公开(公告)号：DE68908488T2

公开(公告)日：1994-04-14

申请号：DE68908488

申请日：1989-05-23

Applicant: GEN ELECTRIC

Inventor： FOUST DONALD FRANKLIN ,  LAMBY EDWARD JOHN ,  KARAS BRADLEY ROSS ,  DUMAS WILLIAM VINCENT ,  JERABEK ELIHU CALVIN

IPC: C23C18/24 ,  C23C18/22 ,  H05K3/18 ,  H05K3/38

Abstract: An improved method for pretreating a polyimide surface in preparation for an adhesion promotion treatment and subsequent metallization is disclosed, wherein the pretreatment comprises mild etching of the surface, contact of the surface with a basic solution, and contact of the surface with a cationic surfactant which is capable of removing a residual film formed on the surface after the mild etching step. This invention further includes articles such as printed circuit boards, which comprise a polyimide substrate pretreated as described above and then treated with an adhesion promoter, wherein an electrolessly-applied metal layer is disposed on the substrate, and an electrolytically-applied metal layer free of chemical additives is disposed on the electrolessly-applied layer. The article may include an additional electrolytically-applied layer containing chemical additives and disposed on top of the first electrolytic layer.

公开(公告)号：DE68908488D1

公开(公告)日：1993-09-23

申请号：DE68908488

申请日：1989-05-23

Applicant: GEN ELECTRIC

Inventor： FOUST DONALD FRANKLIN ,  LAMBY EDWARD JOHN ,  KARAS BRADLEY ROSS ,  DUMAS WILLIAM VINCENT ,  JERABEK ELIHU CALVIN

IPC: C23C18/24 ,  C23C18/22 ,  H05K3/18 ,  H05K3/38

Abstract: An improved method for pretreating a polyimide surface in preparation for an adhesion promotion treatment and subsequent metallization is disclosed, wherein the pretreatment comprises mild etching of the surface, contact of the surface with a basic solution, and contact of the surface with a cationic surfactant which is capable of removing a residual film formed on the surface after the mild etching step. This invention further includes articles such as printed circuit boards, which comprise a polyimide substrate pretreated as described above and then treated with an adhesion promoter, wherein an electrolessly-applied metal layer is disposed on the substrate, and an electrolytically-applied metal layer free of chemical additives is disposed on the electrolessly-applied layer. The article may include an additional electrolytically-applied layer containing chemical additives and disposed on top of the first electrolytic layer.

公开(公告)号：AU2182883A

公开(公告)日：1984-06-07

申请号：AU2182883

申请日：1983-11-30

Applicant: GEN ELECTRIC

Inventor： SPIRO CLIFFORD LAWRENCE ,  LAMBY EDWARD JOHN

IPC: C02F9/00 ,  C07C29/38 ,  C08G8/04 ,  C09K8/584 ,  C07C37/20 ,  C07C39/15 ,  E21B43/22

Abstract: The effluent stream from a process for producing phenolic compounds is reacted with an aldehyde in the presence of a base to form a water soluble resol which is useful in enhanced oil recovery.

公开(公告)号：DE3885054T2

公开(公告)日：1994-05-11

申请号：DE3885054

申请日：1988-08-24

Applicant: GEN ELECTRIC CO N D GES D STAA

Inventor： FOUST DONALD FRANKLIN ,  DUMAS WILLIAM VINCENT ,  LAMBY EDWARD JOHN ,  KARAS BRADLEY ROSS

IPC: C23C18/40 ,  C08J7/12 ,  C09J5/02 ,  C23C18/20 ,  C23C18/26 ,  H05K3/38 ,  C23C18/18

Abstract: A method for treating a polyimide surface is disclosed, in which an adhesion-promoting compound such as thiourea contacts the surface prior to the electroless plating of metal thereon. Articles formed by such a method are also disclosed.

公开(公告)号：DE3885054D1

公开(公告)日：1993-11-25

申请号：DE3885054

申请日：1988-08-24

Applicant: GEN ELECTRIC

Inventor： FOUST DONALD FRANKLIN ,  DUMAS WILLIAM VINCENT ,  LAMBY EDWARD JOHN ,  KARAS BRADLEY ROSS

IPC: C23C18/40 ,  C08J7/12 ,  C09J5/02 ,  C23C18/20 ,  C23C18/26 ,  H05K3/38 ,  C23C18/18

Abstract: A method for treating a polyimide surface is disclosed, in which an adhesion-promoting compound such as thiourea contacts the surface prior to the electroless plating of metal thereon. Articles formed by such a method are also disclosed.