , HAYS DAVID CECIL , KAPUSTA CHRISTOPHER JAMES , GRUBER NANETTE JUDITH
Inventor： BERKAN ERTUGRUL , ANDARAWIS EMAD ANADARAWIS , SEALING CHARLES SCOTT , SEELY CHARLES SCOTT , DELGADO ELADIO CLEMENTE , HAYS DAVID CECIL , KAPUSTA CHRISTOPHER JAMES , GRUBER NANETTE JUDITH
IPC: H01L27/20 , G01N29/14 , G01N29/22 , H01L41/04 , H01L41/113
CPC classification number: H01L27/20 , G01M5/00 , G01N29/245 , G01N29/2475 , G01N2291/0231 , H01L41/047 , H01L41/1132
Abstract: A piezoelectric planar composite apparatus (30, 30') to provide health monitoring of a structure and associated methods are provided. The piezoelectric planar composite apparatus (30, 30') includes a piezoelectric electric material layer (41, 41'), multiple electrodes (35, 35') positioned in electrical contact with the piezoelectric material layer (41, 41'), and multiple sets of electrode interconnect conductors (53) each positioned in electrical contact with a different subset of the of the electrodes (35, 35') and positioned to form multiple complementary electrode patterns. Each of the complementary electrode patterns is positioned to form an electric field having an electric field axis oriented along a different physical axis from that of an electric field formed by at least one other of the complementary electrode patterns. The interconnect conductors (53) can be distributed over several electrode interconnect conductor carrying layers (51) to enhance formation of the different complementary electrode patterns.
Abstract translation: 提供了一种用于提供对结构和相关方法的健康监测的压电平面复合设备（30,30'）。 压电平面复合设备（30,30'）包括压电电材料层（41,41'），定位成与压电材料层（41,41'）电接触的多个电极（35,35'），以及多个 电极互连导体组（53），每个电极互连导体定位成与电极（35,35'）的不同子集电接触并定位以形成多个互补电极图案。 互补电极图案中的每一个被定位为形成电场，该电场具有沿着与由互补电极图案中的至少一个另外的互补电极图案形成的电场不同的物理轴定向的电场轴。 互连导体（53）可以分布在几个电极互连导体承载层（51）上以增强不同互补电极图案的形成。
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公开(公告)号：WO2013148515A3
公开(公告)日：2013-12-27
申请号：PCT/US2013033527
申请日：2013-03-22
Applicant: GEN ELECTRIC
Inventor： BAUMGARTNER CHARLES EDWARD , DUROCHER KEVIN MATTHEW , WODNICKI ROBERT GIDEON , MILLS DAVID MARTIN , HUBER WILLIAM HULLINGER , KAPUSTA CHRISTOPHER JAMES , SOGOIAN GEORGE CHARLES
IPC: B06B1/06
CPC classification number: B06B1/0622 , H01L41/338 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2924/1433 , H01L2924/15321 , Y10T29/42 , H01L2924/00
Abstract: An ultrasound acoustic assembly (100) includes a number of ultrasound acoustic arrays, each array comprising an acoustic stack comprising a piezoelectric layer (42) assembled with at least one acoustic impedance dematching layer (41) and with a support layer (2). The acoustic stack defines a number of dicing kerfs and a number of acoustic elements, such that the dicing kerfs are formed between neighboring ones of the acoustic elements. The dicing kerfs extend through the piezoelectric layer and through the acoustic impedance dematching layer(s) but extend only partially through the support layer. The ultrasound acoustic assembly further includes a number of application specific integrated circuit (ASIC) die (32). Each ultrasound acoustic array is coupled to a respective ASIC die to form a respective acoustic-electric transducer module. Methods of manufacture are also provided.
Abstract translation: 超声波声学组件（100）包括多个超声波阵列，每个阵列包括声堆叠，声堆叠包括与至少一个声阻抗分配层（41）和支撑层（2）组装的压电层（42）。 声学堆叠限定了多个切割切口和多个声学元件，使得切割切口形成在相邻的声学元件之间。 切割切口延伸穿过压电层并通过声阻抗分层，但仅部分延伸穿过支撑层。 超声波声学组件还包括许多专用集成电路（ASIC）管芯（32）。 每个超声波阵列耦合到相应的ASIC管芯，以形成相应的声电传感器模块。 还提供了制造方法。
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公开(公告)号：WO2006026421A3
公开(公告)日：2007-02-01
申请号：PCT/US2005030390
申请日：2005-08-25
Applicant: GEN ELECTRIC , CELLA JAMES ANTHONY , COLOMBO DANIEL GERARD , KAPUSTA CHRISTOPHER JAMES
CPC classification number: C08J5/18 , C08G64/045 , C08J2369/00 , C08K5/0025 , G02F1/3615
Abstract: Crosslinkable polymeric materials are disclosed useful for the temporal stabilization of a poling- induced noncentrosymmetric host lattice containing guest nonlinear optical chromophores . The materials are also suitable as, crosslinkable coatings in the absence of chromophores. Also disclosed is a method of srosslinking such polymeric material comprising reacting i)a crosslinkable polymeric material comprising olefin groups and ii) a crosslinking agent comprising electron deficient olefin groups, at a temperature at which crosslinking occurs.
Abstract translation: 公开了可交联聚合材料，其用于包含客体非线性光学发色团的极化诱导的非中心对称主体晶格的时间稳定性。 在不存在发色团的情况下，这些材料也适合作为可交联涂层。 还公开了一种交联这种聚合材料的方法，包括使i）包含烯烃基团的可交联聚合物材料和ii）在发生交联的温度下包含电子缺陷烯烃基团的交联剂。
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公开(公告)号：WO2004038468A3
公开(公告)日：2004-06-17
申请号：PCT/US0333279
申请日：2003-10-20
Applicant: GEN ELECTRIC
Inventor： SAIA RICHARD JOSEPH , GORCZYCA THOMAS BERT , KAPUSTA CHRISTOPHER JAMES , BALCH ERNEST WAYNE , CLAYDON GLENN SCOTT , DASGUPTA SAHMITA , DELGADO ELADIO CLEMENTE
CPC classification number: G02B6/122 , G02B6/12002 , G02B6/12004 , G02B6/1221 , G02B6/138 , G02B6/42 , H01L2224/04105 , H01L2224/32225 , H01L2224/32245 , H01L2224/73267 , H01L2924/15153 , H01L2924/15192
Abstract: An optoelectronic package is fabricated by a method which includes: positioning an optical device within a window of a substrate activeside up and below a top substrate surface; filling the window with an optical polymer material; planarizing surfaces of the optical polymer material and the substrate; patterning waveguide material over the optical polymer material and the substrate to form an optical interconnection path and to form a mirror to reflect light from the optical device to the interconnection path; and forming a via to expose a bond pad of the optical device.
Abstract translation: 一种光电子封装通过包括以下步骤的方法制造：将光学器件定位在衬底有源面的窗口内上和下顶部衬底表面; 用光学聚合物材料填充窗口; 平坦化光学聚合物材料和基底的表面; 在所述光学聚合物材料和所述衬底上形成波导材料以形成光学互连路径并且形成反射镜以将来自所述光学器件的光反射到所述互连路径; 以及形成通孔以暴露光学器件的接合焊盘。
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公开(公告)号：EP3213101A4
公开(公告)日：2018-07-04
申请号：EP15854828
申请日：2015-10-27
Applicant: GEN ELECTRIC
Inventor： KAPUSTA CHRISTOPHER JAMES , AIMI MARCO FRANCESCO
CPC classification number: H01L23/10 , B81B7/0077 , H01L2224/48091 , H01L2224/49171 , H01L2924/0002 , H01L2924/00014 , H01L2924/00
Abstract: A non-magnetic hermetic package includes walls that surround an open cavity, with a generally planar non-magnetic and metallic seal ring disposed in a continuous loop around upper edges of the walls; a sensitive component that is bonded within the cavity; and a non-magnetic lid that is sealed to the seal ring to close the cavity by a metallic seal.
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Patent Agency Ranking
公开(公告)号：AT374952T
公开(公告)日：2007-10-15
申请号：AT05253492
申请日：2005-06-07
Applicant: GEN ELECTRIC
Inventor： BERKCAN ERTUGRUL , KAPUSTA CHRISTOPHER JAMES , CLAYDON GLENN SCOTT , ZRIBI ANIS , MEYER LAURA JEAN , TIAN WEI-CHENG
IPC: G01R33/028 , G01R15/20
Abstract: A micro-electromechanical system, MEMS, current sensor is described as including a first conductor, a magnetic field shaping component (5) for shaping a magnetic field (20) produced by a current (I) in the first conductor, and a MEMS-based magnetic field sensing component (25) including a magneto-MEMS component (30) for sensing the shaped magnetic field and, in response thereto, providing an indication (80) of the current in the first conductor. A method for sensing a current using MEMS is also described as including shaping a magnetic field produced with a current in a first conductor, sensing the shaped magnetic field with a MEMS-based magnetic field sensing component having a magneto-MEMS component magnetic field sensing circuit, and providing an indication of the current in the first conductor.
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公开(公告)号：CA3006096A1
公开(公告)日：2018-12-07
申请号：CA3006096
申请日：2018-05-24
Applicant: GEN ELECTRIC
Inventor： IANNOTTI JOSEPH , KAPUSTA CHRISTOPHER JAMES , ESLER DAVID RICHARD
Abstract: A system includes a structure configured to have a structure bonding layer disposed on a surface of the structure. The structure bonding layer is a metallic alloy. The system includes a sensor configured to have a sensor bonding layer disposed on a surface of the sensor. The sensor bonding layer is a metallic alloy. The sensor bonding layer is configured to be coupled to the structure bonding layer via a metallic joint in order for the sensor to sense data of the structure through the metallic joint, the structure bonding layer, and the sensor bonding layer.
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公开(公告)号：CA2570847A1
公开(公告)日：2007-06-09
申请号：CA2570847
申请日：2006-12-08
Applicant: GEN ELECTRIC
Inventor： BALCH ERNEST WAYNE , DUROCHER KEVIN MATTHEW , GOODWIN STACEY JOY , KAPUSTA CHRISTOPHER JAMES
IPC: C25D5/00 , C23C14/34 , H01L23/473 , H05K7/20
Abstract: METHOD OF MAKING AN ELECTRONIC DEVICE COOLING SYSTEM A method is provided. The method includes forming a conductive layer on an inner surface of a substrate (12) and providing a sacrificial layer (36) over the conductive layer. The method includes forming a plurality of channels in the sacrificia l layer (36) and plating the sacrificial layer to substantially fill the plurality of channels with a plating material comprising conducting material. The method also includes etching the sacrificial layer (36) to form a conducting structure having fins where conducting material remains separated by microchannels where the sacrificial layer (36) is etched.
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公开(公告)号：CA2966183A1
公开(公告)日：2016-05-06
申请号：CA2966183
申请日：2015-10-27
Applicant: GEN ELECTRIC
Inventor： KAPUSTA CHRISTOPHER JAMES , AIMI MARCO FRANCESCO
Abstract: A non-magnetic hermetic package includes walls that surround an open cavity, with a generally planar non-magnetic and metallic seal ring disposed in a continuous loop around upper edges of the walls; a sensitive component that is bonded within the cavity; and a non-magnetic lid that is sealed to the seal ring to close the cavity by a metallic seal.
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公开(公告)号：CA2640827A1
公开(公告)日：2009-04-15
申请号：CA2640827
申请日：2008-10-09
Applicant: GEN ELECTRIC
Inventor： AIMI MARCO FRANCESCO , GOWDA ARUN VIRUPAKSHA , KAPUSTA CHRISTOPHER JAMES , CLAYDON GLENN SCOTT , HAYS DAVID CECIL , BOOMHOWER OLIVER CHARLES , KEIMEL CHRISTOPHER FRED , IANNOTTI JOSEPH ALFRED
Abstract: Multiple microelectromechanical systems (MEMS) on a substrate (20) are capped with a cover (28) using a layer that may function as a bonding agent, separation layer, and hermetic seal. A substrate (20) has a first side (20A) with multiple MEMS devices. A cover (28) is formed with through-holes (40) for vi as (40), and with standoff posts (34) for layer registration and separation. An adhesive sheet (42) is patterned with cutouts (44) for the MEMS devices, vias (40), a nd standoff posts (34). The adhesive sheet (42) is tacked to the cover (28), th en placed on the mems substrate (20) and heated to bond the layers. The via holes (40) may be metalized with leads for circuit board (58) connection. The mems units (22) may be diced from the substrate (20) after sealing, thus protecting them from contaminants.
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