Abstract:
A process for forming multi-layer optical quality films by sputtering at least a first and second material with at least two unbalanced DC magnetron sputtering devices. During sputtering, an effective negative radio frequency or alternating current bias is applied to the substrate and an arc suppression device is operated to reduce arcing on the sputtering devices. In addition, a controlled partial pressure of a reactive gas is maintained in the sputtering chamber to provide a sufficient amount of reactive gas to form the desired compound on the substrate without substantially poisoning the target.